WO2008078706A1 - 非晶質シリカ質粉末、その製造方法及び半導体封止材 - Google Patents

非晶質シリカ質粉末、その製造方法及び半導体封止材 Download PDF

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Publication number
WO2008078706A1
WO2008078706A1 PCT/JP2007/074727 JP2007074727W WO2008078706A1 WO 2008078706 A1 WO2008078706 A1 WO 2008078706A1 JP 2007074727 W JP2007074727 W JP 2007074727W WO 2008078706 A1 WO2008078706 A1 WO 2008078706A1
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WO
WIPO (PCT)
Prior art keywords
particle diameter
amorphous silica
silica powder
sealing material
semiconductor sealing
Prior art date
Application number
PCT/JP2007/074727
Other languages
English (en)
French (fr)
Inventor
Yasuhisa Inishi
Tohru Umezaki
Original Assignee
Denki Kagaku Kogyo Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo Kabushiki Kaisha filed Critical Denki Kagaku Kogyo Kabushiki Kaisha
Priority to US12/517,851 priority Critical patent/US8048817B2/en
Priority to JP2008551090A priority patent/JP5410095B2/ja
Priority to KR1020097012604A priority patent/KR101394808B1/ko
Priority to CN2007800465897A priority patent/CN101563291B/zh
Publication of WO2008078706A1 publication Critical patent/WO2008078706A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Silicon Compounds (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

　ＨＴＳＬ特性及びＨＴＯＬ特性を向上させた半導体封止材用に好適な非晶質シリカ質粉末、その製造方法を提供する。 　原子吸光光度法で測定されたＡｌ量をＡｌ２Ｏ３換算で０．０３～２０質量％含有する非晶質シリカ質粉末であって、平均粒子径が５０μｍ以下であり、かつ、該非晶質シリカ質粉末を平均粒子径で二つの粉末に分けたときに、平均粒子径より大きな粒子径を有する粉末側よりも、平均粒子径より小さな粒子径を有する粉末側の方が、Ａｌ２Ｏ３換算含有率が大きいことを特徴とする非晶質シリカ質粉末。
PCT/JP2007/074727 2006-12-22 2007-12-21 非晶質シリカ質粉末、その製造方法及び半導体封止材 WO2008078706A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US12/517,851 US8048817B2 (en) 2006-12-22 2007-12-21 Amorphous silica powder, process for its production, and sealing material for semiconductors
JP2008551090A JP5410095B2 (ja) 2006-12-22 2007-12-21 非晶質シリカ質粉末、その製造方法及び半導体封止材
KR1020097012604A KR101394808B1 (ko) 2006-12-22 2007-12-21 비정질 실리카질 분말, 그 제조 방법 및 반도체 봉지재
CN2007800465897A CN101563291B (zh) 2006-12-22 2007-12-21 无定形二氧化硅粉末、其制造方法及半导体密封材料

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006346638 2006-12-22
JP2006-346638 2006-12-22

Publications (1)

Publication Number Publication Date
WO2008078706A1 true WO2008078706A1 (ja) 2008-07-03

Family

ID=39562495

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/074727 WO2008078706A1 (ja) 2006-12-22 2007-12-21 非晶質シリカ質粉末、その製造方法及び半導体封止材

Country Status (7)

Country Link
US (1) US8048817B2 (ja)
JP (1) JP5410095B2 (ja)
KR (1) KR101394808B1 (ja)
CN (1) CN101563291B (ja)
MY (1) MY147189A (ja)
TW (1) TWI402214B (ja)
WO (1) WO2008078706A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010285307A (ja) * 2009-06-10 2010-12-24 Denki Kagaku Kogyo Kk 非晶質シリカ質粉末およびその製造方法、用途
US20120288716A1 (en) * 2010-01-07 2012-11-15 Mitsubishi Materials Corporation Synthetic amorphous silica powder
JP2013095855A (ja) * 2011-11-01 2013-05-20 Sumitomo Bakelite Co Ltd プリプレグ、積層板および電子部品

