DE602006014985D1 - Flexible leiterplatte und verfahren zu ihrer herstellung - Google Patents

Flexible leiterplatte und verfahren zu ihrer herstellung

Info

Publication number
DE602006014985D1
DE602006014985D1 DE602006014985T DE602006014985T DE602006014985D1 DE 602006014985 D1 DE602006014985 D1 DE 602006014985D1 DE 602006014985 T DE602006014985 T DE 602006014985T DE 602006014985 T DE602006014985 T DE 602006014985T DE 602006014985 D1 DE602006014985 D1 DE 602006014985D1
Authority
DE
Germany
Prior art keywords
reinforcement plate
silver foil
ink
production
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006014985T
Other languages
English (en)
Inventor
Hua Zhang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BYD Co Ltd
Original Assignee
BYD Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BYD Co Ltd filed Critical BYD Co Ltd
Publication of DE602006014985D1 publication Critical patent/DE602006014985D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
DE602006014985T 2005-10-25 2006-07-28 Flexible leiterplatte und verfahren zu ihrer herstellung Active DE602006014985D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CNB2005100219630A CN100546432C (zh) 2005-10-25 2005-10-25 一种挠性印刷线路板的制造方法
PCT/CN2006/001886 WO2007048300A1 (en) 2005-10-25 2006-07-28 Flexible printed circuit and method for manufacturing the same

Publications (1)

Publication Number Publication Date
DE602006014985D1 true DE602006014985D1 (de) 2010-07-29

Family

ID=37967397

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006014985T Active DE602006014985D1 (de) 2005-10-25 2006-07-28 Flexible leiterplatte und verfahren zu ihrer herstellung

Country Status (7)

Country Link
US (1) US8171622B2 (de)
EP (1) EP1941789B1 (de)
JP (1) JP4663793B2 (de)
CN (1) CN100546432C (de)
AT (1) ATE471655T1 (de)
DE (1) DE602006014985D1 (de)
WO (1) WO2007048300A1 (de)

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* Cited by examiner, † Cited by third party
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CN101437358B (zh) * 2007-11-14 2010-04-14 昆山雅森电子材料科技有限公司 印刷电路板的保护膜及使用该保护膜的电路板加工制程
JP2011018873A (ja) * 2009-05-22 2011-01-27 Sony Ericsson Mobilecommunications Japan Inc 電磁シールド方法および電磁シールド用フィルム
JP4865020B2 (ja) 2009-09-11 2012-02-01 株式会社東芝 電子機器
JP4996727B2 (ja) 2010-08-31 2012-08-08 株式会社東芝 電子機器およびフレキシブルプリント配線板
DE102012004634A1 (de) * 2011-03-28 2012-10-04 Heidelberger Druckmaschinen Ag Verfahren zum Erzeugen einer Schicht auf einem Substrat
CN102300409B (zh) * 2011-07-08 2014-02-26 深圳市精诚达电路科技股份有限公司 挠性电路板基材与补强材料间粘合的方法
WO2014139126A1 (en) 2013-03-14 2014-09-18 Laird Technologies, Inc. Flame-retardant electrically-conductive adhesive material and method of making the same
CN103327731B (zh) * 2013-05-29 2017-03-29 上海安费诺永亿通讯电子有限公司 一种加强电子线路表面接触强度的结构
CN106916546A (zh) * 2015-12-28 2017-07-04 严能进 一种增强型免钉胶薄片及其制造方法
CN105430881A (zh) * 2015-12-29 2016-03-23 广东欧珀移动通信有限公司 柔性电路板及终端
CN105828590A (zh) * 2016-05-10 2016-08-03 青岛海信移动通信技术股份有限公司 一种终端设备
JP6246857B2 (ja) * 2016-05-24 2017-12-13 Ｊｘ金属株式会社 ロール状積層体、ロール状積層体の製造方法、積層体の製造方法、ビルドアップ基板の製造方法、プリント配線板の製造方法、電子機器の製造方法
CN106154660A (zh) * 2016-08-30 2016-11-23 信利半导体有限公司 一种液晶显示装置的制作方法
CN107240451A (zh) * 2017-05-25 2017-10-10 江苏金坤科技有限公司 一种内画线补强板及生产方法
CN107454756B (zh) * 2017-07-12 2019-11-15 维沃移动通信有限公司 一种fpc器件贴片方法、fpc组件及终端
CN108135072A (zh) * 2017-12-07 2018-06-08 江苏联康电子有限公司 一种柔性线路板补强的制作方法
CN109493748B (zh) * 2019-01-04 2021-01-22 京东方科技集团股份有限公司 显示模组、显示装置及显示模组的制作方法
CN112105157A (zh) * 2020-08-31 2020-12-18 广州源康精密电子股份有限公司 一种增加柔性电路板补强胶片结合力的处理方法
CN113271719B (zh) * 2021-06-23 2022-07-08 昆山丘钛生物识别科技有限公司 柔性电路板处理方法、装置及设备

