ATE366784T1 - Dispersion für das chemisch-mechanische polieren von metalloberflächen mit metalloxidpartikeln und einem kationischen polymer - Google Patents
Dispersion für das chemisch-mechanische polieren von metalloberflächen mit metalloxidpartikeln und einem kationischen polymerInfo
- Publication number
- ATE366784T1 ATE366784T1 AT05716106T AT05716106T ATE366784T1 AT E366784 T1 ATE366784 T1 AT E366784T1 AT 05716106 T AT05716106 T AT 05716106T AT 05716106 T AT05716106 T AT 05716106T AT E366784 T1 ATE366784 T1 AT E366784T1
- Authority
- AT
- Austria
- Prior art keywords
- dispersion
- chemical
- mechanical polishing
- metal oxide
- metal
- Prior art date
Links
- 239000006185 dispersion Substances 0.000 title abstract 4
- 229910044991 metal oxide Inorganic materials 0.000 title abstract 3
- 150000004706 metal oxides Chemical class 0.000 title abstract 3
- 238000005498 polishing Methods 0.000 title abstract 3
- 229920006317 cationic polymer Polymers 0.000 title 1
- 239000002245 particle Substances 0.000 title 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 4
- 125000002091 cationic group Chemical group 0.000 abstract 2
- 229920000642 polymer Polymers 0.000 abstract 2
- 239000000843 powder Substances 0.000 abstract 2
- 235000012239 silicon dioxide Nutrition 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 150000001412 amines Chemical class 0.000 abstract 1
- 230000004888 barrier function Effects 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229920000083 poly(allylamine) Polymers 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/02—Silicon
- C01B33/021—Preparation
- C01B33/023—Preparation by reduction of silica or free silica-containing material
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
- C01F7/00—Compounds of aluminium
- C01F7/02—Aluminium oxide; Aluminium hydroxide; Aluminates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102004016600A DE102004016600A1 (de) | 2004-04-03 | 2004-04-03 | Dispersion zum chemisch-mechanischen Polieren von Metalloberflächen enthaltend Metalloxidpartikel und ein kationisches Polymer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE366784T1 true ATE366784T1 (de) | 2007-08-15 |
Family
ID=34962311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT05716106T ATE366784T1 (de) | 2004-04-03 | 2005-03-16 | Dispersion für das chemisch-mechanische polieren von metalloberflächen mit metalloxidpartikeln und einem kationischen polymer |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20070157524A1 (de) |
| EP (1) | EP1732999B1 (de) |
| JP (1) | JP2007530749A (de) |
| KR (1) | KR100806995B1 (de) |
| CN (1) | CN1938393A (de) |
| AT (1) | ATE366784T1 (de) |
| DE (2) | DE102004016600A1 (de) |
| TW (1) | TWI297719B (de) |
| WO (1) | WO2005097930A2 (de) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5410095B2 (ja) * | 2006-12-22 | 2014-02-05 | 電気化学工業株式会社 | 非晶質シリカ質粉末、その製造方法及び半導体封止材 |
| CN101177591B (zh) * | 2007-12-07 | 2010-06-02 | 天长市华润清洗科技有限公司 | 金属抛光剂及其制备方法 |
| JP5518523B2 (ja) * | 2010-02-25 | 2014-06-11 | 富士フイルム株式会社 | 化学的機械的研磨液及び研磨方法 |
| JP5925454B2 (ja) | 2010-12-16 | 2016-05-25 | 花王株式会社 | 磁気ディスク基板用研磨液組成物 |
| JP5979872B2 (ja) * | 2011-01-31 | 2016-08-31 | 花王株式会社 | 磁気ディスク基板の製造方法 |
| DE102013208034A1 (de) | 2012-05-23 | 2013-11-28 | Evonik Industries Ag | Verfahren zum chemisch-mechanischen Polieren mittels einer Siliciumdioxidpartikel und Kationisierungsmittel aufweisenden Dispersion |
| US20130327977A1 (en) * | 2012-06-11 | 2013-12-12 | Cabot Microelectronics Corporation | Composition and method for polishing molybdenum |
| EP3103133A4 (de) * | 2014-02-05 | 2017-10-04 | Cabot Microelectronics Corporation | Cmp-verfahren zur unterdrückung von titannitrid und titan-/titannitridentfernung |
| US9238754B2 (en) * | 2014-03-11 | 2016-01-19 | Cabot Microelectronics Corporation | Composition for tungsten CMP |
| JP6425954B2 (ja) * | 2014-09-26 | 2018-11-21 | 太平洋セメント株式会社 | 研磨材 |
| CN106062931A (zh) * | 2015-02-06 | 2016-10-26 | 嘉柏微电子材料股份公司 | 用于抑制氮化钛及钛/氮化钛移除的化学机械抛光方法 |
| US9631122B1 (en) * | 2015-10-28 | 2017-04-25 | Cabot Microelectronics Corporation | Tungsten-processing slurry with cationic surfactant |
| KR20180117609A (ko) * | 2016-03-01 | 2018-10-29 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 | 기판의 화학 기계적 연마 방법 |
| WO2017147891A1 (en) * | 2016-03-04 | 2017-09-08 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of chemical mechanical polishing a semiconductor substrate |
| CN106271898A (zh) * | 2016-08-18 | 2017-01-04 | 广西华银铝业有限公司 | 一种石英片的清洁方法 |
| WO2019006604A1 (zh) * | 2017-07-03 | 2019-01-10 | 深圳市宏昌发科技有限公司 | 抛光剂、不锈钢件及其抛光处理方法 |
| US20190085205A1 (en) * | 2017-09-15 | 2019-03-21 | Cabot Microelectronics Corporation | NITRIDE INHIBITORS FOR HIGH SELECTIVITY OF TiN-SiN CMP APPLICATIONS |
| JP7270611B2 (ja) * | 2017-09-15 | 2023-05-10 | シーエムシー マテリアルズ，インコーポレイティド | タングステンｃｍｐ用組成物 |
| US10815392B2 (en) * | 2018-05-03 | 2020-10-27 | Rohm and Haas Electronic CMP Holdings, Inc. | Chemical mechanical polishing method for tungsten |
| KR102114839B1 (ko) * | 2018-06-08 | 2020-05-27 | 한국생산기술연구원 | 전자파 차폐 및 방열 복합시트를 위한 코어-쉘 구조의 금속수산화물 제조방법 |
| US11712777B2 (en) * | 2019-06-10 | 2023-08-01 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Cationic fluoropolymer composite polishing pad |
| CN112920716A (zh) * | 2021-01-26 | 2021-06-08 | 中国科学院上海微系统与信息技术研究所 | 一种用于氮化钛化学机械抛光的组合物及其使用方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4406624A1 (de) * | 1994-03-01 | 1995-09-07 | Roehm Gmbh | Vernetzte wasserlösliche Polymerdispersionen |
| EP1234800A1 (de) * | 2001-02-22 | 2002-08-28 | Degussa Aktiengesellschaft | Wässrige Dispersion, Verfahren zu ihrer Herstellung und Verwendung |
| US6589100B2 (en) * | 2001-09-24 | 2003-07-08 | Cabot Microelectronics Corporation | Rare earth salt/oxidizer-based CMP method |
| DE10205280C1 (de) * | 2002-02-07 | 2003-07-03 | Degussa | Dispersion zum chemisch-mechanischen Polieren |
| US6776810B1 (en) * | 2002-02-11 | 2004-08-17 | Cabot Microelectronics Corporation | Anionic abrasive particles treated with positively charged polyelectrolytes for CMP |
| DE10320854A1 (de) * | 2003-05-09 | 2004-12-09 | Degussa Ag | Dispersion zum chemisch-mechanischen Polieren |
-
2004
- 2004-04-03 DE DE102004016600A patent/DE102004016600A1/de not_active Withdrawn
-
2005
- 2005-03-16 JP JP2007505424A patent/JP2007530749A/ja active Pending
- 2005-03-16 CN CNA2005800107031A patent/CN1938393A/zh active Pending
- 2005-03-16 EP EP05716106A patent/EP1732999B1/de active Active
- 2005-03-16 US US11/547,034 patent/US20070157524A1/en not_active Abandoned
- 2005-03-16 AT AT05716106T patent/ATE366784T1/de not_active IP Right Cessation
- 2005-03-16 DE DE602005001622T patent/DE602005001622T2/de active Active
- 2005-03-16 WO PCT/EP2005/002786 patent/WO2005097930A2/en active IP Right Grant
- 2005-03-16 KR KR1020067020367A patent/KR100806995B1/ko active IP Right Grant
- 2005-03-30 TW TW094110057A patent/TWI297719B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| EP1732999A2 (de) | 2006-12-20 |
| TW200536910A (en) | 2005-11-16 |
| EP1732999B1 (de) | 2007-07-11 |
| KR100806995B1 (ko) | 2008-02-25 |
| DE602005001622D1 (de) | 2007-08-23 |
| DE602005001622T2 (de) | 2008-08-14 |
| JP2007530749A (ja) | 2007-11-01 |
| WO2005097930A2 (en) | 2005-10-20 |
| US20070157524A1 (en) | 2007-07-12 |
| KR20060135010A (ko) | 2006-12-28 |
| WO2005097930A3 (en) | 2006-01-12 |
| CN1938393A (zh) | 2007-03-28 |
| TWI297719B (en) | 2008-06-11 |
| DE102004016600A1 (de) | 2005-10-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |