JP4595862B2 - 静電容量式センサ - Google Patents
静電容量式センサ Download PDFInfo
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- JP4595862B2 JP4595862B2 JP2006089122A JP2006089122A JP4595862B2 JP 4595862 B2 JP4595862 B2 JP 4595862B2 JP 2006089122 A JP2006089122 A JP 2006089122A JP 2006089122 A JP2006089122 A JP 2006089122A JP 4595862 B2 JP4595862 B2 JP 4595862B2
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- 238000001514 detection method Methods 0.000 claims description 56
- 239000004065 semiconductor Substances 0.000 claims description 30
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- 230000008859 change Effects 0.000 claims description 20
- 238000006073 displacement reaction Methods 0.000 claims description 15
- 230000004044 response Effects 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 6
- 230000007423 decrease Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
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- 239000011347 resin Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/84—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of applied mechanical force, e.g. of pressure
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
- G01P2015/082—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for two degrees of freedom of movement of a single mass
Description
2,2A 半導体層
5 可動電極
5d 縁部(可動電極の他の一部;可動電極の内側面の一部)
5e 棒状部(棒状部分)
6 固定電極
6b 縁部(固定電極の他の一部;固定電極の外側面の一部)
6d 棒状部(棒状部分)
8 検出部
9 誤差補償部
10a (検出部8の)間隙
10b (誤差補償部9の)間隙(他の間隙)
Claims (2)
- 半導体層に形成された固定電極と可動電極とを備えるとともに、当該固定電極の一部と可動電極の一部とを間隙をもって相互に対向配置させて検出部が構成され、当該間隙の大きさに応じた静電容量を検出することで所定の物理量を検出する静電容量式センサにおいて、
前記半導体層は、全体として正方形状に形成されており、フレーム部が、前記半導体層の四辺に沿って枠状に延設され、
前記フレーム部の内側には、前記フレーム部に対して前記可動電極を弾性的に可動支持するビーム部が設けられ、
前記可動電極は、その可動電極中央部から前記フレーム部の一辺の中央部に向けてその辺と垂直な方向に帯状に伸びる可動電極櫛歯部を備え、
前記固定電極は、前記正方形状半導体層の隅部に対応する可動電極隅部に隣接して設けられる固定電極隅部と、この固定電極隅部から前記フレーム部の一辺に沿って帯状に伸びる固定電極縁部とを備えており、この固定電極縁部に、前記可動電極の中央部側に向けて伸びる固定電極櫛歯部が接続され、
前記可動電極櫛歯部と前記固定電極櫛歯部とを間隙をもって噛み合うようにして前記検出部を構成し、
前記可動電極隅部間に、前記フレーム部の辺に沿って平行に伸びる可動電極縁部を架設して、前記固定電極を取り囲み、前記可動電極縁部と前記固定電極縁部とを間隙をもって相互に対向配置させることにより、前記検出部における前記可動電極櫛歯部と前記固定電極櫛歯部との長手方向のずれによる静電容量の検出誤差を、当該ずれに伴う前記可動電極縁部と前記固定電極縁部との間隙の変化に応じた静電容量の変化によって減殺させる誤差補償部を構成し、
ずれに伴う前記可動電極縁部と前記固定電極縁部との間隙の変化に応じた静電容量の変化が、検出部においてずれに伴って生じる静電容量の変化と同一となるように、前記可動電極縁部と前記固定電極縁部との間隙および相互対向面積を設定したことを特徴とする静電容量式センサ。 - 前記ずれに伴って前記検出部において前記固定電極櫛歯部と前記可動電極櫛歯部とが相互に対向する面積が小さくなるほど、前記可動電極縁部と前記固定電極縁部との間隙が小さくなるようにしたことを特徴とする請求項1に記載の静電容量式センサ。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006089122A JP4595862B2 (ja) | 2006-03-28 | 2006-03-28 | 静電容量式センサ |
EP07005835A EP1840581B1 (en) | 2006-03-28 | 2007-03-21 | Capacitive sensor |
DE602007003126T DE602007003126D1 (de) | 2006-03-28 | 2007-03-21 | Kapazitiver Sensor |
KR1020070028216A KR100871217B1 (ko) | 2006-03-28 | 2007-03-22 | 용량성 센서 |
US11/689,663 US7554340B2 (en) | 2006-03-28 | 2007-03-22 | Capacitive sensor |
TW096109964A TWI324687B (en) | 2006-03-28 | 2007-03-22 | Capacitive sensor |
CNB2007100914012A CN100568001C (zh) | 2006-03-28 | 2007-03-28 | 电容传感器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006089122A JP4595862B2 (ja) | 2006-03-28 | 2006-03-28 | 静電容量式センサ |
Publications (2)
Publication Number | Publication Date |
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JP2007263741A JP2007263741A (ja) | 2007-10-11 |
JP4595862B2 true JP4595862B2 (ja) | 2010-12-08 |
Family
ID=38326211
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006089122A Active JP4595862B2 (ja) | 2006-03-28 | 2006-03-28 | 静電容量式センサ |
Country Status (7)
Country | Link |
---|---|
US (1) | US7554340B2 (ja) |
EP (1) | EP1840581B1 (ja) |
JP (1) | JP4595862B2 (ja) |
KR (1) | KR100871217B1 (ja) |
CN (1) | CN100568001C (ja) |
DE (1) | DE602007003126D1 (ja) |
TW (1) | TWI324687B (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8516891B2 (en) * | 2007-01-16 | 2013-08-27 | Analog Devices, Inc. | Multi-stage stopper system for MEMS devices |
JP4960767B2 (ja) * | 2007-05-25 | 2012-06-27 | パナソニック株式会社 | 変位センサ |
JP2009216693A (ja) * | 2008-02-13 | 2009-09-24 | Denso Corp | 物理量センサ |
US8186221B2 (en) * | 2009-03-24 | 2012-05-29 | Freescale Semiconductor, Inc. | Vertically integrated MEMS acceleration transducer |
DE102010039236B4 (de) * | 2010-08-12 | 2023-06-29 | Robert Bosch Gmbh | Sensoranordnung und Verfahren zum Abgleich einer Sensoranordnung |
JP6020793B2 (ja) * | 2012-04-02 | 2016-11-02 | セイコーエプソン株式会社 | 物理量センサーおよび電子機器 |
US9316666B2 (en) * | 2012-11-27 | 2016-04-19 | Murata Manufacturing Co., Ltd. | Acceleration sensor having a capacitor array located in the center of an inertial mass |
JP6206651B2 (ja) | 2013-07-17 | 2017-10-04 | セイコーエプソン株式会社 | 機能素子、電子機器、および移動体 |
JP2016042074A (ja) | 2014-08-13 | 2016-03-31 | セイコーエプソン株式会社 | 物理量センサー、電子機器および移動体 |
JP6413462B2 (ja) * | 2014-08-15 | 2018-10-31 | セイコーエプソン株式会社 | 物理量センサー、物理量センサー装置、電子機器および移動体 |
JP6279464B2 (ja) * | 2014-12-26 | 2018-02-14 | 株式会社東芝 | センサおよびその製造方法 |
CN105158582B (zh) * | 2015-09-29 | 2018-03-09 | 北京工业大学 | 一种变间距叉指型相邻电容传感器 |
CN107045951A (zh) * | 2016-02-04 | 2017-08-15 | 中国电力科学研究院 | 一种片式电容器元件的电容量测量方法 |
JP2018179575A (ja) * | 2017-04-05 | 2018-11-15 | セイコーエプソン株式会社 | 物理量センサー、電子機器、および移動体 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000028634A (ja) * | 1998-07-07 | 2000-01-28 | Denso Corp | 容量式物理量検出装置 |
JP2003166999A (ja) * | 2001-12-03 | 2003-06-13 | Denso Corp | 半導体力学量センサ |
JP2005083972A (ja) * | 2003-09-10 | 2005-03-31 | Matsushita Electric Works Ltd | 静電容量式センサおよびその製造方法 |
EP1626283A1 (en) * | 2004-08-13 | 2006-02-15 | STMicroelectronics S.r.l. | Micro-electromechanical structure, in particular accelerometer, with improved insensitivity to thermomechanical stresses |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002071708A (ja) | 2000-08-29 | 2002-03-12 | Denso Corp | 半導体力学量センサ |
JP2002131331A (ja) | 2000-10-24 | 2002-05-09 | Denso Corp | 半導体力学量センサ |
JP4174979B2 (ja) | 2001-07-13 | 2008-11-05 | 松下電工株式会社 | 加速度センサ |
JP3969228B2 (ja) | 2002-07-19 | 2007-09-05 | 松下電工株式会社 | 機械的変形量検出センサ及びそれを用いた加速度センサ、圧力センサ |
EP1491901A1 (en) | 2003-06-25 | 2004-12-29 | Matsushita Electric Works, Ltd. | Semiconductor acceleration sensor and method of manufacturing the same |
JP2005098891A (ja) | 2003-09-25 | 2005-04-14 | Matsushita Electric Works Ltd | 静電容量式センサ |
KR100513346B1 (ko) * | 2003-12-20 | 2005-09-07 | 삼성전기주식회사 | 보정전극을 갖는 정전용량형 가속도계 |
-
2006
- 2006-03-28 JP JP2006089122A patent/JP4595862B2/ja active Active
-
2007
- 2007-03-21 DE DE602007003126T patent/DE602007003126D1/de active Active
- 2007-03-21 EP EP07005835A patent/EP1840581B1/en not_active Expired - Fee Related
- 2007-03-22 TW TW096109964A patent/TWI324687B/zh not_active IP Right Cessation
- 2007-03-22 US US11/689,663 patent/US7554340B2/en active Active
- 2007-03-22 KR KR1020070028216A patent/KR100871217B1/ko not_active IP Right Cessation
- 2007-03-28 CN CNB2007100914012A patent/CN100568001C/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000028634A (ja) * | 1998-07-07 | 2000-01-28 | Denso Corp | 容量式物理量検出装置 |
JP2003166999A (ja) * | 2001-12-03 | 2003-06-13 | Denso Corp | 半導体力学量センサ |
JP2005083972A (ja) * | 2003-09-10 | 2005-03-31 | Matsushita Electric Works Ltd | 静電容量式センサおよびその製造方法 |
EP1626283A1 (en) * | 2004-08-13 | 2006-02-15 | STMicroelectronics S.r.l. | Micro-electromechanical structure, in particular accelerometer, with improved insensitivity to thermomechanical stresses |
Also Published As
Publication number | Publication date |
---|---|
KR100871217B1 (ko) | 2008-12-01 |
EP1840581A1 (en) | 2007-10-03 |
CN100568001C (zh) | 2009-12-09 |
JP2007263741A (ja) | 2007-10-11 |
KR20070097321A (ko) | 2007-10-04 |
US7554340B2 (en) | 2009-06-30 |
TW200801519A (en) | 2008-01-01 |
DE602007003126D1 (de) | 2009-12-24 |
TWI324687B (en) | 2010-05-11 |
CN101046491A (zh) | 2007-10-03 |
EP1840581B1 (en) | 2009-11-11 |
US20070273393A1 (en) | 2007-11-29 |
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