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US4517044A (en) * 1981-11-18 1985-05-14 Advanced Graphic Technology Dry transfer decal and method of manufacture
JPS6052082A (ja) * 1983-08-31 1985-03-23 日本メクトロン株式会社 フレキシブル回路基板の製造法
US4659872A (en) * 1985-04-30 1987-04-21 Amp Incorporated Flexible flat multiconductor cable
US4753838A (en) * 1986-06-16 1988-06-28 Tsuguji Kimura Polishing sheet material and method for its production
JP2875076B2 (ja) 1990-11-29 1999-03-24 三井化学株式会社 フレキシブル配線基板
JPH0524145A (ja) 1991-07-24 1993-02-02 Unitika Ltd 積層体および電磁波シールド材
US5417044A (en) * 1993-10-18 1995-05-23 Russo; Anthony N. Horse mucking rake device
JPH07245494A (ja) 1994-03-03 1995-09-19 Cmk Corp 銅箔接着剤に磁性体材料を含有させたプリント配線板 用素材
US6378199B1 (en) * 1994-05-13 2002-04-30 Dai Nippon Printing Co., Ltd. Multi-layer printed-wiring board process for producing
JP2850786B2 (ja) * 1995-02-28 1999-01-27 ヤマハ株式会社 シールド基板及びその製造方法
US6168855B1 (en) * 1997-12-01 2001-01-02 Polyeitan Composites Ltd. Polyolefin composites for printed circuit board and antenna base material
JP2000269632A (ja) * 1999-03-17 2000-09-29 Tatsuta Electric Wire & Cable Co Ltd シールドフレキシブルプリント配線板の製造方法、シールドフレキシブルプリント配線板用補強シールドフィルム及びシールドフレキシブルプリント配線板
US6480359B1 (en) 2000-05-09 2002-11-12 3M Innovative Properties Company Hard disk drive suspension with integral flexible circuit
JP3895125B2 (ja) * 2001-04-12 2007-03-22 日東電工株式会社 補強板付フレキシブルプリント回路板
WO2002089664A2 (en) * 2001-05-03 2002-11-14 Masimo Corporation Flex circuit shielded optical sensor and method of fabricating the same
JP2003234550A (ja) 2002-02-08 2003-08-22 Mitsumi Electric Co Ltd フレキシブルプリント回路
JP4360774B2 (ja) * 2002-03-29 2009-11-11 タツタ電線株式会社 補強シールドフィルム及びシールドフレキシブルプリント配線板
JP4201548B2 (ja) * 2002-07-08 2008-12-24 タツタ電線株式会社 シールドフィルム、シールドフレキシブルプリント配線板及びそれらの製造方法
US6781056B1 (en) * 2003-02-28 2004-08-24 Motorola, Inc. Heater for temperature control integrated in circuit board and method of manufacture
JP4086768B2 (ja) * 2003-12-10 2008-05-14 日東電工株式会社 フレキシブル回路用基板の製造方法
US7300820B2 (en) * 2004-03-16 2007-11-27 Temic Automotive Of North America, Inc. Adhesive assembly for a circuit board

Also Published As

Publication number Publication date
EP1941789B1 (de) 2010-06-16
US20090145632A1 (en) 2009-06-11
WO2007048300A1 (en) 2007-05-03
CN1956629A (zh) 2007-05-02
US8171622B2 (en) 2012-05-08
JP2009513023A (ja) 2009-03-26
EP1941789A1 (de) 2008-07-09
ATE471655T1 (de) 2010-07-15
EP1941789A4 (de) 2008-11-26
CN100546432C (zh) 2009-09-30
JP4663793B2 (ja) 2011-04-06

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