DE69007222D1 - Verfahren und Vorrichtung zur Elektroplattierung. - Google Patents

Verfahren und Vorrichtung zur Elektroplattierung.

Info

Publication number
DE69007222D1
DE69007222D1 DE90310591T DE69007222T DE69007222D1 DE 69007222 D1 DE69007222 D1 DE 69007222D1 DE 90310591 T DE90310591 T DE 90310591T DE 69007222 T DE69007222 T DE 69007222T DE 69007222 D1 DE69007222 D1 DE 69007222D1
Authority
DE
Germany
Prior art keywords
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE90310591T
Other languages
English (en)
Other versions
DE69007222T2 (de
Inventor
Hironari Sawa
Kazunari Sawa
Norinari Sawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of DE69007222D1 publication Critical patent/DE69007222D1/de
Application granted granted Critical
Publication of DE69007222T2 publication Critical patent/DE69007222T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
DE69007222T 1989-09-29 1990-09-27 Verfahren und Vorrichtung zur Elektroplattierung. Expired - Fee Related DE69007222T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1252093A JPH03115593A (ja) 1989-09-29 1989-09-29 鍍金方法及びその鍍金方法に使用する鍍金装置

Publications (2)

Publication Number Publication Date
DE69007222D1 true DE69007222D1 (de) 1994-04-14
DE69007222T2 DE69007222T2 (de) 1994-09-29

Family

ID=17232441

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69007222T Expired - Fee Related DE69007222T2 (de) 1989-09-29 1990-09-27 Verfahren und Vorrichtung zur Elektroplattierung.

Country Status (5)

Country Link
US (1) US5139636A (de)
EP (1) EP0420640B1 (de)
JP (1) JPH03115593A (de)
KR (1) KR930004073B1 (de)
DE (1) DE69007222T2 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5217598A (en) * 1989-09-29 1993-06-08 Hironari Sawa Process for electroplating and apparatus therefor
JPH10511744A (ja) * 1995-10-26 1998-11-10 レアー ロナル ゲーエムベーハー 板状対象の化学的または電解的表面処理のための装置
DE19539866C2 (de) * 1995-10-26 1997-09-18 Lea Ronal Gmbh Vorrichtung zur chemischen oder elektrolytischen Oberflächenbehandlung plattenförmiger Gegenstände
US6811591B2 (en) * 2000-10-13 2004-11-02 The United States Of America As Represented By The Secretary Of The Army Autonomous system and method for efficiently collecting fugitive airborne emissions from open vessels
JP4994185B2 (ja) * 2007-10-24 2012-08-08 株式会社 大昌電子 めっき電流遮蔽体、めっき用治具、めっき装置、めっき基板の製造方法
WO2016023162A1 (zh) * 2014-08-11 2016-02-18 深圳崇达多层线路板有限公司 一种电镀槽及电镀装置
CN112481667B (zh) * 2020-11-03 2021-12-07 深圳市恒兴安实业有限公司 一种锌-镍合金电镀工艺

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3567595A (en) * 1967-09-25 1971-03-02 Circuit Foil Corp Electrolytic plating method
US3630860A (en) * 1970-02-05 1971-12-28 Phillips Petroleum Co Electrochemical treatment of material produced by reaction in electrochemical cell
US3959112A (en) * 1975-06-12 1976-05-25 Amax Inc. Device for providing uniform air distribution in air-agitated electrowinning cells
CA1062651A (en) * 1976-05-11 1979-09-18 Anthony P. Holko Process and apparatus for electrowinning metal from metal bearing solutions
DE2846692A1 (de) * 1978-10-26 1980-05-08 Norddeutsche Affinerie Anode
US4360410A (en) * 1981-03-06 1982-11-23 Western Electric Company, Inc. Electroplating processes and equipment utilizing a foam electrolyte

Also Published As

Publication number Publication date
US5139636A (en) 1992-08-18
KR910006521A (ko) 1991-04-29
KR930004073B1 (ko) 1993-05-20
EP0420640A1 (de) 1991-04-03
DE69007222T2 (de) 1994-09-29
JPH03115593A (ja) 1991-05-16
JPH0571674B2 (de) 1993-10-07
EP0420640B1 (de) 1994-03-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee