DE602004031938D1 - Mikroelektromechanische Struktur, insbesondere Beschleunigungssensor, mit verbesserter Unempfindlichkeit gegenüber thermischen und mechanischen Spannungen - Google Patents

Mikroelektromechanische Struktur, insbesondere Beschleunigungssensor, mit verbesserter Unempfindlichkeit gegenüber thermischen und mechanischen Spannungen

Info

Publication number
DE602004031938D1
DE602004031938D1 DE602004031938T DE602004031938T DE602004031938D1 DE 602004031938 D1 DE602004031938 D1 DE 602004031938D1 DE 602004031938 T DE602004031938 T DE 602004031938T DE 602004031938 T DE602004031938 T DE 602004031938T DE 602004031938 D1 DE602004031938 D1 DE 602004031938D1
Authority
DE
Germany
Prior art keywords
thermal
acceleration sensor
mechanical stresses
microelectromechanical structure
particular acceleration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004031938T
Other languages
English (en)
Inventor
Angelo Merassi
Bruno Murari
Sarah Zerbini
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Original Assignee
STMicroelectronics SRL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SRL filed Critical STMicroelectronics SRL
Publication of DE602004031938D1 publication Critical patent/DE602004031938D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
    • B81B7/0048—Packages or encapsulation for reducing stress inside of the package structure between the MEMS die and the substrate
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/006—Details of instruments used for thermal compensation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
    • G01P2015/082—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for two degrees of freedom of movement of a single mass
DE602004031938T 2004-08-13 2004-08-13 Mikroelektromechanische Struktur, insbesondere Beschleunigungssensor, mit verbesserter Unempfindlichkeit gegenüber thermischen und mechanischen Spannungen Active DE602004031938D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP04425630A EP1626283B1 (de) 2004-08-13 2004-08-13 Mikroelektromechanische Struktur, insbesondere Beschleunigungssensor, mit verbesserter Unempfindlichkeit gegenüber thermischen und mechanischen Spannungen

Publications (1)

Publication Number Publication Date
DE602004031938D1 true DE602004031938D1 (de) 2011-05-05

Family

ID=34932720

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004031938T Active DE602004031938D1 (de) 2004-08-13 2004-08-13 Mikroelektromechanische Struktur, insbesondere Beschleunigungssensor, mit verbesserter Unempfindlichkeit gegenüber thermischen und mechanischen Spannungen

Country Status (3)

Country Link
US (1) US7322242B2 (de)
EP (1) EP1626283B1 (de)
DE (1) DE602004031938D1 (de)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1645847B1 (de) * 2004-10-08 2014-07-02 STMicroelectronics Srl Mikro-elektromechanische Vorrichtung mit Temperaturkompensation und Verfahren zur Temperaturkompensation in einer mikro-elektromechanischen Vorrichtung
JP5135683B2 (ja) * 2005-02-28 2013-02-06 ソニー株式会社 振動型ジャイロセンサ及び振動素子の製造方法
JP4595862B2 (ja) 2006-03-28 2010-12-08 パナソニック電工株式会社 静電容量式センサ
DE102006059928A1 (de) * 2006-12-19 2008-08-21 Robert Bosch Gmbh Beschleunigungssensor mit Kammelektroden
US8042396B2 (en) 2007-09-11 2011-10-25 Stmicroelectronics S.R.L. Microelectromechanical sensor with improved mechanical decoupling of sensing and driving modes
DE102007047592B4 (de) 2007-10-05 2022-01-05 Robert Bosch Gmbh Beschleunigungssensor
DE102008001863A1 (de) 2008-05-19 2009-11-26 Robert Bosch Gmbh Beschleunigungssensor mit umgreifender seismischer Masse
DE102008002606B4 (de) 2008-06-24 2020-03-12 Robert Bosch Gmbh Mikromechanischer Beschleunigungssensor mit offener seismischer Masse
US8499629B2 (en) 2008-10-10 2013-08-06 Honeywell International Inc. Mounting system for torsional suspension of a MEMS device
IT1391972B1 (it) 2008-11-26 2012-02-02 St Microelectronics Rousset Giroscopio microelettromeccanico con movimento di azionamento rotatorio e migliorate caratteristiche elettriche
ITTO20090489A1 (it) * 2008-11-26 2010-12-27 St Microelectronics Srl Circuito di lettura per un giroscopio mems multi-asse avente direzioni di rilevamento inclinate rispetto agli assi di riferimento, e corrispondente giroscopio mems multi-asse
IT1391973B1 (it) 2008-11-26 2012-02-02 St Microelectronics Rousset Giroscopio microelettromeccanico mono o biassiale con aumentata sensibilita' al rilevamento di velocita' angolari
IT1392741B1 (it) 2008-12-23 2012-03-16 St Microelectronics Rousset Giroscopio microelettromeccanico con migliorata reiezione di disturbi di accelerazione
US8186220B2 (en) * 2009-03-09 2012-05-29 Freescale Semiconductor, Inc. Accelerometer with over-travel stop structure
JP5206709B2 (ja) * 2009-03-18 2013-06-12 株式会社豊田中央研究所 可動体を備えている装置
IT1394007B1 (it) 2009-05-11 2012-05-17 St Microelectronics Rousset Struttura microelettromeccanica con reiezione migliorata di disturbi di accelerazione
TWM378928U (en) * 2009-07-29 2010-04-21 Pixart Imaging Inc Mems device and spring element of mems
US8534127B2 (en) 2009-09-11 2013-09-17 Invensense, Inc. Extension-mode angular velocity sensor
US9097524B2 (en) 2009-09-11 2015-08-04 Invensense, Inc. MEMS device with improved spring system
ITTO20091042A1 (it) 2009-12-24 2011-06-25 St Microelectronics Srl Giroscopio integrato microelettromeccanico con migliorata struttura di azionamento
US20110174074A1 (en) * 2010-01-15 2011-07-21 Freescale Semiconductor, Inc. Framed transducer device
JP4905574B2 (ja) * 2010-03-25 2012-03-28 株式会社豊田中央研究所 可動部分を備えている積層構造体
GB201020722D0 (en) 2010-12-07 2011-01-19 Atlantic Inertial Systems Ltd Accelerometer
US8610222B2 (en) 2011-04-18 2013-12-17 Freescale Semiconductor, Inc. MEMS device with central anchor for stress isolation
ITTO20110806A1 (it) 2011-09-12 2013-03-13 St Microelectronics Srl Dispositivo microelettromeccanico integrante un giroscopio e un accelerometro
US8968532B2 (en) 2011-10-06 2015-03-03 Applied Materials, Inc. Electrochemical processor alignment system
EP3059595B1 (de) * 2012-01-12 2018-07-04 Murata Electronics Oy Struktur eines beschleunigungssensors und verwendung
JP5962900B2 (ja) * 2012-04-02 2016-08-03 セイコーエプソン株式会社 物理量センサーおよび電子機器
US20150301075A1 (en) * 2012-10-16 2015-10-22 Hitachi Automotive Systems, Ltd. Inertial Sensor
JP6020392B2 (ja) * 2013-09-03 2016-11-02 株式会社デンソー 加速度センサ
US9404747B2 (en) 2013-10-30 2016-08-02 Stmicroelectroncs S.R.L. Microelectromechanical gyroscope with compensation of quadrature error drift
DE102014202819A1 (de) * 2014-02-17 2015-08-20 Robert Bosch Gmbh Mikromechanische Struktur für einen Beschleunigungssensor
GB2523320A (en) * 2014-02-19 2015-08-26 Atlantic Inertial Systems Ltd Accelerometers
US9463976B2 (en) * 2014-06-27 2016-10-11 Freescale Semiconductor, Inc. MEMS fabrication process with two cavities operating at different pressures
US20170356929A1 (en) * 2015-01-30 2017-12-14 Goertek, Inc. Z-axis structure of accelerometer and manufacturing method of z-axis structure
FI127000B (en) * 2015-06-26 2017-09-15 Murata Manufacturing Co MEMS sensor
JP6485260B2 (ja) 2015-07-10 2019-03-20 セイコーエプソン株式会社 物理量センサー、物理量センサー装置、電子機器および移動体
JP6558110B2 (ja) * 2015-07-10 2019-08-14 セイコーエプソン株式会社 物理量センサー、電子機器および移動体
JP6657626B2 (ja) * 2015-07-10 2020-03-04 セイコーエプソン株式会社 物理量センサー、電子機器および移動体
JP6575187B2 (ja) * 2015-07-10 2019-09-18 セイコーエプソン株式会社 物理量センサー、物理量センサー装置、電子機器および移動体
US10012671B2 (en) 2015-11-03 2018-07-03 Richtek Technology Corporation Micro-electro-mechanical system device
US10696541B2 (en) 2016-05-26 2020-06-30 Honeywell International Inc. Systems and methods for bias suppression in a non-degenerate MEMS sensor
US10371521B2 (en) 2016-05-26 2019-08-06 Honeywell International Inc. Systems and methods for a four-mass vibrating MEMS structure
KR101707959B1 (ko) * 2016-08-23 2017-02-17 국방과학연구소 점화안전장치 및 이를 이용한 추진 기관의 점화 방법
JP6866623B2 (ja) * 2016-12-07 2021-04-28 セイコーエプソン株式会社 物理量センサー、物理量センサーデバイス、電子機器および移動体
JP6866624B2 (ja) 2016-12-07 2021-04-28 セイコーエプソン株式会社 物理量センサー、物理量センサーデバイス、電子機器および移動体
FR3065956B1 (fr) * 2017-02-23 2021-05-21 Safran Dispositif mems ou nems a empilement de butee
JP2018179575A (ja) * 2017-04-05 2018-11-15 セイコーエプソン株式会社 物理量センサー、電子機器、および移動体
US10266389B2 (en) * 2017-07-31 2019-04-23 Infineon Technologies Dresden Gmbh Forming an offset in an interdigitated capacitor of a microelectromechanical systems (MEMS) device
JP6922552B2 (ja) 2017-08-25 2021-08-18 セイコーエプソン株式会社 物理量センサー、物理量センサーデバイス、電子機器、携帯型電子機器および移動体
JP6922562B2 (ja) * 2017-08-31 2021-08-18 セイコーエプソン株式会社 物理量センサー、物理量センサーデバイス、携帯型電子機器、電子機器および移動体
WO2020145202A1 (en) * 2019-01-08 2020-07-16 Panasonic Intellectual Property Management Co., Ltd. Sensing device
JP6870761B2 (ja) * 2019-05-15 2021-05-12 株式会社村田製作所 ロバストなｚ軸加速度センサ
JP7188311B2 (ja) * 2019-07-31 2022-12-13 セイコーエプソン株式会社 ジャイロセンサー、電子機器、及び移動体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5565625A (en) * 1994-12-01 1996-10-15 Analog Devices, Inc. Sensor with separate actuator and sense fingers
DE19537814B4 (de) * 1995-10-11 2009-11-19 Robert Bosch Gmbh Sensor und Verfahren zur Herstellung eines Sensors
KR100363246B1 (ko) * 1995-10-27 2003-02-14 삼성전자 주식회사 진동구조물및진동구조물의고유진동수제어방법
DE19639946B4 (de) 1996-09-27 2006-09-21 Robert Bosch Gmbh Mikromechanisches Bauelement
EP1083144B1 (de) * 1999-09-10 2008-05-07 STMicroelectronics S.r.l. Gegen mechanische Spannungen unempfindliche mikroelektromechanische Struktur
DE69932516T2 (de) 1999-09-10 2007-02-15 Stmicroelectronics S.R.L., Agrate Brianza Integrierter Halbleiter-Inertialsensor mit Mikroantrieb zur Kalibration
WO2004010150A2 (en) 2002-07-19 2004-01-29 Analog Devices, Inc. Reducing offset in accelerometers

Also Published As

Publication number Publication date
EP1626283B1 (de) 2011-03-23
US20060032310A1 (en) 2006-02-16
US7322242B2 (en) 2008-01-29
EP1626283A1 (de) 2006-02-15

Similar Documents

Publication Publication Date Title
DE602004031938D1 (de) Mikroelektromechanische Struktur, insbesondere Beschleunigungssensor, mit verbesserter Unempfindlichkeit gegenüber thermischen und mechanischen Spannungen
BRPI0716334A2 (pt) "sensor de analito de célula estamada e métodos de fabriação"
NO20066007L (no) Rullestol med mekanisk arm
FI20050739A (fi) Mikromekaaninen sensori, sensoriryhmä ja menetelmä
PT2036496T (pt) Artigo de vestuário com sistema de sensor integrado
NL1028342A1 (nl) Keramisch glas met lage thermisch expansie.
DE502006008419D1 (de) Bedienelement mit Näherungssensor
DE602006012406D1 (de) Keramikwabenstruktur
DE602004028716D1 (de) Festkörperbildsensor und Herstellungsverfahren
FR2874908B1 (fr) Element de capteur comportant une cavite avec des tranchees
DE502007005051D1 (de) Beschleunigungssensor
DE602005000859D1 (de) Dehnungssensor und entsprechendes Herstellungsverfahren.
NO20040789L (no) Forbedret pakning med integrerte sensorer.
DE602005027306D1 (de) Winkelgeschwindigkeitssensor
DE602005016509D1 (de) Piezoelektrisches Resonatorelement, piezoelektrisches Bauelement und Kreiselsensor
EP1902323A4 (de) Stimmgabel-kreisel, beschleunigungsmesser und andere sensoren mit verbessertem skalenfaktor
DE602006010119D1 (de) Mikro-Heizelement und Fühler
FR2877491B1 (fr) Structure composite a forte dissipation thermique
DK1714127T3 (da) Føler med modultilslutning
DE602005012752D1 (de) Motorrad mit Geschwindigkeitssensor
DE602004023082D1 (de) Mikro-Elektromechanische Struktur mit Selbstkompensation von durch thermomechanische Spannungen hervorgerufenen thermischen Driften
FR2874909B1 (fr) Element de capteur micromecanique
DE602006004938D1 (de) Lufreifen enthaltend eine Komponente mit geringer Wärmeausdehnung
NL1029114A1 (nl) Differentiele interferometer met verbeterde cyclische niet-lineariteit.
FI20050811A0 (fi) Menetelmä biomassan luontaisen rakenteen hajottamiseksi