DE60138930D1 - Mikroherstellungsverfahren für organische optische Bauteile - Google Patents
Mikroherstellungsverfahren für organische optische BauteileInfo
- Publication number
- DE60138930D1 DE60138930D1 DE60138930T DE60138930T DE60138930D1 DE 60138930 D1 DE60138930 D1 DE 60138930D1 DE 60138930 T DE60138930 T DE 60138930T DE 60138930 T DE60138930 T DE 60138930T DE 60138930 D1 DE60138930 D1 DE 60138930D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing process
- optical components
- organic optical
- micro manufacturing
- photodefinable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/188—Processes of additive manufacturing involving additional operations performed on the added layers, e.g. smoothing, grinding or thickness control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
- G03C1/00—Photosensitive materials
- G03C1/72—Photosensitive compositions not covered by the groups G03C1/005 - G03C1/705
- G03C1/73—Photosensitive compositions not covered by the groups G03C1/005 - G03C1/705 containing organic compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
- B29C64/129—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
- B29C64/135—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask the energy source being concentrated, e.g. scanning lasers or focused light sources
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/02—Simple or compound lenses with non-spherical faces
- G02B3/06—Simple or compound lenses with non-spherical faces with cylindrical or toric faces
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0387—Polyamides or polyimides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2011/00—Optical elements, e.g. lenses, prisms
- B29L2011/0075—Light guides, optical cables
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US21170100P | 2000-06-15 | 2000-06-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60138930D1 true DE60138930D1 (de) | 2009-07-16 |
Family
ID=22787995
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60138930T Expired - Lifetime DE60138930D1 (de) | 2000-06-15 | 2001-06-14 | Mikroherstellungsverfahren für organische optische Bauteile |
DE60114820T Expired - Lifetime DE60114820T2 (de) | 2000-06-15 | 2001-06-14 | Mikroherstellungsverfahren für organische optische bauteile |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60114820T Expired - Lifetime DE60114820T2 (de) | 2000-06-15 | 2001-06-14 | Mikroherstellungsverfahren für organische optische bauteile |
Country Status (8)
Country | Link |
---|---|
US (1) | US6855478B2 (de) |
EP (1) | EP1292852B1 (de) |
JP (1) | JP4965052B2 (de) |
KR (1) | KR100810546B1 (de) |
AT (2) | ATE309553T1 (de) |
AU (1) | AU2001266905A1 (de) |
DE (2) | DE60138930D1 (de) |
WO (1) | WO2001096915A2 (de) |
Families Citing this family (80)
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US7005229B2 (en) | 2002-10-02 | 2006-02-28 | 3M Innovative Properties Company | Multiphoton photosensitization method |
EP1295181A2 (de) * | 2000-06-15 | 2003-03-26 | 3M Innovative Properties Company | Methode zur erzeugung oder hinzufügung von mikrostrukturen mittels multiphotonpolymerisation |
EP1292862B1 (de) * | 2000-06-15 | 2009-08-19 | 3M Innovative Properties Company | Methode und gerät zur erzielung wiederholter multiphotonabsorption |
AU2001268465A1 (en) * | 2000-06-15 | 2001-12-24 | 3M Innovative Properties Company | Multiphoton curing to provide encapsulated optical elements |
AU2001266918A1 (en) * | 2000-06-15 | 2001-12-24 | 3M Innovative Properties Company | Multidirectional photoreactive absorption method |
US7118845B2 (en) | 2000-06-15 | 2006-10-10 | 3M Innovative Properties Company | Multiphoton photochemical process and articles preparable thereby |
US7265161B2 (en) | 2002-10-02 | 2007-09-04 | 3M Innovative Properties Company | Multi-photon reactive compositions with inorganic particles and method for fabricating structures |
US7381516B2 (en) | 2002-10-02 | 2008-06-03 | 3M Innovative Properties Company | Multiphoton photosensitization system |
JP2002316363A (ja) * | 2001-02-16 | 2002-10-29 | Fuji Photo Film Co Ltd | 光造形装置及び露光ユニット |
JP4284889B2 (ja) * | 2001-05-28 | 2009-06-24 | パナソニック電工株式会社 | 光導波路、光配線板、電気・光混載回路基板及び光導波路の製造方法 |
