DE602005001622D1 - Dispersion für das chemisch-mechanische polieren von metalloberflächen mit metalloxidpartikeln und einem kationischen polymer - Google Patents

Dispersion für das chemisch-mechanische polieren von metalloberflächen mit metalloxidpartikeln und einem kationischen polymer

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Publication number
DE602005001622D1
DE602005001622D1 DE602005001622T DE602005001622T DE602005001622D1 DE 602005001622 D1 DE602005001622 D1 DE 602005001622D1 DE 602005001622 T DE602005001622 T DE 602005001622T DE 602005001622 T DE602005001622 T DE 602005001622T DE 602005001622 D1 DE602005001622 D1 DE 602005001622D1
Authority
DE
Germany
Prior art keywords
dispersion
chemical
mechanical polishing
metal oxide
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005001622T
Other languages
English (en)
Other versions
DE602005001622T2 (de
Inventor
Wolfgang Lortz
Frank Menzel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Evonik Operations GmbH
Original Assignee
Degussa GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Degussa GmbH filed Critical Degussa GmbH
Priority to DE602005001622T priority Critical patent/DE602005001622T2/de
Publication of DE602005001622D1 publication Critical patent/DE602005001622D1/de
Application granted granted Critical
Publication of DE602005001622T2 publication Critical patent/DE602005001622T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/02—Silicon
    • C01B33/021—Preparation
    • C01B33/023—Preparation by reduction of silica or free silica-containing material
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F7/00—Compounds of aluminium
    • C01F7/02—Aluminium oxide; Aluminium hydroxide; Aluminates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Geology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE602005001622T 2004-04-03 2005-03-16 Dispersion für das chemisch-mechanische polieren von metalloberflächen mit metalloxidpartikeln und einem kationischen polymer Active DE602005001622T2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE602005001622T DE602005001622T2 (de) 2004-04-03 2005-03-16 Dispersion für das chemisch-mechanische polieren von metalloberflächen mit metalloxidpartikeln und einem kationischen polymer

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102004016600 2004-04-03
DE102004016600A DE102004016600A1 (de) 2004-04-03 2004-04-03 Dispersion zum chemisch-mechanischen Polieren von Metalloberflächen enthaltend Metalloxidpartikel und ein kationisches Polymer
DE602005001622T DE602005001622T2 (de) 2004-04-03 2005-03-16 Dispersion für das chemisch-mechanische polieren von metalloberflächen mit metalloxidpartikeln und einem kationischen polymer
PCT/EP2005/002786 WO2005097930A2 (en) 2004-04-03 2005-03-16 Dispersion for the chemical-mechanical polishing of metal surfaces containing metal oxide particles and a cationic polymer

Publications (2)

Publication Number Publication Date
DE602005001622D1 true DE602005001622D1 (de) 2007-08-23
DE602005001622T2 DE602005001622T2 (de) 2008-08-14

Family

ID=34962311

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102004016600A Withdrawn DE102004016600A1 (de) 2004-04-03 2004-04-03 Dispersion zum chemisch-mechanischen Polieren von Metalloberflächen enthaltend Metalloxidpartikel und ein kationisches Polymer
DE602005001622T Active DE602005001622T2 (de) 2004-04-03 2005-03-16 Dispersion für das chemisch-mechanische polieren von metalloberflächen mit metalloxidpartikeln und einem kationischen polymer

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102004016600A Withdrawn DE102004016600A1 (de) 2004-04-03 2004-04-03 Dispersion zum chemisch-mechanischen Polieren von Metalloberflächen enthaltend Metalloxidpartikel und ein kationisches Polymer

Country Status (9)

Country Link
US (1) US20070157524A1 (de)
EP (1) EP1732999B1 (de)
JP (1) JP2007530749A (de)
KR (1) KR100806995B1 (de)
CN (1) CN1938393A (de)
AT (1) ATE366784T1 (de)
DE (2) DE102004016600A1 (de)
TW (1) TWI297719B (de)
WO (1) WO2005097930A2 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008078706A1 (ja) * 2006-12-22 2008-07-03 Denki Kagaku Kogyo Kabushiki Kaisha 非晶質シリカ質粉末、その製造方法及び半導体封止材
CN101177591B (zh) * 2007-12-07 2010-06-02 天长市华润清洗科技有限公司 金属抛光剂及其制备方法
JP5518523B2 (ja) * 2010-02-25 2014-06-11 富士フイルム株式会社 化学的機械的研磨液及び研磨方法
JP5925454B2 (ja) 2010-12-16 2016-05-25 花王株式会社 磁気ディスク基板用研磨液組成物
JP5979872B2 (ja) * 2011-01-31 2016-08-31 花王株式会社 磁気ディスク基板の製造方法
DE102013208034A1 (de) 2012-05-23 2013-11-28 Evonik Industries Ag Verfahren zum chemisch-mechanischen Polieren mittels einer Siliciumdioxidpartikel und Kationisierungsmittel aufweisenden Dispersion
CN108977173A (zh) * 2012-06-11 2018-12-11 嘉柏微电子材料股份公司 用于抛光钼的组合物和方法
JP6538701B2 (ja) * 2014-02-05 2019-07-03 キャボット マイクロエレクトロニクス コーポレイション 窒化チタン及びチタン／窒化チタン除去の抑制に関するｃｍｐ方法
US9238754B2 (en) * 2014-03-11 2016-01-19 Cabot Microelectronics Corporation Composition for tungsten CMP
JP6425954B2 (ja) * 2014-09-26 2018-11-21 太平洋セメント株式会社 研磨材
CN106062931A (zh) * 2015-02-06 2016-10-26 嘉柏微电子材料股份公司 用于抑制氮化钛及钛/氮化钛移除的化学机械抛光方法
US9631122B1 (en) * 2015-10-28 2017-04-25 Cabot Microelectronics Corporation Tungsten-processing slurry with cationic surfactant
US10557060B2 (en) * 2016-03-01 2020-02-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of chemical mechanical polishing a substrate
US10573524B2 (en) * 2016-03-04 2020-02-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of chemical mechanical polishing a semiconductor substrate
CN106271898A (zh) * 2016-08-18 2017-01-04 广西华银铝业有限公司 一种石英片的清洁方法
WO2019006604A1 (zh) * 2017-07-03 2019-01-10 深圳市宏昌发科技有限公司 抛光剂、不锈钢件及其抛光处理方法
US20190085205A1 (en) * 2017-09-15 2019-03-21 Cabot Microelectronics Corporation NITRIDE INHIBITORS FOR HIGH SELECTIVITY OF TiN-SiN CMP APPLICATIONS
CN111094481A (zh) * 2017-09-15 2020-05-01 嘉柏微电子材料股份公司 用于钨化学机械抛光的组合物
US10815392B2 (en) * 2018-05-03 2020-10-27 Rohm and Haas Electronic CMP Holdings, Inc. Chemical mechanical polishing method for tungsten
KR102114839B1 (ko) * 2018-06-08 2020-05-27 한국생산기술연구원 전자파 차폐 및 방열 복합시트를 위한 코어-쉘 구조의 금속수산화물 제조방법
US11712777B2 (en) * 2019-06-10 2023-08-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cationic fluoropolymer composite polishing pad
CN112920716A (zh) * 2021-01-26 2021-06-08 中国科学院上海微系统与信息技术研究所 一种用于氮化钛化学机械抛光的组合物及其使用方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4406624A1 (de) * 1994-03-01 1995-09-07 Roehm Gmbh Vernetzte wasserlösliche Polymerdispersionen
EP1234800A1 (de) * 2001-02-22 2002-08-28 Degussa Aktiengesellschaft Wässrige Dispersion, Verfahren zu ihrer Herstellung und Verwendung
US6589100B2 (en) * 2001-09-24 2003-07-08 Cabot Microelectronics Corporation Rare earth salt/oxidizer-based CMP method
DE10205280C1 (de) * 2002-02-07 2003-07-03 Degussa Dispersion zum chemisch-mechanischen Polieren
US6776810B1 (en) * 2002-02-11 2004-08-17 Cabot Microelectronics Corporation Anionic abrasive particles treated with positively charged polyelectrolytes for CMP
DE10320854A1 (de) * 2003-05-09 2004-12-09 Degussa Ag Dispersion zum chemisch-mechanischen Polieren

Also Published As

Publication number Publication date
KR20060135010A (ko) 2006-12-28
JP2007530749A (ja) 2007-11-01
US20070157524A1 (en) 2007-07-12
WO2005097930A2 (en) 2005-10-20
ATE366784T1 (de) 2007-08-15
EP1732999B1 (de) 2007-07-11
WO2005097930A3 (en) 2006-01-12
DE602005001622T2 (de) 2008-08-14
DE102004016600A1 (de) 2005-10-27
KR100806995B1 (ko) 2008-02-25
TW200536910A (en) 2005-11-16
TWI297719B (en) 2008-06-11
EP1732999A2 (de) 2006-12-20
CN1938393A (zh) 2007-03-28

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8327 Change in the person/name/address of the patent owner

Owner name: EVONIK DEGUSSA GMBH, 40474 DUESSELDORF, DE

8364 No opposition during term of opposition