DE69223027T2 - Verfahren und Klebstoff zur Herstellung von elektrischen und mechanischen Verbindungen - Google Patents

Verfahren und Klebstoff zur Herstellung von elektrischen und mechanischen Verbindungen

Info

Publication number
DE69223027T2
DE69223027T2 DE69223027T DE69223027T DE69223027T2 DE 69223027 T2 DE69223027 T2 DE 69223027T2 DE 69223027 T DE69223027 T DE 69223027T DE 69223027 T DE69223027 T DE 69223027T DE 69223027 T2 DE69223027 T2 DE 69223027T2
Authority
DE
Germany
Prior art keywords
adhesive
making electrical
mechanical connections
connections
mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69223027T
Other languages
English (en)
Other versions
DE69223027D1 (de
Inventor
Issa S Mahmoud
Julian Peter Partridge
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE69223027D1 publication Critical patent/DE69223027D1/de
Application granted granted Critical
Publication of DE69223027T2 publication Critical patent/DE69223027T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
DE69223027T 1991-12-06 1992-12-02 Verfahren und Klebstoff zur Herstellung von elektrischen und mechanischen Verbindungen Expired - Fee Related DE69223027T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/804,279 US5286417A (en) 1991-12-06 1991-12-06 Method and composition for making mechanical and electrical contact

Publications (2)

Publication Number Publication Date
DE69223027D1 DE69223027D1 (de) 1997-12-11
DE69223027T2 true DE69223027T2 (de) 1998-05-20

Family

ID=25188598

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69223027T Expired - Fee Related DE69223027T2 (de) 1991-12-06 1992-12-02 Verfahren und Klebstoff zur Herstellung von elektrischen und mechanischen Verbindungen

Country Status (4)

Country Link
US (1) US5286417A (de)
EP (1) EP0549159B1 (de)
JP (1) JPH0751700B2 (de)
DE (1) DE69223027T2 (de)

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US5916641A (en) * 1996-08-01 1999-06-29 Loctite (Ireland) Limited Method of forming a monolayer of particles
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US5818700A (en) * 1996-09-24 1998-10-06 Texas Instruments Incorporated Microelectronic assemblies including Z-axis conductive films
US5805425A (en) * 1996-09-24 1998-09-08 Texas Instruments Incorporated Microelectronic assemblies including Z-axis conductive films
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US6228206B1 (en) * 1997-07-30 2001-05-08 Drug Delivery Technologies, Inc. Bonding agent composition containing conductive filler and method of bonding electrode to printed conductive trace with same
JP3876953B2 (ja) 1998-03-27 2007-02-07 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
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US6239980B1 (en) * 1998-08-31 2001-05-29 General Electric Company Multimodule interconnect structure and process
US6188582B1 (en) * 1998-12-18 2001-02-13 Geoffrey Peter Flexible interconnection between integrated circuit chip and substrate or printed circuit board
US6791839B2 (en) * 2002-06-25 2004-09-14 Dow Corning Corporation Thermal interface materials and methods for their preparation and use
US6733613B2 (en) * 2002-07-25 2004-05-11 S. Kumar Khanna Method for curing an anisotropic conductive compound
US6838022B2 (en) * 2002-07-25 2005-01-04 Nexaura Systems, Llc Anisotropic conductive compound
US6909100B2 (en) 2002-07-25 2005-06-21 Ii-Vi Incorporated Radiation detector assembly
US7510621B2 (en) * 2004-09-22 2009-03-31 General Motors Corporation Conductive adhesive bonding
US7611040B2 (en) * 2005-05-24 2009-11-03 Panasonic Corporation Method for forming solder bump and method for mounting semiconductor device using a solder powder resin composition
US20070131912A1 (en) * 2005-07-08 2007-06-14 Simone Davide L Electrically conductive adhesives
US20070226995A1 (en) * 2006-03-30 2007-10-04 Gregory Alan Bone System and method for adhering large semiconductor applications to pcb
JP5018779B2 (ja) * 2006-08-22 2012-09-05 日立化成工業株式会社 回路接続材料、回路部材の接続構造及び回路部材の接続構造の製造方法
US20100001237A1 (en) * 2007-03-26 2010-01-07 Fornes Timothy D Method for producing heterogeneous composites
CN101803009B (zh) * 2007-09-11 2012-07-04 陶氏康宁公司 组合物，包括这种组合物的热界面材料,及其制备方法和用途
US8334592B2 (en) * 2007-09-11 2012-12-18 Dow Corning Corporation Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and use
KR20120037464A (ko) * 2009-06-12 2012-04-19 로오드 코포레이션 전자파 장애로부터 기판을 차폐하는 방법
DE102009056308A1 (de) * 2009-11-30 2011-06-01 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Metallisch kontaktiertes Substrat sowie Verfahren zu dessen Herstellung
KR20130050906A (ko) * 2010-08-27 2013-05-16 피켐 어소시에이츠, 인코퍼레이티드 저온 소결성 은 나노 입자 조성물 및 상기 조성물을 이용하여 형성된 전자 물품
TWI504693B (zh) * 2010-08-30 2015-10-21 Dowa Electronics Materials Co 低溫燒結性銀奈米粒子組成物及使用該組成物所形成之電子物品
CN103176640B (zh) * 2011-12-24 2016-05-25 宸鸿科技(厦门)有限公司 触控面板及其制造方法
US8878072B2 (en) 2012-06-19 2014-11-04 Lockheed Martin Corporation High reliability fluid-tight low-profile electrically conductive interconnects for large scale frame attachment
US9258907B2 (en) 2012-08-09 2016-02-09 Lockheed Martin Corporation Conformal 3D non-planar multi-layer circuitry
US8772745B1 (en) 2013-03-14 2014-07-08 Lockheed Martin Corporation X-ray obscuration film and related techniques
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US9365749B2 (en) 2013-05-31 2016-06-14 Sunray Scientific, Llc Anisotropic conductive adhesive with reduced migration
US10123410B2 (en) 2014-10-10 2018-11-06 Lockheed Martin Corporation Fine line 3D non-planar conforming circuit
JP6609073B1 (ja) * 2019-01-15 2019-11-20 株式会社日本マイクロニクス プローブ基板及び電気的接続装置

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Also Published As

Publication number Publication date
JPH05279649A (ja) 1993-10-26
DE69223027D1 (de) 1997-12-11
EP0549159A2 (de) 1993-06-30
EP0549159B1 (de) 1997-11-05
JPH0751700B2 (ja) 1995-06-05
EP0549159A3 (de) 1994-02-09
US5286417A (en) 1994-02-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee