DE60117212T2 - Imidazol-PhosphorsäureSalze als Beschleuniger für die Härtung von einkomponentIgen Epoxidharzzusammensetzungen mit Dicyandiamid - Google Patents

Imidazol-PhosphorsäureSalze als Beschleuniger für die Härtung von einkomponentIgen Epoxidharzzusammensetzungen mit Dicyandiamid Download PDF

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Publication number
DE60117212T2
DE60117212T2 DE60117212T DE60117212T DE60117212T2 DE 60117212 T2 DE60117212 T2 DE 60117212T2 DE 60117212 T DE60117212 T DE 60117212T DE 60117212 T DE60117212 T DE 60117212T DE 60117212 T2 DE60117212 T2 DE 60117212T2
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DE
Germany
Prior art keywords
imidazole
epoxy composition
dicyandiamide
epoxy resin
composition according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60117212T
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German (de)
English (en)
Other versions
DE60117212D1 (de
Inventor
Dilipkumar Nandlal Wescosville Shah
William Edward Nesquehoning Starner
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Air Products and Chemicals Inc
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Air Products and Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Products and Chemicals Inc filed Critical Air Products and Chemicals Inc
Application granted granted Critical
Publication of DE60117212D1 publication Critical patent/DE60117212D1/de
Publication of DE60117212T2 publication Critical patent/DE60117212T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
    • C07D233/56—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D231/00—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings
    • C07D231/02—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings
    • C07D231/10—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members
    • C07D231/12—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to ring carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D249/00—Heterocyclic compounds containing five-membered rings having three nitrogen atoms as the only ring hetero atoms
    • C07D249/02—Heterocyclic compounds containing five-membered rings having three nitrogen atoms as the only ring hetero atoms not condensed with other rings
    • C07D249/08—1,2,4-Triazoles; Hydrogenated 1,2,4-triazoles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5093—Complexes of amines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
DE60117212T 2000-11-01 2001-10-30 Imidazol-PhosphorsäureSalze als Beschleuniger für die Härtung von einkomponentIgen Epoxidharzzusammensetzungen mit Dicyandiamid Expired - Lifetime DE60117212T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US703311 1996-08-26
US09/703,311 US6441064B1 (en) 2000-11-01 2000-11-01 Imidazole-phosphoric acid salts as accelerators for dicyandiamide in one-component epoxy compositions

Publications (2)

Publication Number Publication Date
DE60117212D1 DE60117212D1 (de) 2006-04-20
DE60117212T2 true DE60117212T2 (de) 2006-07-27

Family

ID=24824881

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60117212T Expired - Lifetime DE60117212T2 (de) 2000-11-01 2001-10-30 Imidazol-PhosphorsäureSalze als Beschleuniger für die Härtung von einkomponentIgen Epoxidharzzusammensetzungen mit Dicyandiamid

Country Status (6)

Country Link
US (1) US6441064B1 (https=)
EP (1) EP1203782B1 (https=)
JP (2) JP3509799B2 (https=)
CN (1) CN1258560C (https=)
AT (1) ATE317867T1 (https=)
DE (1) DE60117212T2 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060194064A1 (en) * 2002-03-01 2006-08-31 Xiao Allison Y Underfill encapsulant for wafer packaging and method for its application
JP4481011B2 (ja) 2002-03-05 2010-06-16 トランス テック ファーマ，インコーポレイテッド リガンドのｒａｇｅとの相互作用を阻害する単環式および二環式アゾール誘導体
EP1635823A1 (en) * 2003-05-20 2006-03-22 TransTech Pharma Inc. Rage antagonists as agents to reverse amyloidosis and diseases associated therewith
EP1646054A4 (en) * 2003-07-11 2010-05-19 Ube Industries ACIDS-BASE MIXTURE AND ION CONDUCTOR COMPOSED FROM SUCH A MIXTURE
WO2011025040A1 (ja) * 2009-08-31 2011-03-03 日本合成化学工業株式会社 エポキシ樹脂用硬化剤
ES2467923T3 (es) 2009-09-30 2014-06-13 Transtech Pharma, Llc Derivados de imidazol substituidos para el tratamiento de la enfermedad de Alzheimer
JP6030028B2 (ja) * 2013-07-11 2016-11-24 株式会社Adeka 新規化合物、熱硬化剤及びエポキシ樹脂組成物
US9546243B2 (en) * 2013-07-17 2017-01-17 Air Products And Chemicals, Inc. Amines and polymeric phenols and usage thereof as curing agents in one component epoxy resin compositions
JP6161464B2 (ja) * 2013-08-08 2017-07-12 株式会社Adeka 一液型硬化性樹脂組成物
CN109563240A (zh) 2016-08-15 2019-04-02 赢创德固赛有限公司 用于环氧树脂体系的具有咪唑盐添加剂的酸酐环氧固化剂
KR102439519B1 (ko) 2016-12-12 2022-09-05 에보니크 오퍼레이션즈 게엠베하 신규한 저온 무수물 에폭시 경화된 시스템
CN111032724B (zh) 2017-08-22 2022-04-29 盛势达技研株式会社 固化性组合物
DE102018121012A1 (de) * 2018-08-28 2020-03-05 Alzchem Trostberg Gmbh Verfahren zur Herstellung eines Druckgasbehälters
KR102197406B1 (ko) * 2019-12-05 2020-12-31 주식회사 제일화성 친환경 바이오매스 기반의 아이소소바이드 에폭시를 활용한 고체상 에폭시 수지의 제조 방법
KR102197405B1 (ko) * 2019-12-05 2020-12-31 주식회사 제일화성 친환경 바이오매스 기반의 아이소소바이드 에폭시 원료를 이용한 고체상 에폭시 수지의 제조 방법
CN116478344A (zh) * 2022-01-17 2023-07-25 万华化学集团股份有限公司 一种水性单组份环氧乳液及其制备方法
CN120988566B (zh) * 2025-10-27 2025-12-30 广东百慕新材料技术工程有限公司 一种薄涂水性石墨烯改性苯氧浸涂涂料及其制备方法与应用
CN121379466B (zh) * 2025-12-24 2026-04-17 厦门优佰电子材料有限公司 一种ar/vr眼镜用耐溶剂型防水密封胶及其制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3356645A (en) * 1964-04-20 1967-12-05 Shell Oil Co Process for curing epoxy resins with a salt of an imidazole and compositions thereof
NL130329C (https=) 1964-04-20
US3329652A (en) 1965-02-15 1967-07-04 Shell Oil Co Process for curing polyepoxides with anhydrides and activators therefor
US3632427A (en) 1970-05-15 1972-01-04 Air Prod & Chem Epoxy resin and imidazole alkyl acid phosphate fiber treatment
US3631150A (en) 1970-05-20 1971-12-28 Dexter Corp Synergistic composition for curing polyepoxides comprising an imidazole compound and dicyandiamide
US3755253A (en) 1971-09-24 1973-08-28 Shell Oil Co Catalization of diaminodiphenylsulfone cure of polyepoxides with an imidazole compound or a salt thereof
JPS5883023A (ja) 1981-11-11 1983-05-18 Taoka Chem Co Ltd 硬化性組成物
JPS5920371A (ja) 1982-07-27 1984-02-02 Toyo Ink Mfg Co Ltd 導電性接着剤
DE3624177A1 (de) 1986-07-17 1988-01-21 Huels Chemische Werke Ag Pulverlacke, deren herstellung und verwendung
JPH0253777A (ja) 1988-08-18 1990-02-22 Shikoku Chem Corp １−ベンジルイミダゾール化合物の合成方法
WO1994014866A1 (en) 1992-12-21 1994-07-07 Alliedsignal, Inc. Solvent free epoxy resin compositions
US5508328A (en) * 1994-11-17 1996-04-16 Alliedsignal Inc. Curing epoxy resins using dicy, imidazole and acid

Also Published As

Publication number Publication date
CN1351092A (zh) 2002-05-29
JP2002161127A (ja) 2002-06-04
EP1203782A1 (en) 2002-05-08
JP2004010618A (ja) 2004-01-15
EP1203782B1 (en) 2006-02-15
JP3509799B2 (ja) 2004-03-22
ATE317867T1 (de) 2006-03-15
CN1258560C (zh) 2006-06-07
DE60117212D1 (de) 2006-04-20
US6441064B1 (en) 2002-08-27

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