DE602005005588T2 - Lösemittelfreie Polyimid-Silikonharz-Zusammensetzung und mittels Vernetzung dergleichen hergestellter Film - Google Patents

Lösemittelfreie Polyimid-Silikonharz-Zusammensetzung und mittels Vernetzung dergleichen hergestellter Film Download PDF

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Publication number
DE602005005588T2
DE602005005588T2 DE602005005588T DE602005005588T DE602005005588T2 DE 602005005588 T2 DE602005005588 T2 DE 602005005588T2 DE 602005005588 T DE602005005588 T DE 602005005588T DE 602005005588 T DE602005005588 T DE 602005005588T DE 602005005588 T2 DE602005005588 T2 DE 602005005588T2
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DE
Germany
Prior art keywords
silicone resin
polyimide
solvent
resin composition
free
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602005005588T
Other languages
German (de)
English (en)
Other versions
DE602005005588D1 (de
Inventor
Yoshinori 379-0224 Usui-gun Yoneda
Michihiro 379-0224 Usui-gun Sugo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin-Etsu Chemical Co Ltd
Original Assignee
Shin-Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin-Etsu Chemical Co Ltd filed Critical Shin-Etsu Chemical Co Ltd
Publication of DE602005005588D1 publication Critical patent/DE602005005588D1/de
Application granted granted Critical
Publication of DE602005005588T2 publication Critical patent/DE602005005588T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
    • C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Organic Insulating Materials (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
DE602005005588T 2004-09-09 2005-09-06 Lösemittelfreie Polyimid-Silikonharz-Zusammensetzung und mittels Vernetzung dergleichen hergestellter Film Expired - Lifetime DE602005005588T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004262005 2004-09-09
JP2004262005 2004-09-09
JP2005234548 2005-08-12
JP2005234548A JP4372065B2 (ja) 2004-09-09 2005-08-12 無溶剤型ポリイミドシリコーン樹脂組成物及びその硬化樹脂皮膜

Publications (2)

Publication Number Publication Date
DE602005005588D1 DE602005005588D1 (de) 2008-05-08
DE602005005588T2 true DE602005005588T2 (de) 2009-05-07

Family

ID=35427957

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005005588T Expired - Lifetime DE602005005588T2 (de) 2004-09-09 2005-09-06 Lösemittelfreie Polyimid-Silikonharz-Zusammensetzung und mittels Vernetzung dergleichen hergestellter Film

Country Status (6)

Country Link
US (1) US7432313B2 (cg-RX-API-DMAC7.html)
EP (1) EP1634907B1 (cg-RX-API-DMAC7.html)
JP (1) JP4372065B2 (cg-RX-API-DMAC7.html)
KR (1) KR101135772B1 (cg-RX-API-DMAC7.html)
DE (1) DE602005005588T2 (cg-RX-API-DMAC7.html)
TW (1) TW200615281A (cg-RX-API-DMAC7.html)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4602151B2 (ja) * 2004-04-22 2010-12-22 信越化学工業株式会社 無溶剤型ポリイミドシリコーン系樹脂組成物及びこれを用いた樹脂皮膜
WO2007052540A1 (ja) * 2005-11-01 2007-05-10 Jsr Corporation 感光性樹脂組成物
JP4771100B2 (ja) 2008-08-27 2011-09-14 信越化学工業株式会社 無溶剤型ポリイミドシリコーン系樹脂組成物及びその硬化物
JP5457051B2 (ja) * 2009-03-05 2014-04-02 新日鉄住金化学株式会社 位相差フィルム及びその製造方法
JP5100894B2 (ja) * 2009-12-22 2012-12-19 新日鉄住金化学株式会社 ポリイミド樹脂、その製造方法、接着剤樹脂組成物、カバーレイフィルム及び回路基板
TWI362398B (en) * 2009-12-31 2012-04-21 Ind Tech Res Inst Polyimide polymers for flexible electrical device substrate material and flexible electrical devices comprising the same
RU2414762C1 (ru) * 2010-03-26 2011-03-20 Федеральное государственное унитарное предприятие "Особое конструкторское бюро кабельной промышленности" Радиационно-сшиваемая композиция на основе фторуглеродного полимера
JP6379390B2 (ja) * 2013-04-03 2018-08-29 日産化学株式会社 無溶剤型光硬化性樹脂組成物
US11543083B2 (en) 2014-09-28 2023-01-03 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11997768B2 (en) 2014-09-28 2024-05-28 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
EP3266808B1 (en) 2015-03-05 2020-12-09 LG Chem, Ltd. Composition for polyimide film for flexible substrate of optoelectronic device
JP6763139B2 (ja) * 2015-12-25 2020-09-30 信越化学工業株式会社 無溶剤型シリコーン変性ポリイミド樹脂組成物
JP2017222745A (ja) 2016-06-14 2017-12-21 信越化学工業株式会社 無溶剤型シリコーン変性ポリイミド樹脂組成物
US10982048B2 (en) * 2018-04-17 2021-04-20 Jiaxing Super Lighting Electric Appliance Co., Ltd Organosilicon-modified polyimide resin composition and use thereof
WO2021225163A1 (ja) * 2020-05-08 2021-11-11 積水化学工業株式会社 粘着剤組成物、粘着テープ、及び、電子部品の処理方法
CN117662093A (zh) * 2022-08-30 2024-03-08 中国石油化工股份有限公司 耐酸可溶球及其制备方法与应用

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4499149A (en) * 1980-12-15 1985-02-12 M&T Chemicals Inc. Siloxane-containing polymers
JP3211108B2 (ja) * 1992-06-25 2001-09-25 チッソ株式会社 感光性樹脂組成物
JP3451128B2 (ja) 1994-03-31 2003-09-29 新日鐵化学株式会社 ポリイミド樹脂及び耐熱接着剤
JP2002012667A (ja) 2000-06-29 2002-01-15 Shin Etsu Chem Co Ltd ポリイミドシリコーン樹脂、その溶液組成物、およびポリイミドシリコーン樹脂皮膜
JP3865046B2 (ja) * 2001-05-08 2007-01-10 信越化学工業株式会社 無溶剤型ポリイミドシリコーン系樹脂組成物
WO2003038526A1 (fr) * 2001-10-30 2003-05-08 Kaneka Corporation Composition de resine photosensible et films et stratifies photosensibles ainsi obtenus
DE60302853T2 (de) * 2002-10-10 2006-08-24 Shin-Etsu Chemical Co., Ltd. Farbloses und transparentes Polyimidsilikonharz mit wärmehärtenden funktionellen Gruppen
JP4204435B2 (ja) 2002-10-10 2009-01-07 信越化学工業株式会社 熱硬化性基を含有する透明ポリイミドシリコーン樹脂

Also Published As

Publication number Publication date
JP4372065B2 (ja) 2009-11-25
US7432313B2 (en) 2008-10-07
TW200615281A (en) 2006-05-16
EP1634907B1 (en) 2008-03-26
JP2006104447A (ja) 2006-04-20
EP1634907A1 (en) 2006-03-15
TWI370138B (cg-RX-API-DMAC7.html) 2012-08-11
KR20060051106A (ko) 2006-05-19
DE602005005588D1 (de) 2008-05-08
US20060052476A1 (en) 2006-03-09
KR101135772B1 (ko) 2012-04-16

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