DE60119468D1 - Bei Raumtemperatur härtbare Siliconzusammensetzungen - Google Patents

Bei Raumtemperatur härtbare Siliconzusammensetzungen

Info

Publication number
DE60119468D1
DE60119468D1 DE60119468T DE60119468T DE60119468D1 DE 60119468 D1 DE60119468 D1 DE 60119468D1 DE 60119468 T DE60119468 T DE 60119468T DE 60119468 T DE60119468 T DE 60119468T DE 60119468 D1 DE60119468 D1 DE 60119468D1
Authority
DE
Germany
Prior art keywords
room temperature
curable silicone
temperature curable
silicone compositions
compositions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60119468T
Other languages
English (en)
Other versions
DE60119468T2 (de
Inventor
Tsuneo Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of DE60119468D1 publication Critical patent/DE60119468D1/de
Application granted granted Critical
Publication of DE60119468T2 publication Critical patent/DE60119468T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S528/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S528/901—Room temperature curable silicon-containing polymer
DE60119468T 2000-10-12 2001-10-10 Bei Raumtemperatur härtbare Siliconzusammensetzungen Expired - Lifetime DE60119468T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000312022A JP3714402B2 (ja) 2000-10-12 2000-10-12 室温硬化性オルガノポリシロキサン組成物
JP2000312022 2000-10-12

Publications (2)

Publication Number Publication Date
DE60119468D1 true DE60119468D1 (de) 2006-06-14
DE60119468T2 DE60119468T2 (de) 2007-05-03

Family

ID=18791689

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60119468T Expired - Lifetime DE60119468T2 (de) 2000-10-12 2001-10-10 Bei Raumtemperatur härtbare Siliconzusammensetzungen

Country Status (4)

Country Link
US (2) US20020091220A1 (de)
EP (1) EP1197525B1 (de)
JP (1) JP3714402B2 (de)
DE (1) DE60119468T2 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4081278B2 (ja) * 2002-02-05 2008-04-23 株式会社スリーボンド 自動車用一液常温硬化型シール剤組成物
DE102004014216A1 (de) * 2004-03-23 2005-10-13 Wacker-Chemie Gmbh Vernetzbare Massen auf der Basis von Organosiliciumverbindungen
JP2006265485A (ja) * 2005-03-25 2006-10-05 Shin Etsu Chem Co Ltd 室温硬化性オルガノポリシロキサン組成物
WO2006117766A2 (en) * 2005-04-29 2006-11-09 Zerusa Limited An interventional medical closure device
JP4569765B2 (ja) * 2005-05-13 2010-10-27 信越化学工業株式会社 電気・電子部品保護用室温硬化型シリコーンゴム組成物、並びに実装回路板、銀電極及び銀チップ抵抗器
JP4743511B2 (ja) * 2005-12-27 2011-08-10 信越化学工業株式会社 熱硬化性オルガノポリシロキサン組成物の硬化方法
JP2007321122A (ja) * 2006-06-05 2007-12-13 Shin Etsu Chem Co Ltd 室温硬化性オルガノポリシロキサン組成物
WO2008152617A2 (en) * 2007-06-15 2008-12-18 Zerusa Limited A closure device
JP4984086B2 (ja) * 2008-05-14 2012-07-25 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物
DE102010042712A1 (de) * 2010-10-20 2012-04-26 Wacker Chemie Ag Selbsthaftende Härterzusammensetzung
JP6039894B2 (ja) 2011-10-20 2016-12-07 東レ・ダウコーニング株式会社 多成分型室温硬化性シリコーンエラストマー組成物
CN107109064A (zh) * 2015-01-21 2017-08-29 信越化学工业株式会社 室温固化性有机聚硅氧烷组合物
CN105349034B (zh) * 2015-11-30 2017-06-20 苏州太湖电工新材料股份有限公司 一种低粘度耐高温耐电晕环保绝缘漆及其制备方法
CN105348534B (zh) * 2015-11-30 2017-02-08 苏州太湖电工新材料股份有限公司 一种纳米二氧化硅杂化乙烯基苯基硅中物、其制备方法及应用
CN109642079B (zh) * 2016-08-26 2022-04-05 信越化学工业株式会社 脱醇型室温固化性有机聚硅氧烷组合物和用该组合物的固化物密封的物品

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1238093A (de) * 1969-04-11 1971-07-07
JPS6131461A (ja) * 1984-07-24 1986-02-13 Shin Etsu Chem Co Ltd 室温硬化性オルガノシロキサン組成物
JPS6165891A (ja) 1984-09-06 1986-04-04 Asahi Shiyueebell Kk 新規なシラン化合物およびその製造法
JPS6164753A (ja) 1984-09-06 1986-04-03 Shin Etsu Chem Co Ltd 室温硬化性オルガノシロキサン組成物
JPS62232459A (ja) * 1986-04-02 1987-10-12 Shin Etsu Chem Co Ltd 室温硬化性オルガノポリシロキサン組成物
JPH04359058A (ja) * 1991-06-03 1992-12-11 Shin Etsu Chem Co Ltd 室温硬化性オルガノポリシロキサン組成物の製造方法
JP2538152B2 (ja) * 1991-10-15 1996-09-25 信越化学工業株式会社 有機けい素化合物
US5300611A (en) * 1991-10-21 1994-04-05 Shin-Etsu Chemical Co., Ltd. Room temperature curable organopolysiloxane compositions
JP3349702B2 (ja) * 1994-01-21 2002-11-25 ジーイー東芝シリコーン株式会社 接着シール材及びその硬化方法
JP3295287B2 (ja) * 1995-10-26 2002-06-24 信越化学工業株式会社 オートマチックトランスミッションオイルシール用オルガノポリシロキサン組成物
JP3714861B2 (ja) * 2000-09-20 2005-11-09 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物
US6833407B1 (en) * 2003-10-16 2004-12-21 Csl Silicones Inc. Solvent free silicone coating composition

Also Published As

Publication number Publication date
US20040092694A1 (en) 2004-05-13
EP1197525A3 (de) 2003-03-12
EP1197525B1 (de) 2006-05-10
US7026426B2 (en) 2006-04-11
DE60119468T2 (de) 2007-05-03
EP1197525A2 (de) 2002-04-17
US20020091220A1 (en) 2002-07-11
JP3714402B2 (ja) 2005-11-09
JP2002121385A (ja) 2002-04-23

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Legal Events

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