US20040012872A1 (en) * | 2001-06-14 | 2004-01-22 | Fleming Patrick R | Multiphoton absorption method using patterned light |
US6750266B2 (en) | 2001-12-28 | 2004-06-15 | 3M Innovative Properties Company | Multiphoton photosensitization system |
US7237893B2 (en) * | 2001-12-28 | 2007-07-03 | Chang Shiao H | Light adjustable lenses capable of post-fabrication power modification via multi-photon processes |
DE10252563A1 (de) * | 2002-06-27 | 2004-01-29 | Atotech Deutschland Gmbh | Verfahren zur Herstellung von integrierten Wellenleitern, Polymersysteme zur Herstellung solcher Wellenleiter sowie Verfahren zur Erzeugung von planaren Wellenleiterkanälen |
US7235195B2 (en) | 2002-09-06 | 2007-06-26 | Novartis Ag | Method for making opthalmic devices |
AU2002951841A0 (en) * | 2002-09-30 | 2002-10-24 | Swinburne University Of Technology | Apparatus |
US7232650B2 (en) | 2002-10-02 | 2007-06-19 | 3M Innovative Properties Company | Planar inorganic device |
JP4814522B2 (ja) * | 2002-10-16 | 2011-11-16 | ジョージア・テック・リサーチ・コーポレーション | ポリマーの使用方法 |
JP3987787B2 (ja) * | 2002-11-25 | 2007-10-10 | 日東電工株式会社 | 三次元ポリイミド光導波路の製造方法 |
US20030155667A1 (en) * | 2002-12-12 | 2003-08-21 | Devoe Robert J | Method for making or adding structures to an article |
FR2859543B1 (fr) * | 2003-09-08 | 2005-12-09 | Pascal Joffre | Systeme de fabrication d'un objet a trois dimensions dans un materiau photo polymerisable |
JP2005092177A (ja) * | 2003-09-12 | 2005-04-07 | Rohm & Haas Electronic Materials Llc | 光学部品形成方法 |
US20050124712A1 (en) * | 2003-12-05 | 2005-06-09 | 3M Innovative Properties Company | Process for producing photonic crystals |
EP1723455B1 (de) * | 2003-12-05 | 2009-08-12 | 3M Innovative Properties Company | Prozess zur herstellung von photonischen kristallen |
AT413891B (de) | 2003-12-29 | 2006-07-15 | Austria Tech & System Tech | Leiterplattenelement mit wenigstens einem licht-wellenleiter sowie verfahren zur herstellung eines solchen leiterplattenelements |
US20060078802A1 (en) * | 2004-10-13 | 2006-04-13 | Chan Kwok P | Holographic storage medium |
ATE403708T1 (de) * | 2004-12-29 | 2008-08-15 | 3M Innovative Properties Co | Multiphoton-polymerisierbare vorkeramische polymerzusammensetzungen |
US20060228386A1 (en) * | 2005-02-22 | 2006-10-12 | University Of Tennessee Research Foundation | Polymeric microstructures |
US20090173889A1 (en) * | 2005-06-10 | 2009-07-09 | Santiago Costantino | Fluorescent photopolymerizable resins and uses thereof |
US9069256B2 (en) * | 2005-10-03 | 2015-06-30 | Carnegie Mellon University | Method of optical fabrication of three-dimensional polymeric structures with out of plane profile control |
US7799885B2 (en) | 2005-11-30 | 2010-09-21 | Corning Incorporated | Photo or electron beam curable compositions |
JP4880701B2 (ja) * | 2005-12-21 | 2012-02-22 | スリーエム イノベイティブ プロパティズ カンパニー | 多光子硬化反応性組成物を処理するための方法及び装置 |
US7583444B1 (en) * | 2005-12-21 | 2009-09-01 | 3M Innovative Properties Company | Process for making microlens arrays and masterforms |
KR100741110B1 (ko) * | 2006-02-15 | 2007-07-19 | 삼성에스디아이 주식회사 | 광 파이버 및 플라즈마 디스플레이 패널의 전극 형성 방법 |
US7728955B2 (en) * | 2006-03-21 | 2010-06-01 | Asml Netherlands B.V. | Lithographic apparatus, radiation supply and device manufacturing method |
WO2007112309A2 (en) * | 2006-03-24 | 2007-10-04 | 3M Innovative Properties Company | Process for making microneedles, microneedle arrays, masters, and replication tools |
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CN101448632B (zh) * | 2006-05-18 | 2012-12-12 | 3M创新有限公司 | 用于制备具有提取结构的光导的方法以及由此方法生产的光导 |
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US20080083886A1 (en) | 2006-09-14 | 2008-04-10 | 3M Innovative Properties Company | Optical system suitable for processing multiphoton curable photoreactive compositions |
CN101795838B (zh) | 2007-09-06 | 2014-02-12 | 3M创新有限公司 | 形成模具的方法以及使用所述模具形成制品的方法 |
US8322874B2 (en) | 2007-09-06 | 2012-12-04 | 3M Innovative Properties Company | Lightguides having light extraction structures providing regional control of light output |
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JP6377906B2 (ja) * | 2010-03-19 | 2018-08-22 | アヴェドロ・インコーポレーテッドAvedro,Inc. | 眼治療を適用およびモニターするためのシステム |
