DE68901660D1 - Verfahren und vorrichtung zur positionierung von elektrischen bauelementen. - Google Patents

Verfahren und vorrichtung zur positionierung von elektrischen bauelementen.

Info

Publication number
DE68901660D1
DE68901660D1 DE8989850038T DE68901660T DE68901660D1 DE 68901660 D1 DE68901660 D1 DE 68901660D1 DE 8989850038 T DE8989850038 T DE 8989850038T DE 68901660 T DE68901660 T DE 68901660T DE 68901660 D1 DE68901660 D1 DE 68901660D1
Authority
DE
Germany
Prior art keywords
electrical components
positioning electrical
positioning
components
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8989850038T
Other languages
English (en)
Other versions
DE68901660T2 (de
Inventor
Ted Minter Smith
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE68901660D1 publication Critical patent/DE68901660D1/de
Application granted granted Critical
Publication of DE68901660T2 publication Critical patent/DE68901660T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49718—Repairing
    • Y10T29/49721—Repairing with disassembling
    • Y10T29/4973—Replacing of defective part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Automatic Assembly (AREA)
DE8989850038T 1988-02-16 1989-02-07 Verfahren und vorrichtung zur positionierung von elektrischen bauelementen. Expired - Lifetime DE68901660T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/155,773 US4796357A (en) 1988-02-16 1988-02-16 Method and apparatus for positioning electrical components

Publications (2)

Publication Number Publication Date
DE68901660D1 true DE68901660D1 (de) 1992-07-09
DE68901660T2 DE68901660T2 (de) 1992-12-24

Family

ID=22556736

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8989850038T Expired - Lifetime DE68901660T2 (de) 1988-02-16 1989-02-07 Verfahren und vorrichtung zur positionierung von elektrischen bauelementen.

Country Status (4)

Country Link
US (1) US4796357A (de)
EP (1) EP0329630B1 (de)
JP (1) JPH01209799A (de)
DE (1) DE68901660T2 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5332275A (en) * 1991-11-27 1994-07-26 Microscience Group, Inc. Microgripper
US5284413A (en) * 1992-08-05 1994-02-08 Intelmatec Corporation Apparatus for loading and unloading thin integrated circuits into and from carriers
US5626378A (en) * 1994-08-11 1997-05-06 Vactech, Inc. Self-actuated vacuum grip
US5697658A (en) * 1995-05-05 1997-12-16 Samsung Electronics Co., Ltd. Centering apparatus for component mounting device
US5908283A (en) 1996-11-26 1999-06-01 United Parcel Service Of Americia, Inc. Method and apparatus for palletizing packages of random size and weight
US6393694B2 (en) * 1999-04-23 2002-05-28 Koninklijke Philips Electronics N.V. Gripping device
JP3828807B2 (ja) * 2000-01-14 2006-10-04 芝浦メカトロニクス株式会社 部品実装装置および部品実装方法
US6438818B1 (en) * 2000-02-21 2002-08-27 Larry J. Costa Electrical terminal implementation device
US6584670B2 (en) * 2000-02-21 2003-07-01 Larry J. Costa Electrical terminal implementation device
CN102837272A (zh) * 2011-06-22 2012-12-26 鸿富锦精密工业（深圳）有限公司 吸附装置
US6651866B2 (en) * 2001-10-17 2003-11-25 Lilogix, Inc. Precision bond head for mounting semiconductor chips
KR100817254B1 (ko) 2007-03-27 2008-03-27 한국뉴매틱(주) 내장 진공펌프를 갖는 레벨 보정기
US20130139378A1 (en) * 2011-12-01 2013-06-06 Sae Magnetics (H.K.) Ltd. Method of manufacturing thermally-assisted magnetic recording head and alignment apparatus
KR101157542B1 (ko) * 2012-04-26 2012-06-22 한국뉴매틱(주) 인-라인 진공펌프
CN104627454B (zh) * 2013-11-15 2017-01-11 深圳富泰宏精密工业有限公司 吸头装置
ITUB20160018A1 (it) * 2016-01-25 2017-07-25 Officina Meccanica Di Prec G 3 Di Gamba Walter & C S N C Picker per manipolatore di circuiti integrati
EP3687270B1 (de) * 2017-09-22 2022-10-19 Fuji Corporation Montageverfahren für elektronische komponenten und montagemaschine für elektronische komponenten
JP6777688B2 (ja) * 2018-06-15 2020-10-28 ファナック株式会社 コネクタ接続用ハンドおよびハンドシステム
CN112008369B (zh) * 2020-08-15 2021-12-10 温岭市微米自动化设备有限公司 一种自动轴承压装设备

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5425196B2 (de) * 1972-03-16 1979-08-25
US3985238A (en) * 1973-03-17 1976-10-12 Daikin Kogyo Co., Ltd. Industrial robot
US4132318A (en) * 1976-12-30 1979-01-02 International Business Machines Corporation Asymmetric six-degree-of-freedom force-transducer system for a computer-controlled manipulator system
CH617559GA3 (de) * 1977-12-29 1980-06-13
US4260187A (en) * 1979-03-23 1981-04-07 Nasa Terminal guidance sensor system
WO1985003404A1 (en) * 1984-01-23 1985-08-01 Dyna/Pert - Precima Limited Head for handling electrical components
JPS6119522A (ja) * 1984-07-06 1986-01-28 Matsushita Electric Ind Co Ltd 部品挿入ヘツド
US4611397A (en) * 1984-10-09 1986-09-16 Universal Instruments Corporation Pick and place method and apparatus for handling electrical components
JPS62131533A (ja) * 1985-12-04 1987-06-13 Hitachi Ltd チヤツク機構

Also Published As

Publication number Publication date
US4796357A (en) 1989-01-10
EP0329630A3 (de) 1991-02-06
EP0329630B1 (de) 1992-06-03
EP0329630A2 (de) 1989-08-23
DE68901660T2 (de) 1992-12-24
JPH01209799A (ja) 1989-08-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee