DE602005023402D1 - Silberpulver sowie Verfahren zu dessen Herstellung - Google Patents

Silberpulver sowie Verfahren zu dessen Herstellung

Info

Publication number
DE602005023402D1
DE602005023402D1 DE602005023402T DE602005023402T DE602005023402D1 DE 602005023402 D1 DE602005023402 D1 DE 602005023402D1 DE 602005023402 T DE602005023402 T DE 602005023402T DE 602005023402 T DE602005023402 T DE 602005023402T DE 602005023402 D1 DE602005023402 D1 DE 602005023402D1
Authority
DE
Germany
Prior art keywords
silver powder
silver
treated
heat
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005023402T
Other languages
English (en)
Inventor
Takatoshi Fujino
Kozo Ogi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Electronics Materials Co Ltd
Original Assignee
Dowa Electronics Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Electronics Materials Co Ltd filed Critical Dowa Electronics Materials Co Ltd
Publication of DE602005023402D1 publication Critical patent/DE602005023402D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H01G4/0085—Fried electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C01P2006/13—Surface area thermal stability thereof at high temperatures
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
DE602005023402T 2004-11-25 2005-11-23 Silberpulver sowie Verfahren zu dessen Herstellung Active DE602005023402D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004340789A JP5028695B2 (ja) 2004-11-25 2004-11-25 銀粉およびその製造方法

Publications (1)

Publication Number Publication Date
DE602005023402D1 true DE602005023402D1 (de) 2010-10-21

Family

ID=36127299

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005023402T Active DE602005023402D1 (de) 2004-11-25 2005-11-23 Silberpulver sowie Verfahren zu dessen Herstellung

Country Status (8)

Country Link
US (2) US8282702B2 (de)
EP (1) EP1666174B1 (de)
JP (1) JP5028695B2 (de)
KR (1) KR101141839B1 (de)
CN (2) CN1781630B (de)
AT (1) ATE480350T1 (de)
DE (1) DE602005023402D1 (de)
TW (1) TWI367137B (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5032005B2 (ja) * 2005-07-05 2012-09-26 三井金属鉱業株式会社 高結晶銀粉及びその高結晶銀粉の製造方法
JP2007235082A (ja) 2006-02-02 2007-09-13 E I Du Pont De Nemours & Co 太陽電池電極用ペースト
JP5252843B2 (ja) * 2007-01-09 2013-07-31 Ｄｏｗａエレクトロニクス株式会社 銀インクおよびその製法
JP5232016B2 (ja) * 2007-01-09 2013-07-10 Ｄｏｗａエレクトロニクス株式会社 配線形成用材料
WO2010025140A2 (en) * 2008-08-29 2010-03-04 Dow Corning Corporation Metallized particles formed from a dispersion
KR101061841B1 (ko) 2009-01-13 2011-09-05 충남대학교산학협력단 화학환원법에 의한 단분산 구형 은 분말의 제조방법
AU2010349580B2 (en) * 2010-08-27 2014-06-26 Dowa Electronics Materials Co., Ltd. Low-temperature sintered silver nanoparticle composition and electronic articles formed using the same
JP5556561B2 (ja) * 2010-10-06 2014-07-23 住友金属鉱山株式会社 銀粉及びその製造方法
JP5916633B2 (ja) * 2011-01-26 2016-05-11 ナミックス株式会社 導電性ペースト及び導電膜の製造方法
JP6174301B2 (ja) * 2011-03-28 2017-08-02 Ｄｏｗａエレクトロニクス株式会社 銀粉および導電性ペースト
KR101883709B1 (ko) * 2011-06-21 2018-08-01 스미토모 긴조쿠 고잔 가부시키가이샤 은분 및 그 제조 방법
JP5872440B2 (ja) * 2012-02-13 2016-03-01 Ｄｏｗａエレクトロニクス株式会社 球状銀粉およびその製造方法
JP2012153979A (ja) * 2012-04-02 2012-08-16 Dowa Holdings Co Ltd 銀粉およびその製造方法
KR101558462B1 (ko) * 2012-10-30 2015-10-13 가켄 테크 가부시키가이샤 도전성 페이스트 및 다이 본딩 방법
US9648753B2 (en) * 2012-12-31 2017-05-09 Amogreentech Co., Ltd. Flexible printed circuit board and method for manufacturing same
CN103350235B (zh) * 2013-07-16 2015-07-22 宁波晶鑫电子材料有限公司 一种触点粘合用高亮度银粉的制备方法
JP6404554B2 (ja) * 2013-10-03 2018-10-10 住友金属鉱山株式会社 銀粉の製造方法
CN104289726B (zh) * 2014-09-25 2017-02-15 中国船舶重工集团公司第七一二研究所 高比表面积絮状超细银粉制备方法及制得的银粉
JP6158461B1 (ja) * 2015-12-25 2017-07-05 株式会社ノリタケカンパニーリミテド 銀粉末および銀ペーストならびにその利用
CN105880626A (zh) * 2016-05-13 2016-08-24 浙江光达电子科技有限公司 一种太阳能电池正面银浆用类球形超细银粉的制备方法
CN105869775A (zh) * 2016-05-13 2016-08-17 浙江光达电子科技有限公司 太阳能电池正面银浆用球形银粉的制备方法
CN107983946B (zh) * 2016-10-26 2019-12-06 中国科学院苏州纳米技术与纳米仿生研究所 一种降低银粉比表面积的方法
CN107457411B (zh) * 2017-06-15 2019-02-05 昆明理工大学 一种制备超细银粉的方法
CN110364285B (zh) * 2019-07-09 2021-02-12 湖南省国银新材料有限公司 一种低温快速固化的rfid电子浆料及其制备方法
CN111889695A (zh) * 2020-07-15 2020-11-06 善日(嘉善)能源科技有限公司 一种粒径可控的微纳米银粉的制备方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62280308A (ja) 1986-05-30 1987-12-05 Mitsui Mining & Smelting Co Ltd 銀−パラジウム合金微粉末の製造方法
US5045141A (en) * 1988-07-01 1991-09-03 Amoco Corporation Method of making solderable printed circuits formed without plating
JPH04269403A (ja) 1991-02-25 1992-09-25 Nec Kagoshima Ltd 導電性ペースト
JPH05239502A (ja) * 1992-02-28 1993-09-17 Daido Steel Co Ltd 金属フレークの処理方法
TW261554B (de) * 1992-10-05 1995-11-01 Du Pont
JP4012960B2 (ja) * 1996-09-12 2007-11-28 Ｄｏｗａエレクトロニクス株式会社 銀粉の製造方法
JP4025839B2 (ja) * 1996-09-12 2007-12-26 Ｄｏｗａエレクトロニクス株式会社 銀粉および銀粉の製造方法
JPH10183209A (ja) * 1996-12-25 1998-07-14 Sumitomo Metal Mining Co Ltd 鱗片状銀粉末の製造方法
JPH11177240A (ja) * 1997-12-11 1999-07-02 Taiyo Yuden Co Ltd セラミック積層体の製造方法
JP3457879B2 (ja) * 1998-02-25 2003-10-20 石福金属興業株式会社 白金ペーストに用いる球形状白金粉末の製造方法
JP3751154B2 (ja) * 1998-10-22 2006-03-01 同和鉱業株式会社 銀粉の製造方法
JP2000160212A (ja) * 1998-11-27 2000-06-13 Mitsuboshi Belting Ltd 金属微粒子−チタニア複合体の製造方法
US6110254A (en) * 1999-02-24 2000-08-29 The United States Of America As Represented By The Secretary Of Commerce Method for chemical precipitation of metallic silver powder via a two solution technique
JP2001107101A (ja) * 1999-10-12 2001-04-17 Mitsui Mining & Smelting Co Ltd 高分散性球状銀粉末及びその製造方法
JP4639395B2 (ja) 2001-08-09 2011-02-23 Ｄｏｗａエレクトロニクス株式会社 銀粒子の製造方法
JP2003306701A (ja) * 2002-04-19 2003-10-31 Mitsui Mining & Smelting Co Ltd 耐熱金属層付銀粉及びその耐熱金属層付銀粉を用いた銀ペースト並びにその銀ペーストを用いて得られた配線板
JP2004323866A (ja) * 2003-04-21 2004-11-18 Murata Mfg Co Ltd ニッケル粉末の製造方法及びニッケル粉末
JP4320447B2 (ja) * 2004-02-03 2009-08-26 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法

Also Published As

Publication number Publication date
EP1666174B1 (de) 2010-09-08
ATE480350T1 (de) 2010-09-15
US8992701B2 (en) 2015-03-31
CN1781630A (zh) 2006-06-07
JP5028695B2 (ja) 2012-09-19
CN101513671A (zh) 2009-08-26
TW200626262A (en) 2006-08-01
US20060107791A1 (en) 2006-05-25
KR20060058655A (ko) 2006-05-30
TWI367137B (en) 2012-07-01
JP2006152327A (ja) 2006-06-15
CN1781630B (zh) 2010-08-04
US8282702B2 (en) 2012-10-09
US20120219453A1 (en) 2012-08-30
EP1666174A2 (de) 2006-06-07
EP1666174A3 (de) 2006-09-13
KR101141839B1 (ko) 2012-05-07
CN101513671B (zh) 2010-12-08

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