US20020091220A1 - Room temperature curable organopolysiloxane compositions - Google Patents

Room temperature curable organopolysiloxane compositions Download PDF

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Publication number
US20020091220A1
US20020091220A1 US09/974,843 US97484301A US2002091220A1 US 20020091220 A1 US20020091220 A1 US 20020091220A1 US 97484301 A US97484301 A US 97484301A US 2002091220 A1 US2002091220 A1 US 2002091220A1
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Prior art keywords
parts
composition
radicals
hydrocarbon radical
carbon atoms
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Abandoned
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US09/974,843
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English (en)
Inventor
Tsuneo Kimura
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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Assigned to SHIN-ETSU CHEMICAL CO., LTD. reassignment SHIN-ETSU CHEMICAL CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIMURA, TSUNEO
Publication of US20020091220A1 publication Critical patent/US20020091220A1/en
Priority to US10/694,186 priority Critical patent/US7026426B2/en
Abandoned legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/544Silicon-containing compounds containing nitrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/045Polysiloxanes containing less than 25 silicon atoms
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S528/00Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S528/901Room temperature curable silicon-containing polymer

Definitions

  • This invention relates to room temperature curable organopolysiloxane compositions capable of maintaining improved adhesion upon exposure to hot steam and useful in bonding and securing of architectural parts and electrical and electronic parts.
  • RTV silicone rubber compositions which crosslink with moisture are used in a wide variety of applications including building sealants and adhesives for electrical and electronic parts.
  • silicone rubber which crosslinks with moisture is often employed due to heat resistance and adherence.
  • the silicone rubber as cured is required to have initial adherence and heat resistant adherence to the adherends, glass and coated steel plate and to maintain adherence even upon exposure to hot steam.
  • silane coupling agents in the form of silicon compounds is effective.
  • RTV silicone rubber compositions containing various conventional silane coupling agents such as aminopropyltriethoxysilane are good in initial adherence and heat resistant adherence, but fail to improve adherence upon exposure to hot steam.
  • U.S. Pat. No. 4,629,775 and JP-A 61-64753 disclose RTV silicone rubber compositions comprising as adhesive aids the reaction product of a mercaptosilane with an isocyanate or polyisocyanate compound. They are good in initial adherence, but insufficient in adherence upon exposure to hot steam.
  • An object of the invention is to provide a room temperature curable organopolysiloxane composition which can maintain adherence to glass even upon exposure to hot steam.
  • the present invention provides a room temperature curable organopolysiloxane composition
  • a room temperature curable organopolysiloxane composition comprising
  • R 1 is a substituted or unsubstituted monovalent hydrocarbon radical of 1 to 10 carbon atoms, and n is an integer of at least 10, and/or an organopolysiloxane of the following general formula (2):
  • R 1 and n are as defined above, R 2 is a substituted or unsubstituted monovalent hydrocarbon radical of 1 to 6 carbon atoms, and m is independently an integer of 0 or 1,
  • R 1 and R 2 are as defined above, R 3 is a divalent hydrocarbon radical of 1 to 10 carbon atoms, R 4 is a divalent aromatic ring-bearing hydrocarbon radical of 7 to 10 carbon atoms, and p is an integer of 1 to 3, at least one of the NH and NH 2 radicals being not directly attached to the aromatic ring in R 4 .
  • component (A) is an organopolysiloxane of the general formula (1) and/or (2).
  • R 1 stands for a substituted or unsubstituted monovalent hydrocarbon radical of 1 to 10 carbon atoms, for example, alkyl radicals such as methyl, ethyl and propyl, cycloalkyl radicals such as cyclohexyl, alkenyl radicals such as vinyl and allyl, aryl radicals such as phenyl and tolyl, and substituted ones of the foregoing radicals in which some of the hydrogen atoms attached to carbon atoms are replaced by halogen atoms or the like, such as 3,3,3-trifluoropropyl. Of these, methyl is preferred.
  • the plural R 1 radicals in formulae (1) and (2) may be the same or different.
  • n is an integer of at least 10, preferably such an integer that the diorganopolysiloxane may have a viscosity of about 25 to 500,000 centistokes at 25° C., especially about 500 to 100,000 centistokes at 25° C.
  • R 2 stands for a substituted or unsubstituted monovalent hydrocarbon radical of 1 to 6 carbon atoms, for example, alkyl radicals such as methyl, ethyl and propyl, cycloalkyl radicals such as cyclohexyl, alkenyl radicals such as vinyl, allyl and propenyl, and phenyl. Of these, methyl is preferred.
  • the letter m is 0 or 1 independently on the right or left side.
  • Component (B) is a silane compound having on the average at least two hydrolyzable radicals each attached to a silicon atom in a molecule, the remaining radicals attached to silicon atoms being selected from among methyl, ethyl, propyl, vinyl and phenyl, and/or a partial hydrolyzate thereof.
  • the silane compound generally has the formula:
  • R 5 is a radical selected from among methyl, ethyl, propyl, vinyl and phenyl
  • X is a hydrolyzable radical
  • a is 2 or 3.
  • the silane compound may be used alone or in admixture of two or more.
  • hydrolyzable radicals in the silane compound or partial hydrolyzates thereof include ketoxime, alkoxy, acetoxy and isopropenoxy radicals, with the ketoxime, alkoxy and isopropenoxy radicals being especially preferred.
  • Illustrative examples of the silane compound (B) include ketoximesilanes such as methyltris(dimethyl ketoxime)silane, methyltris(methyl ethyl ketoxime)silane, ethyltris(methyl ethyl ketoxime)silane, methyltris(methyl isobutyl ketoxime)silane, vinyltris(methyl ethyl ketoxime)silane, and phenyltris(methyl ethyl ketoxime)silane; as well as alkoxysilanes such as methyltrimethoxysilane, dimethyldimethoxysilane, vinyltrimethoxysilane, phenyltrimethoxysilane and methyltriethoxysilane; isopropenoxy radical-containing silanes such as methyltriisopropenoxysilane, ethyltriisopropenoxysilane and vinyltriisopropenoxysi
  • An appropriate amount of the silane compound or partial hydrolyzate thereof (B) used is 0.1 to 30 parts by weight, preferably 0.5 to 20 parts by weight, and more preferably 1 to 15 parts by weight per 100 parts by weight of the organopolysiloxane (A). Less than 0.1 part of component (B) induces insufficient crosslinking, failing to give a cured rubber having desired elasticity. More than 30 parts of component (B) tends to adversely affect mechanical properties of cured compositions.
  • the organosilicon compound (C) has a critical function of enhancing the adherence of the composition upon exposure to steam.
  • the organosilicon compound (C) should have an imino (NH) radical and an amino (NH 2 ) radical, and an aromatic ring between the NH and NH 2 radicals, such that at least one of the NH and NH 2 radicals is not directly attached to the aromatic ring.
  • This compound is described in detail in U.S. Pat. No. 5,231,207.
  • the organosilicon compound has the following general formula (3).
  • R 1 and R 2 are as defined above, R 3 is a divalent hydrocarbon radical of 1 to 10 carbon atoms, R 4 is a divalent aromatic ring-bearing hydrocarbon radical of 7 to 10 carbon atoms, and p is an integer of 1 to 3, at least one of the NH and NH 2 radicals being not directly attached to the aromatic ring in R 4 .
  • R 2 is preferably methyl or ethyl.
  • divalent hydrocarbon radical represented by R 3 include alkylene radicals such as methylene, ethylene, propylene, tetramethylene, hexamethylene, octamethylene, decamethylene, and 2-methylpropylene, arylene radicals such as phenylene, and combinations of alkylene and arylene radicals.
  • R 3 is methylene, ethylene or propylene, with the propylene being most preferred.
  • R 4 is preferably a combination of phenylene with alkylene. Preferred combinations for R 4 include the following structures (4) to (12).
  • the alkylene portion attached to the right side (NH 2 side in formula (3)) of the phenylene radical may be at the ortho, meta- or para-position of phenylene.
  • organosilicon compound of formula (3) is given below by formulae (13) through (123).
  • An appropriate amount of the organosilicon compound (C) used is 0.1 to 10 parts, and preferably 1 to 5 parts by weight per 100 parts by weight of the organopolysiloxane (A).
  • Exemplary fillers are silica including ground silica, fumed silica and wet silica, carbonaceous powders such as carbon black including acetylene black, calcium carbonate, zinc carbonate, basic zinc carbonate, zinc oxide and magnesium oxide. Among them, silica and carbon black are preferred. The silica is preferably surface treated.
  • the fillers are blended in amounts of 0 to about 500 parts, preferably about 2 to 200 parts, and more preferably about 3 to 100 parts by weight per 100 parts by weight of the organopolysiloxane (A).
  • Useful catalysts include well-known condensation reaction catalysts such as organic tin ester compounds, organic tin chelate compounds, alkoxytitanium compounds, titanium chelate compounds, and guanidyl radical-bearing silicon compounds.
  • the catalysts are used in catalytic amounts, usually up to about 10 parts, preferably 0.001 to 10 parts, and more preferably 0.01 to 5 parts by weight per 100 parts by weight of the organopolysiloxane (A).
  • additives for example, polyethers for improving thixotropy, pigments, anti-mildew agents, and anti-fungus agents.
  • composition of the invention may be prepared by mixing components (A) to (C) in a commonly used mixer such as a Shinagawa mixer, planetary mixer or flow jet mixer, preferably under anhydrous conditions.
  • a commonly used mixer such as a Shinagawa mixer, planetary mixer or flow jet mixer, preferably under anhydrous conditions.
  • Composition 1 was prepared by mixing 90 parts of a trimethoxysilyl end-blocked polydimethylsiloxane having a viscosity of 900 centistokes at 25° C. with 10 parts of fumed silica surface treated with dimethyldichlorosilane in a mixer. Then 2 parts of vinyltrimethoxysilane and 0.1 part of dioctyltin dilaurate were added to the mixture, which was thoroughly mixed under vacuum. Further, 2.0 parts of a silane compound of the formula:
  • Composition 2 was prepared by mixing 90 parts of a silanol end-blocked polydimethylsiloxane having a viscosity of 700 centistokes at 25° C. with 10 parts of acetylene black in a mixer. Then 6 parts of methyltributanoximesilane and 0.1 part of dibutyltin dioctate were added to the mixture, which was thoroughly mixed under vacuum. Further, 2.0 parts of a silane compound of the formula:
  • Composition 3 was prepared by mixing 90 parts of a silanol end-blocked polydimethylsiloxane having a viscosity of 700 centistokes at 25° C. with 10 parts of acetylene black in a mixer. Then 6 parts of vinyltriisopropenoxysilane and 0.5 part of tetramethylguanidylpropyltrimethoxysilane were added to the mixture, which was thoroughly mixed under vacuum. Further, 2.0 parts of a silane compound of the formula:
  • Composition 4 was prepared by mixing 90 parts of a silanol end-blocked polydimethylsiloxane having a viscosity of 700 centistokes at 25° C. with 10 parts of acetylene black in a mixer. Then 6 parts of vinyltriisopropenoxysilane and 0.5 part of tetramethylguanidylpropyltrimethoxysilane were added to the mixture, which was thoroughly mixed under vacuum. Further, 2.0 parts of a silane compound of the formula:
  • Composition 5 was prepared by mixing 90 parts of a silanol end-blocked polydimethylsiloxane having a viscosity of 700 centistokes at 25° C. with 10 parts of acetylene black in a mixer. Then 6 parts of vinyltriisopropenoxysilane and 0.5 part of tetramethylguanidylpropyltrimethoxysilane were added to the mixture, which was thoroughly mixed under vacuum. Further, 2.0 parts of a silane compound of the formula:
  • Composition 6 was prepared by mixing 90 parts of a silanol end-blocked polydimethylsiloxane having a viscosity of 700 centistokes at 25° C. with 10 parts of acetylene black in a mixer. Then 6 parts of vinyltriisopropenoxysilane and 0.5 part of tetramethylguanidylpropyltrimethoxysilane were added to the mixture, which was thoroughly mixed under vacuum. Further, 2.0 parts of a silane compound of the formula:
  • the room temperature curable organopolysiloxane composition of the invention cures into silicone rubber which can maintain adherence even upon exposure to hot steam.
  • the silicone rubber finds use as sealants used in wet areas and in the bonding and securing of electrical and electronic parts which are to be exposed to water vapor.
US09/974,843 2000-10-12 2001-10-12 Room temperature curable organopolysiloxane compositions Abandoned US20020091220A1 (en)

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JP2000312022A JP3714402B2 (ja) 2000-10-12 2000-10-12 室温硬化性オルガノポリシロキサン組成物
JP2000-312022 2000-10-12

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030162928A1 (en) * 2002-02-05 2003-08-28 Three Bond Co., Ltd. One-pack room temperature-curable sealant composition for automobile
US20060217498A1 (en) * 2005-03-25 2006-09-28 Shin-Etsu Chemical Co., Ltd. Room temperature curable organopolysiloxane composition
CN105348534A (zh) * 2015-11-30 2016-02-24 苏州太湖电工新材料股份有限公司 一种纳米二氧化硅杂化乙烯基苯基硅中物、其制备方法及应用
CN109642079A (zh) * 2016-08-26 2019-04-16 信越化学工业株式会社 脱醇型室温固化性有机聚硅氧烷组合物和用该组合物的固化物密封的物品

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DE102004014216A1 (de) * 2004-03-23 2005-10-13 Wacker-Chemie Gmbh Vernetzbare Massen auf der Basis von Organosiliciumverbindungen
EP1879505B1 (de) * 2005-04-29 2012-10-24 Vivasure Medical Limited Medizinische Interventionalverschlussvorrichtung
JP4569765B2 (ja) * 2005-05-13 2010-10-27 信越化学工業株式会社 電気・電子部品保護用室温硬化型シリコーンゴム組成物、並びに実装回路板、銀電極及び銀チップ抵抗器
JP4743511B2 (ja) * 2005-12-27 2011-08-10 信越化学工業株式会社 熱硬化性オルガノポリシロキサン組成物の硬化方法
JP2007321122A (ja) * 2006-06-05 2007-12-13 Shin Etsu Chem Co Ltd 室温硬化性オルガノポリシロキサン組成物
EP2166953B8 (de) * 2007-06-15 2018-11-07 Vivasure Medical Limited Verschlussvorrichtung
JP4984086B2 (ja) * 2008-05-14 2012-07-25 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物
DE102010042712A1 (de) * 2010-10-20 2012-04-26 Wacker Chemie Ag Selbsthaftende Härterzusammensetzung
JP6039894B2 (ja) 2011-10-20 2016-12-07 東レ・ダウコーニング株式会社 多成分型室温硬化性シリコーンエラストマー組成物
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CN105349034B (zh) * 2015-11-30 2017-06-20 苏州太湖电工新材料股份有限公司 一种低粘度耐高温耐电晕环保绝缘漆及其制备方法

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Publication number Priority date Publication date Assignee Title
US20030162928A1 (en) * 2002-02-05 2003-08-28 Three Bond Co., Ltd. One-pack room temperature-curable sealant composition for automobile
US6713546B2 (en) * 2002-02-05 2004-03-30 Three Bond Co., Ltd. One-pack room temperature-curable sealant composition for automobile
US20060217498A1 (en) * 2005-03-25 2006-09-28 Shin-Etsu Chemical Co., Ltd. Room temperature curable organopolysiloxane composition
US20090159203A1 (en) * 2005-03-25 2009-06-25 Shin-Etsu Chemical Co., Ltd. Room temperature curable organopolysiloxane composition
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CN109642079A (zh) * 2016-08-26 2019-04-16 信越化学工业株式会社 脱醇型室温固化性有机聚硅氧烷组合物和用该组合物的固化物密封的物品
US11401419B2 (en) * 2016-08-26 2022-08-02 Shin-Etsu Chemical Co., Ltd. Dealcoholization room-temperature curable organopolysiloxane composition, and article sealed by cured product of same

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EP1197525A2 (de) 2002-04-17
EP1197525A3 (de) 2003-03-12
DE60119468T2 (de) 2007-05-03
JP2002121385A (ja) 2002-04-23
US7026426B2 (en) 2006-04-11
EP1197525B1 (de) 2006-05-10
JP3714402B2 (ja) 2005-11-09
US20040092694A1 (en) 2004-05-13
DE60119468D1 (de) 2006-06-14

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