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9926398B2 (en) * 2013-03-20 2018-03-27 Cabot Corporation Composite particles and a process for making the same
US9725621B2 (en) 2013-05-03 2017-08-08 Cabot Corporation Chemical mechanical planarization slurry composition comprising composite particles, process for removing material using said composition, CMP polishing pad and process for preparing said composition
KR102359684B1 (ko) * 2014-11-12 2022-02-07 쓰리본드 화인 케미칼 가부시키가이샤 에폭시 수지조성물

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02227451A (ja) * 1989-02-28 1990-09-10 Denki Kagaku Kogyo Kk 樹脂用充填材及び液状エポキシ樹脂組成物
JPH10152315A (ja) * 1996-11-21 1998-06-09 Oji Yuka Synthetic Paper Co Ltd 無機微細粉末およびその利用
JP2005097930A (ja) * 2003-09-24 2005-04-14 Misawa Homes Co Ltd 建築仕上げ用板材および建築仕上げ用板材の接合構造
JP2005306923A (ja) * 2004-04-19 2005-11-04 Denki Kagaku Kogyo Kk 無機質粉末及びこれを含有した組成物

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EP0227168B1 (en) * 1985-12-09 1996-07-10 Mizusawa Industrial Chemicals Ltd. Alumina-silica resin additive
US5236680A (en) * 1987-01-20 1993-08-17 Mizusawa Industrial Chemicals, Ltd. Preparation of amorphous silica-alumina particles by acid-treating spherical P-type zeolite particles crystallized from a sodium aluminosilicate gel
JPH0617217B2 (ja) * 1989-02-28 1994-03-09 水澤化学工業株式会社 非晶質シリカ・アルミナ系球状粒子及びその製法
US5122191A (en) * 1990-02-22 1992-06-16 Takenaka Corporation Admixture and cement composition using same
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JP3537082B2 (ja) 1999-02-09 2004-06-14 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
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FI110261B (fi) * 2000-06-20 2002-12-31 Paroc Group Oy Ab Menetelmä kolloidisen silikaattidispersion valmistamiseksi
DE10135452A1 (de) * 2001-07-20 2003-02-06 Degussa Pyrogen hergestellte Aluminium-Silicium-Mischoxide
US6630418B2 (en) * 2001-12-21 2003-10-07 Corning Incorporated Fused silica containing aluminum
JP2004035781A (ja) 2002-07-04 2004-02-05 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
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TWI412506B (zh) * 2006-05-12 2013-10-21 Denki Kagaku Kogyo Kk 陶瓷粉末及其用途
TWI408259B (zh) 2006-09-28 2013-09-11 Shinetsu Quartz Prod 具有鋇摻雜內壁的矽玻璃坩堝
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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02227451A (ja) * 1989-02-28 1990-09-10 Denki Kagaku Kogyo Kk 樹脂用充填材及び液状エポキシ樹脂組成物
JPH10152315A (ja) * 1996-11-21 1998-06-09 Oji Yuka Synthetic Paper Co Ltd 無機微細粉末およびその利用
JP2005097930A (ja) * 2003-09-24 2005-04-14 Misawa Homes Co Ltd 建築仕上げ用板材および建築仕上げ用板材の接合構造
JP2005306923A (ja) * 2004-04-19 2005-11-04 Denki Kagaku Kogyo Kk 無機質粉末及びこれを含有した組成物

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010285307A (ja) * 2009-06-10 2010-12-24 Denki Kagaku Kogyo Kk 非晶質シリカ質粉末およびその製造方法、用途
US20120288716A1 (en) * 2010-01-07 2012-11-15 Mitsubishi Materials Corporation Synthetic amorphous silica powder
JP2013095855A (ja) * 2011-11-01 2013-05-20 Sumitomo Bakelite Co Ltd プリプレグ、積層板および電子部品

Also Published As

Publication number Publication date
US8048817B2 (en) 2011-11-01
TW200838801A (en) 2008-10-01
KR20090104000A (ko) 2009-10-05
MY147189A (en) 2012-11-14
KR101394808B1 (ko) 2014-05-13
JP5410095B2 (ja) 2014-02-05
US20110021666A1 (en) 2011-01-27
TWI402214B (zh) 2013-07-21
CN101563291B (zh) 2011-06-22
JPWO2008078706A1 (ja) 2010-04-22
CN101563291A (zh) 2009-10-21

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