DE60213521D1 - Bei Raumtemperatur vernetzbare Organopolysiloxan-Zusammensetzungen - Google Patents

Bei Raumtemperatur vernetzbare Organopolysiloxan-Zusammensetzungen

Info

Publication number
DE60213521D1
DE60213521D1 DE60213521T DE60213521T DE60213521D1 DE 60213521 D1 DE60213521 D1 DE 60213521D1 DE 60213521 T DE60213521 T DE 60213521T DE 60213521 T DE60213521 T DE 60213521T DE 60213521 D1 DE60213521 D1 DE 60213521D1
Authority
DE
Germany
Prior art keywords
room temperature
organopolysiloxane compositions
crosslinkable organopolysiloxane
temperature crosslinkable
compositions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60213521T
Other languages
English (en)
Other versions
DE60213521T2 (de
Inventor
Jun Horikoshi
Tsuneo Kimura
Hironao Fujiki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of DE60213521D1 publication Critical patent/DE60213521D1/de
Application granted granted Critical
Publication of DE60213521T2 publication Critical patent/DE60213521T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01K—ANIMAL HUSBANDRY; CARE OF BIRDS, FISHES, INSECTS; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
    • A01K61/00—Culture of aquatic animals
    • A01K61/60—Floating cultivation devices, e.g. rafts or floating fish-farms
    • A01K61/65—Connecting or mooring devices therefor
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01K—ANIMAL HUSBANDRY; CARE OF BIRDS, FISHES, INSECTS; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
    • A01K61/00—Culture of aquatic animals
    • A01K61/50—Culture of aquatic animals of shellfish
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C08K5/5465—Silicon-containing compounds containing nitrogen containing at least one C=N bond
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S528/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S528/901—Room temperature curable silicon-containing polymer
DE60213521T 2001-06-28 2002-06-28 Bei Raumtemperatur vernetzbare Organopolysiloxan-Zusammensetzungen Expired - Lifetime DE60213521T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001196122 2001-06-28
JP2001196122A JP3748054B2 (ja) 2001-06-28 2001-06-28 室温硬化性オルガノポリシロキサン組成物

Publications (2)

Publication Number Publication Date
DE60213521D1 true DE60213521D1 (de) 2006-09-14
DE60213521T2 DE60213521T2 (de) 2007-08-09

Family

ID=19033988

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60213521T Expired - Lifetime DE60213521T2 (de) 2001-06-28 2002-06-28 Bei Raumtemperatur vernetzbare Organopolysiloxan-Zusammensetzungen

Country Status (6)

Country Link
US (1) US6740725B2 (de)
EP (1) EP1273618B1 (de)
JP (1) JP3748054B2 (de)
KR (1) KR100844253B1 (de)
DE (1) DE60213521T2 (de)
TW (1) TWI304823B (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4553110B2 (ja) * 2004-04-07 2010-09-29 信越化学工業株式会社 マグネシウム合金接着用オルガノポリシロキサン組成物
JP4910339B2 (ja) * 2005-01-07 2012-04-04 パナソニック株式会社 集塵装置および空調装置
JP4821958B2 (ja) * 2005-05-13 2011-11-24 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物
JP5062430B2 (ja) 2007-04-12 2012-10-31 信越化学工業株式会社 室温速硬化性オルガノポリシロキサン組成物及びその硬化方法
MX2009013613A (es) * 2007-06-11 2010-02-17 Henkel Corp Composiciones de rtv de proporcion baja y metodos para hacerlas.
JP5035555B2 (ja) 2008-04-09 2012-09-26 信越化学工業株式会社 室温硬化性フルオロポリエーテルゴム組成物及びその硬化物
JP2012131898A (ja) 2010-12-21 2012-07-12 Shin-Etsu Chemical Co Ltd 室温硬化性オルガノポリシロキサン組成物及びその製造方法並びに該組成物の硬化物で被覆された物品
CN102779926B (zh) * 2012-08-02 2015-01-28 慧明光电(深圳)有限公司 高对比度的防水表贴led灯
DE102013216787A1 (de) * 2013-08-23 2015-02-26 Evonik Degussa Gmbh Guanidingruppen aufweisende semi-organische Siliciumgruppen enthaltende Verbindungen
DE102013216777A1 (de) * 2013-08-23 2015-02-26 Evonik Industries Ag Bei Raumtemperatur härtbare Silikonharz-Zusammensetzungen
KR20160046854A (ko) * 2013-08-23 2016-04-29 모멘티브 퍼포먼스 머티리얼즈 인크. 수분 경화성 조성물
EP3154688B1 (de) * 2014-06-16 2021-08-11 Sika Technology AG Vernetzungskatalysator mit siloxan-struktureinheiten
JP6757306B2 (ja) * 2017-11-07 2020-09-16 双葉電子工業株式会社 乾燥剤、乾燥剤層、封止構造体及び有機ｅｌ素子
CN111386327B (zh) * 2017-12-25 2023-04-18 日华化学株式会社 防水剂组合物和防水性纤维制品的制造方法
JP7415466B2 (ja) 2019-11-14 2024-01-17 株式会社レゾナック 撥水処理剤、撥水構造体、及び撥水構造体の製造方法
WO2023068094A1 (ja) * 2021-10-19 2023-04-27 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物、接着剤、シール剤及びコーティング剤

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5411953A (en) * 1977-06-29 1979-01-29 Shin Etsu Chem Co Ltd Cold-curable organopolysiloxane composition
US4248993A (en) * 1977-06-29 1981-02-03 Shin-Etsu Chemical Co. Ltd. Room temperature curable organopolysiloxane
JPS5695923A (en) * 1979-11-30 1981-08-03 Shin Etsu Chem Co Ltd Cold curing organopolysloxane composition
JPS61209266A (ja) * 1985-03-13 1986-09-17 Shin Etsu Chem Co Ltd 室温硬化性オルガノポリシロキサン組成物
JPS62223264A (ja) * 1986-03-25 1987-10-01 Shin Etsu Chem Co Ltd 室温硬化性オルガノポリシロキサン組成物
JPH01165663A (ja) * 1987-12-21 1989-06-29 Shin Etsu Chem Co Ltd 室温硬化性組成物
JPH0686572B2 (ja) * 1989-01-27 1994-11-02 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物

Also Published As

Publication number Publication date
TWI304823B (en) 2009-01-01
EP1273618A1 (de) 2003-01-08
EP1273618B1 (de) 2006-08-02
KR100844253B1 (ko) 2008-07-07
JP3748054B2 (ja) 2006-02-22
JP2003012927A (ja) 2003-01-15
US6740725B2 (en) 2004-05-25
KR20030003026A (ko) 2003-01-09
DE60213521T2 (de) 2007-08-09
US20030083455A1 (en) 2003-05-01

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