DE69202430D1 - Vorrichtung und Verfahren zur Herstellung von elektrischen Simultanverbindungen. - Google Patents

Vorrichtung und Verfahren zur Herstellung von elektrischen Simultanverbindungen.

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Publication number
DE69202430D1
DE69202430D1 DE69202430T DE69202430T DE69202430D1 DE 69202430 D1 DE69202430 D1 DE 69202430D1 DE 69202430 T DE69202430 T DE 69202430T DE 69202430 T DE69202430 T DE 69202430T DE 69202430 D1 DE69202430 D1 DE 69202430D1
Authority
DE
Germany
Prior art keywords
electrical connections
simultaneous electrical
making simultaneous
making
connections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69202430T
Other languages
English (en)
Other versions
DE69202430T2 (de
Inventor
Mario John Interrante
Michael Berger
Edward Frank Handford
Eugene Tas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69202430D1 publication Critical patent/DE69202430D1/de
Publication of DE69202430T2 publication Critical patent/DE69202430T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
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    • H05K2201/10227—Other objects, e.g. metallic pieces
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    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
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    • H05K2203/17—Post-manufacturing processes
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
DE69202430T 1991-10-04 1992-09-11 Vorrichtung und Verfahren zur Herstellung von elektrischen Simultanverbindungen. Expired - Fee Related DE69202430T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/771,706 US5193732A (en) 1991-10-04 1991-10-04 Apparatus and methods for making simultaneous electrical connections

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DE69202430D1 true DE69202430D1 (de) 1995-06-14
DE69202430T2 DE69202430T2 (de) 1996-01-25

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US (1) US5193732A (de)
EP (1) EP0536076B1 (de)
JP (1) JPH0831672B2 (de)
DE (1) DE69202430T2 (de)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100209457B1 (ko) 1992-07-24 1999-07-15 토마스 디스테파노 반도체 접속 부품과 그 제조 방법 및 반도체 칩 접속 방법
US5977618A (en) * 1992-07-24 1999-11-02 Tessera, Inc. Semiconductor connection components and methods with releasable lead support
US6054756A (en) * 1992-07-24 2000-04-25 Tessera, Inc. Connection components with frangible leads and bus
US5335842A (en) * 1993-03-19 1994-08-09 National Semiconductor Corporation Self-aligning single point bonding tool
DE4311762C2 (de) * 1993-04-08 1995-02-02 Josef Dr Kemmer Verfahren zur Verbindung elektrischer Kontaktstellen
JP3453803B2 (ja) * 1993-06-15 2003-10-06 株式会社日立製作所 電子回路基板の配線修正方法およびその装置
US5384953A (en) * 1993-07-21 1995-01-31 International Business Machines Corporation Structure and a method for repairing electrical lines
US5390844A (en) * 1993-07-23 1995-02-21 Tessera, Inc. Semiconductor inner lead bonding tool
US5834339A (en) 1996-03-07 1998-11-10 Tessera, Inc. Methods for providing void-free layers for semiconductor assemblies
US5663106A (en) * 1994-05-19 1997-09-02 Tessera, Inc. Method of encapsulating die and chip carrier
US5776796A (en) * 1994-05-19 1998-07-07 Tessera, Inc. Method of encapsulating a semiconductor package
US5904868A (en) * 1994-06-16 1999-05-18 International Business Machines Corporation Mounting and/or removing of components using optical fiber tools
US5558270A (en) * 1995-01-06 1996-09-24 Kulicke And Soffa Investments, Inc Fine pitch capillary/wedge bonding tool
US20020151111A1 (en) * 1995-05-08 2002-10-17 Tessera, Inc. P-connection components with frangible leads and bus
US5534371A (en) * 1995-05-22 1996-07-09 International Business Machines Corporation Repaired apertured laser metal mask
US5536605A (en) * 1995-05-22 1996-07-16 International Business Machines Corporation Method of repairing apertured laser metal mask
KR100407055B1 (ko) 1995-09-18 2004-03-31 테세라, 인코포레이티드 유전체층을갖는마이크로전자리드구조
US5937276A (en) 1996-12-13 1999-08-10 Tessera, Inc. Bonding lead structure with enhanced encapsulation
US6029881A (en) * 1997-02-06 2000-02-29 International Business Machines Corporation Micro-scale part positioning by surface interlocking
US6286746B1 (en) * 1997-08-28 2001-09-11 Axya Medical, Inc. Fused loop of filamentous material and apparatus for making same
US6049046A (en) * 1997-09-30 2000-04-11 Siemens Energy & Automation, Inc. Electric circuit protection device having electrical parts ultrasonically joined using a brazing alloy
US6010059A (en) * 1997-09-30 2000-01-04 Siemens Energy & Automation, Inc. Method for ultrasonic joining of electrical parts using a brazing alloy
US6131795A (en) * 1997-11-10 2000-10-17 Matsushita Electric Industrial Co., Ltd. Thermal compression bonding method of electronic part with solder bump
US6220499B1 (en) * 1998-09-29 2001-04-24 International Business Machines Corporation Method for assembling a chip carrier to a semiconductor device
US6062553A (en) * 1999-07-09 2000-05-16 Strehl; Edward A. Vice jaw assembly with floating spacer and gripping blocks for use with a tool holder
DE10211875A1 (de) * 2002-03-18 2003-10-02 Mann & Hummel Filter Verfahren zum Vibrationsschweissen und Werkzeug zu dessen Durchführung
US20050199420A1 (en) * 2004-03-10 2005-09-15 Matsushita Electric Industrial Co., Ltd. Circuit board and method for manufacturing the same
DE102004011929A1 (de) * 2004-03-11 2005-09-29 Conti Temic Microelectronic Gmbh Verfahren zur Herstellung einer Bondverbindung zwischen elektrischen Kontaktflächen
CA2646300A1 (en) * 2006-04-18 2007-11-01 Axya Medical, Inc. Multicomponent fused suture loop and apparatus for making same
DE102006021335A1 (de) * 2006-05-05 2007-11-08 Endress + Hauser Gmbh + Co. Kg Leiterplatte mit mehreren Bauteilen und Verfahren zum Löten dieser Leiterplatte
DE102007014762A1 (de) * 2007-03-28 2008-10-02 Robert Bosch Gmbh Verfahren und Vorrichtung zum Herstellen einer Bondverbindung
US20090280751A1 (en) * 2008-05-07 2009-11-12 Ahmadreza Rofougaran Method And System For On-Demand Beamforming
US20110101534A1 (en) * 2009-11-04 2011-05-05 International Business Machines Corporation Automated short length wire shape strapping and methods of fabricting the same
JP2012192413A (ja) * 2011-03-15 2012-10-11 Yazaki Corp 超音波接合方法
US8986062B2 (en) * 2013-01-18 2015-03-24 Shenzhen China Star Optoelectronics Technology Co., Ltd. Method for repairing white defect of liquid crystal display panel
US9381594B2 (en) * 2013-11-04 2016-07-05 Caterpillar Inc. Laser cladding with a laser scanning head
JP6646872B2 (ja) * 2016-03-09 2020-02-14 株式会社オートネットワーク技術研究所 端子付き電線の製造方法及び端子付き電線
JP6903300B1 (ja) * 2020-06-16 2021-07-14 エレファンテック株式会社 電子装置及びその製造方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3463898A (en) * 1965-07-09 1969-08-26 Tokyo Shibaura Electric Co Welding device utilizing laser beams
US3406246A (en) * 1966-07-11 1968-10-15 United Aircraft Corp Articles for printed circuit repair
US3458102A (en) * 1967-08-09 1969-07-29 Kulicke & Soffa Ind Inc Semiconductor wafer pickup and bonding tool
US3568307A (en) * 1969-04-10 1971-03-09 Kulicke & Soffa Ind Inc Method of picking up and bonding semiconductor wafers to a carrier
US3690538A (en) * 1970-02-25 1972-09-12 Gaiser Tool Co Bonding tool
US3695502A (en) * 1970-09-14 1972-10-03 Floyd E Gaiser Bonding tool
US3762040A (en) * 1971-10-06 1973-10-02 Western Electric Co Method of forming circuit crossovers
US4030657A (en) * 1972-12-26 1977-06-21 Rca Corporation Wire lead bonding tool
DE2640613C2 (de) * 1976-09-09 1985-03-07 Siemens AG, 1000 Berlin und 8000 München Verfahren und Vorrichtung zum Kontaktieren von Schaltungsbausteinen in eine Schichtschaltung
JPS608426Y2 (ja) * 1976-12-08 1985-03-25 シャープ株式会社 半導体ウエハ−の保持基板
US4259367A (en) * 1979-07-30 1981-03-31 International Business Machines Corporation Fine line repair technique
JPS56161693A (en) * 1980-05-19 1981-12-12 Fujitsu Ltd Method of repairing printed circuit board
DE3025875A1 (de) * 1980-07-08 1982-02-04 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zur reparatur von leiterbahnunterbrechungen
FR2492164B1 (fr) * 1980-10-15 1987-01-23 Radiotechnique Compelec Procede de realisation simultanee de liaisons electriques multiples, notamment pour le raccordement electrique d'une micro-plaquette de semiconducteurs
JPS59177993A (ja) * 1983-03-28 1984-10-08 富士通株式会社 導体パタ−ン修復方法
DK149270C (da) * 1983-05-27 1986-08-25 Schering Ag Analogifremgangsmaade til fremstilling af beta-carbolin-3-carboxylsyrederivater
US4952257A (en) * 1985-02-22 1990-08-28 E-P Corporation Lamination repair method
US4630355A (en) * 1985-03-08 1986-12-23 Energy Conversion Devices, Inc. Electric circuits having repairable circuit lines and method of making the same
US4691855A (en) * 1985-12-30 1987-09-08 Fujitsu Limited Twin wire splitter system
US4667867A (en) * 1986-07-01 1987-05-26 Gte Products Corporation Wire bonding tool
US4683652A (en) * 1986-08-22 1987-08-04 Hatfield Jerry L Printed circuit repair process
GB8624513D0 (en) * 1986-10-13 1986-11-19 Microelectronics & Computer Single point bonding method
US4778097A (en) * 1986-12-04 1988-10-18 Hauser John G Ultrasonic wire bonding tool
US4908938A (en) * 1988-05-26 1990-03-20 Siemens Aktiengesellschaft Method for repairing interconnect interruptions by bridging with congruent preforms
US4912843A (en) * 1988-05-26 1990-04-03 Siemens Aktiengesellschaft Method for repairing interconnect interruptions
JPH0312478A (ja) * 1989-06-09 1991-01-21 Canon Inc 強誘電性カイラルスメクチック液晶組成物およびこれを含む液晶素子
US4967950A (en) * 1989-10-31 1990-11-06 International Business Machines Corporation Soldering method

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DE69202430T2 (de) 1996-01-25
JPH0831672B2 (ja) 1996-03-27
EP0536076B1 (de) 1995-05-10
EP0536076A1 (de) 1993-04-07
JPH05206619A (ja) 1993-08-13
US5193732A (en) 1993-03-16

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