DE102010020158A1 (de) * | 2010-05-11 | 2011-11-17 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung sowie Verfahren zur Erzeugung dreidimensionaler Strukturen |
DE202011111072U1 (de) * | 2011-02-25 | 2019-03-27 | Nanoscribe Gmbh | Vorrichtung zum ortsaufgelösten Einbringen eines Intensitätsmusters aus elektromagnetischer Strahlung in eine photosensitive Substanz |
US20140030655A1 (en) | 2011-04-22 | 2014-01-30 | 3M Innovative Properties Company | Enhanced Multi-Photon Imaging Resolution Method |
DE102011050894A1 (de) * | 2011-06-07 | 2012-12-13 | Freie Universität Berlin | Verfahren zur Polymerisierung von Monomer- und/oder Oligomereinheiten durch Infrarotlichtimpulse |
US9104100B2 (en) | 2011-06-08 | 2015-08-11 | 3M Innovative Properties Company | Photoresists containing polymer-tethered nanoparticles |
US8903205B2 (en) | 2012-02-23 | 2014-12-02 | Karlsruhe Institute of Technology (KIT) | Three-dimensional freeform waveguides for chip-chip connections |
US9034222B2 (en) | 2012-02-23 | 2015-05-19 | Karlsruhe Institut Fuer Technologie | Method for producing photonic wire bonds |
DE102013005565A1 (de) * | 2013-03-28 | 2014-10-02 | Karlsruher Institut für Technologie | Herstellung von 3D-Freiform-Wellenleiterstrukturen |
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EP3089861B1 (de) | 2013-12-31 | 2020-01-22 | 3M Innovative Properties Company | Volumenbasierte gradientenindexlinse durch additive fertigung |
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EP3182184A1 (de) * | 2015-12-17 | 2017-06-21 | Universite De Haute Alsace | Verfahren zur herstellung eines selbstausgerichteten optischen leiters zwischen einer optischen quelle und einer optischen faser sowie zugehöriges kit |
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EP3635105A4 (de) | 2017-05-25 | 2021-03-31 | Prellis Biologics, Inc. | Dreidimensionale gedruckte organe, vorrichtungen und matrizen |
DE102017128824A1 (de) * | 2017-12-05 | 2019-06-06 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines strahlungsemittierenden Bauteils und strahlungsemittierendes Bauteil |
US11616302B2 (en) | 2018-01-15 | 2023-03-28 | Rogers Corporation | Dielectric resonator antenna having first and second dielectric portions |
US11552390B2 (en) | 2018-09-11 | 2023-01-10 | Rogers Corporation | Dielectric resonator antenna system |
TWI820237B (zh) | 2018-10-18 | 2023-11-01 | 美商羅傑斯公司 | 聚合物結構、其立體光刻製造方法以及包含該聚合物結構之電子裝置 |
US11637377B2 (en) | 2018-12-04 | 2023-04-25 | Rogers Corporation | Dielectric electromagnetic structure and method of making the same |
KR20220016812A (ko) | 2019-05-30 | 2022-02-10 | 로저스코포레이션 | 스테레오리소그래피용 광경화성 조성물, 조성물을 사용한 스테레오리소그래피 방법, 스테레오리소그래피 방법에 의해 형성된 폴리머 성분, 및 폴리머 성분을 포함하는 장치 |
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-
2001
- 2001-06-14 KR KR1020027017031A patent/KR100810546B1/ko not_active IP Right Cessation
- 2001-06-14 AT AT01944497T patent/ATE309553T1/de not_active IP Right Cessation
- 2001-06-14 US US10/297,957 patent/US6855478B2/en not_active Expired - Lifetime
- 2001-06-14 WO PCT/US2001/019038 patent/WO2001096915A2/en active IP Right Grant
- 2001-06-14 JP JP2002510984A patent/JP4965052B2/ja not_active Expired - Fee Related
- 2001-06-14 DE DE60138930T patent/DE60138930D1/de not_active Expired - Lifetime
- 2001-06-14 EP EP01944497A patent/EP1292852B1/de not_active Expired - Lifetime
- 2001-06-14 AU AU2001266905A patent/AU2001266905A1/en not_active Abandoned
- 2001-06-14 DE DE60114820T patent/DE60114820T2/de not_active Expired - Lifetime
- 2001-06-14 AT AT05020361T patent/ATE433129T1/de not_active IP Right Cessation
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AU2001266905A1 (en) | 2001-12-24 |
KR100810546B1 (ko) | 2008-03-18 |
US6855478B2 (en) | 2005-02-15 |
US20040126694A1 (en) | 2004-07-01 |
DE60114820D1 (de) | 2005-12-15 |
KR20030008219A (ko) | 2003-01-24 |
DE60114820T2 (de) | 2006-09-14 |
JP4965052B2 (ja) | 2012-07-04 |
EP1292852B1 (de) | 2005-11-09 |
EP1292852A2 (de) | 2003-03-19 |
ATE433129T1 (de) | 2009-06-15 |
ATE309553T1 (de) | 2005-11-15 |
WO2001096915A3 (en) | 2002-04-25 |
WO2001096915A2 (en) | 2001-12-20 |
JP2004503413A (ja) | 2004-02-05 |
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