DE602006011927D1 - Verfahren zur herstellung eines strukturierten elements auf einem träger, welches verfahren eine obere antireflexbeschichtungszusammensetzung mit geringem brechungsindex bei einer strahlungswellenlänge von 193nm verwendet - Google Patents

Verfahren zur herstellung eines strukturierten elements auf einem träger, welches verfahren eine obere antireflexbeschichtungszusammensetzung mit geringem brechungsindex bei einer strahlungswellenlänge von 193nm verwendet

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Publication number
DE602006011927D1
DE602006011927D1 DE602006011927T DE602006011927T DE602006011927D1 DE 602006011927 D1 DE602006011927 D1 DE 602006011927D1 DE 602006011927 T DE602006011927 T DE 602006011927T DE 602006011927 T DE602006011927 T DE 602006011927T DE 602006011927 D1 DE602006011927 D1 DE 602006011927D1
Authority
DE
Germany
Prior art keywords
radiation wavelength
embowment
index
producing
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
DE602006011927T
Other languages
German (de)
English (en)
Inventor
Wu-Song Huang
William Heath
Kaushal Patel
Pushkara Varanasi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE602006011927D1 publication Critical patent/DE602006011927D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/942—Masking
    • Y10S438/948—Radiation resist
    • Y10S438/952—Utilizing antireflective layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Paints Or Removers (AREA)
  • Surface Treatment Of Optical Elements (AREA)
DE602006011927T 2005-10-13 2006-08-31 Verfahren zur herstellung eines strukturierten elements auf einem träger, welches verfahren eine obere antireflexbeschichtungszusammensetzung mit geringem brechungsindex bei einer strahlungswellenlänge von 193nm verwendet Active DE602006011927D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/249,693 US7544750B2 (en) 2005-10-13 2005-10-13 Top antireflective coating composition with low refractive index at 193nm radiation wavelength
PCT/EP2006/065877 WO2007042348A1 (en) 2005-10-13 2006-08-31 Top antireflective coating composition with low refractive index at 193nm radiation wavelength

Publications (1)

Publication Number Publication Date
DE602006011927D1 true DE602006011927D1 (de) 2010-03-11

Family

ID=37188858

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006011927T Active DE602006011927D1 (de) 2005-10-13 2006-08-31 Verfahren zur herstellung eines strukturierten elements auf einem träger, welches verfahren eine obere antireflexbeschichtungszusammensetzung mit geringem brechungsindex bei einer strahlungswellenlänge von 193nm verwendet

Country Status (9)

Country Link
US (1) US7544750B2 (enExample)
EP (1) EP1934654B1 (enExample)
JP (2) JP4866912B2 (enExample)
KR (1) KR101054729B1 (enExample)
CN (1) CN101288029B (enExample)
AT (1) ATE456076T1 (enExample)
DE (1) DE602006011927D1 (enExample)
TW (1) TWI391787B (enExample)
WO (1) WO2007042348A1 (enExample)

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KR101096954B1 (ko) * 2006-01-31 2011-12-20 신에쓰 가가꾸 고교 가부시끼가이샤 고분자 화합물, 레지스트 보호막 재료 및 패턴 형성 방법
US7771913B2 (en) * 2006-04-04 2010-08-10 Shin-Etsu Chemical Co., Ltd. Resist composition and patterning process using the same
JP4749232B2 (ja) * 2006-05-24 2011-08-17 信越化学工業株式会社 レジスト上層反射防止膜材料およびパターン形成方法
US7608390B2 (en) * 2006-08-04 2009-10-27 International Business Machines Corporation Top antireflective coating composition containing hydrophobic and acidic groups
JP4888655B2 (ja) * 2006-08-11 2012-02-29 信越化学工業株式会社 レジスト保護膜材料及びパターン形成方法
JP5162934B2 (ja) * 2007-03-23 2013-03-13 Ｊｓｒ株式会社 上層反射防止膜形成用組成物及びレジストパターン形成方法
JP5229228B2 (ja) * 2007-09-26 2013-07-03 Ｊｓｒ株式会社 液浸用上層膜形成用組成物及び液浸用上層膜並びにフォトレジストパターン形成方法
JP4993139B2 (ja) * 2007-09-28 2012-08-08 信越化学工業株式会社 反射防止膜形成材料、反射防止膜及びこれを用いたパターン形成方法
JP5010569B2 (ja) * 2008-01-31 2012-08-29 信越化学工業株式会社 レジスト保護膜材料及びパターン形成方法
JP5228792B2 (ja) * 2008-10-23 2013-07-03 Ｊｓｒ株式会社 上層反射防止膜形成用組成物及び上層反射防止膜
US8097401B2 (en) 2009-03-24 2012-01-17 International Business Machines Corporation Self-forming top anti-reflective coating compositions and, photoresist mixtures and method of imaging using same
JP5382321B2 (ja) * 2009-03-31 2014-01-08 日産化学工業株式会社 レジスト下層膜形成組成物及びそれを用いたレジストパターンの形成方法
US9012133B2 (en) 2011-08-30 2015-04-21 International Business Machines Corporation Removal of alkaline crystal defects in lithographic patterning
WO2022196485A1 (ja) * 2021-03-19 2022-09-22 Jsr株式会社 半導体基板の製造方法及びレジスト下層膜形成用組成物

