DE60307169D1 - Bei Raumtemperatur vernetzbare Organopolysiloxan-Zusammensetzungen - Google Patents

Bei Raumtemperatur vernetzbare Organopolysiloxan-Zusammensetzungen

Info

Publication number
DE60307169D1
DE60307169D1 DE60307169T DE60307169T DE60307169D1 DE 60307169 D1 DE60307169 D1 DE 60307169D1 DE 60307169 T DE60307169 T DE 60307169T DE 60307169 T DE60307169 T DE 60307169T DE 60307169 D1 DE60307169 D1 DE 60307169D1
Authority
DE
Germany
Prior art keywords
room temperature
organopolysiloxane compositions
crosslinkable organopolysiloxane
temperature crosslinkable
compositions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60307169T
Other languages
English (en)
Other versions
DE60307169T2 (de
Inventor
Takafumi Sakamoto
Tsuneo Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of DE60307169D1 publication Critical patent/DE60307169D1/de
Application granted granted Critical
Publication of DE60307169T2 publication Critical patent/DE60307169T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
DE60307169T 2002-05-09 2003-05-09 Bei Raumtemperatur vernetzbare Organopolysiloxan-Zusammensetzungen Expired - Lifetime DE60307169T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002134101A JP3900267B2 (ja) 2002-05-09 2002-05-09 室温硬化性オルガノポリシロキサン組成物
JP2002134101 2002-05-09

Publications (2)

Publication Number Publication Date
DE60307169D1 true DE60307169D1 (de) 2006-09-14
DE60307169T2 DE60307169T2 (de) 2007-07-05

Family

ID=29244173

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60307169T Expired - Lifetime DE60307169T2 (de) 2002-05-09 2003-05-09 Bei Raumtemperatur vernetzbare Organopolysiloxan-Zusammensetzungen

Country Status (4)

Country Link
US (1) US6784241B2 (de)
EP (1) EP1361254B1 (de)
JP (1) JP3900267B2 (de)
DE (1) DE60307169T2 (de)

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JP4780976B2 (ja) * 2004-03-05 2011-09-28 信越化学工業株式会社 フルオロポリエーテル系接着剤組成物
JP4569765B2 (ja) * 2005-05-13 2010-10-27 信越化学工業株式会社 電気・電子部品保護用室温硬化型シリコーンゴム組成物、並びに実装回路板、銀電極及び銀チップ抵抗器
JP4811562B2 (ja) 2005-05-13 2011-11-09 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物
US7527838B2 (en) * 2006-04-06 2009-05-05 Momentive Performance Materials Inc. Architectural unit possessing translucent silicone rubber component
DE102006033236A1 (de) * 2006-07-18 2008-01-24 Wacker Chemie Ag Zusammensetzung auf der Basis von Organosiliciumverbindungen
US7993754B2 (en) * 2007-03-27 2011-08-09 Momentive Performance Materials Inc. Architectural unit possessing rapid deep-section cure silicone rubber component
JP5894911B2 (ja) * 2009-03-31 2016-03-30 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 分岐オルガノポリシロキサン
US8889801B2 (en) * 2009-10-28 2014-11-18 Momentive Performance Materials, Inc. Surface protective coating and methods of use thereof
CN102712811B (zh) * 2010-01-18 2014-08-13 日本实行株式会社 硅树脂组合物以及使用硅树脂组合物的保护覆盖方法
CN105829449B (zh) * 2013-12-17 2019-07-05 信越化学工业株式会社 多成分系室温固化性有机聚硅氧烷组合物和该组合物的固化物以及包括该固化物的成型物
EP2886584A1 (de) * 2013-12-19 2015-06-24 Sika Technology AG Kondensationsvernetzende Silikone mit verbesserter Temperaturstabilität
JP6574771B2 (ja) * 2013-12-27 2019-09-11 ダウ・東レ株式会社 室温硬化性シリコーンゴム組成物、その用途、および電子機器の補修方法
JP6490367B2 (ja) * 2014-09-05 2019-03-27 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 室温硬化性ポリオルガノシロキサン組成物
JP6307465B2 (ja) * 2015-03-24 2018-04-04 信越化学工業株式会社 縮合硬化型シリコーン組成物および半導体装置
JP6704846B2 (ja) 2015-12-28 2020-06-03 住友化学株式会社 組成物
KR101864505B1 (ko) * 2016-11-21 2018-06-29 주식회사 케이씨씨 방열성이 우수한 실리콘 조성물
WO2022138627A1 (ja) 2020-12-21 2022-06-30 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 耐水性を有する接着性ポリオルガノシロキサン組成物

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JPS5543119A (en) 1978-09-20 1980-03-26 Sws Silicones Corp Titanium ester contained vulcanizable organopolysiloxane composition and its manufacture
JPS5695923A (en) * 1979-11-30 1981-08-03 Shin Etsu Chem Co Ltd Cold curing organopolysloxane composition
US4731411A (en) 1982-12-02 1988-03-15 General Electric Company Process for producing alkoxy-terminated polysiloxanes
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JP3712029B2 (ja) * 1998-01-29 2005-11-02 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物の製造方法
US6235832B1 (en) * 1998-12-21 2001-05-22 Dow Corning Corporation RTV silicone compositions with rapid development of green strength
JP2001302934A (ja) * 2000-04-20 2001-10-31 Dow Corning Asia Ltd 室温硬化性に優れた硬化性組成物
JP4171868B2 (ja) * 2001-08-31 2008-10-29 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物
JP3824071B2 (ja) * 2001-12-25 2006-09-20 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物

Also Published As

Publication number Publication date
EP1361254A1 (de) 2003-11-12
EP1361254B1 (de) 2006-08-02
JP2003327829A (ja) 2003-11-19
DE60307169T2 (de) 2007-07-05
US6784241B2 (en) 2004-08-31
US20030212197A1 (en) 2003-11-13
JP3900267B2 (ja) 2007-04-04

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