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JP2643056B2 (ja) * 1991-06-28 1997-08-20 インターナショナル・ビジネス・マシーンズ・コーポレイション 表面反射防止コーティング形成組成物及びその使用
SG52630A1 (en) * 1993-10-12 1998-09-28 Hoechst Ag Top anti-reflective coating films
JP3334304B2 (ja) * 1993-11-30 2002-10-15 ソニー株式会社 半導体装置の製造方法
US5731385A (en) * 1993-12-16 1998-03-24 International Business Machines Corporation Polymeric dyes for antireflective coatings
US5879853A (en) * 1996-01-18 1999-03-09 Kabushiki Kaisha Toshiba Top antireflective coating material and its process for DUV and VUV lithography systems
TW357395B (en) * 1996-03-07 1999-05-01 Clariant Finance Bvi Ltd Light-absorbing antireflective layers with improved performance due to refractive index optimization
US6274295B1 (en) * 1997-03-06 2001-08-14 Clariant Finance (Bvi) Limited Light-absorbing antireflective layers with improved performance due to refractive index optimization
JP3965740B2 (ja) 1997-10-24 2007-08-29 旭硝子株式会社 コーティング組成物
US5994007A (en) * 1997-12-19 1999-11-30 Kabushiki Kaisha Toshiba Pattern forming method utilizing first insulative and then conductive overlayer and underlayer
JP3673399B2 (ja) * 1998-06-03 2005-07-20 クラリアント インターナショナル リミテッド 反射防止コーティング用組成物
US6114085A (en) * 1998-11-18 2000-09-05 Clariant Finance (Bvi) Limited Antireflective composition for a deep ultraviolet photoresist
US6251562B1 (en) * 1998-12-23 2001-06-26 International Business Machines Corporation Antireflective polymer and method of use
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JP2003345026A (ja) * 2002-05-24 2003-12-03 Tokyo Ohka Kogyo Co Ltd 反射防止膜形成用塗布液組成物およびこれを用いたホトレジスト積層体、並びにホトレジストパターンの形成方法
JP3851594B2 (ja) * 2002-07-04 2006-11-29 Ａｚエレクトロニックマテリアルズ株式会社 反射防止コーティング用組成物およびパターン形成方法
KR100586541B1 (ko) * 2003-07-16 2006-06-07 주식회사 하이닉스반도체 유기 반사 방지막 조성물 및 이를 이용한 패턴 형성 방법
KR100586542B1 (ko) * 2003-07-31 2006-06-07 주식회사 하이닉스반도체 상부 반사방지막 중합체, 이의 제조 방법 및 이를포함하는 반사방지막 조성물
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JP4551704B2 (ja) * 2004-07-08 2010-09-29 富士フイルム株式会社 液浸露光用保護膜形成組成物及びそれを用いたパターン形成方法
JP4520245B2 (ja) * 2004-08-17 2010-08-04 セントラル硝子株式会社 リソグラフィー用トップコート膜の製造方法
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US7709182B2 (en) * 2004-12-03 2010-05-04 Jsr Corporation Composition for forming antireflection film, layered product, and method of forming resist pattern
US7326523B2 (en) * 2004-12-16 2008-02-05 International Business Machines Corporation Low refractive index polymers as underlayers for silicon-containing photoresists
US7375172B2 (en) * 2005-07-06 2008-05-20 International Business Machines Corporation Underlayer compositions containing heterocyclic aromatic structures

Also Published As

Publication number Publication date
CN101288029A (zh) 2008-10-15
EP1934654B1 (en) 2010-01-20
US7544750B2 (en) 2009-06-09
ATE456076T1 (de) 2010-02-15
CN101288029B (zh) 2012-05-30
WO2007042348A1 (en) 2007-04-19
KR20080063302A (ko) 2008-07-03
US20070087285A1 (en) 2007-04-19
TW200734823A (en) 2007-09-16
KR101054729B1 (ko) 2011-08-05
JP4866912B2 (ja) 2012-02-01
JP2009511969A (ja) 2009-03-19
EP1934654A1 (en) 2008-06-25
JP2012008586A (ja) 2012-01-12
JP5182830B2 (ja) 2013-04-17
TWI391787B (zh) 2013-04-01

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