DE60117212D1 - Imidazol-Phosphorsäure-Salze als Beschleuniger für die Härtung von einkomponentigen Epoxidharzzusammensetzungen mit Dicyandiamid - Google Patents

Imidazol-Phosphorsäure-Salze als Beschleuniger für die Härtung von einkomponentigen Epoxidharzzusammensetzungen mit Dicyandiamid

Info

Publication number
DE60117212D1
DE60117212D1 DE60117212T DE60117212T DE60117212D1 DE 60117212 D1 DE60117212 D1 DE 60117212D1 DE 60117212 T DE60117212 T DE 60117212T DE 60117212 T DE60117212 T DE 60117212T DE 60117212 D1 DE60117212 D1 DE 60117212D1
Authority
DE
Germany
Prior art keywords
dicyandiamide
epoxy resin
imidazole
accelerators
curing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60117212T
Other languages
English (en)
Other versions
DE60117212T2 (de
Inventor
Dilipkumar Nandlal Shah
William Edward Starner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Air Products and Chemicals Inc
Original Assignee
Air Products and Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Products and Chemicals Inc filed Critical Air Products and Chemicals Inc
Application granted granted Critical
Publication of DE60117212D1 publication Critical patent/DE60117212D1/de
Publication of DE60117212T2 publication Critical patent/DE60117212T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
    • C07D233/56—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D231/00—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings
    • C07D231/02—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings
    • C07D231/10—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members
    • C07D231/12—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to ring carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D249/00—Heterocyclic compounds containing five-membered rings having three nitrogen atoms as the only ring hetero atoms
    • C07D249/02—Heterocyclic compounds containing five-membered rings having three nitrogen atoms as the only ring hetero atoms not condensed with other rings
    • C07D249/08—1,2,4-Triazoles; Hydrogenated 1,2,4-triazoles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5093—Complexes of amines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
DE60117212T 2000-11-01 2001-10-30 Imidazol-PhosphorsäureSalze als Beschleuniger für die Härtung von einkomponentIgen Epoxidharzzusammensetzungen mit Dicyandiamid Expired - Lifetime DE60117212T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US703311 1996-08-26
US09/703,311 US6441064B1 (en) 2000-11-01 2000-11-01 Imidazole-phosphoric acid salts as accelerators for dicyandiamide in one-component epoxy compositions

Publications (2)

Publication Number Publication Date
DE60117212D1 true DE60117212D1 (de) 2006-04-20
DE60117212T2 DE60117212T2 (de) 2006-07-27

Family

ID=24824881

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60117212T Expired - Lifetime DE60117212T2 (de) 2000-11-01 2001-10-30 Imidazol-PhosphorsäureSalze als Beschleuniger für die Härtung von einkomponentIgen Epoxidharzzusammensetzungen mit Dicyandiamid

Country Status (6)

Country Link
US (1) US6441064B1 (de)
EP (1) EP1203782B1 (de)
JP (2) JP3509799B2 (de)
CN (1) CN1258560C (de)
AT (1) ATE317867T1 (de)
DE (1) DE60117212T2 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060194064A1 (en) * 2002-03-01 2006-08-31 Xiao Allison Y Underfill encapsulant for wafer packaging and method for its application
CN100525763C (zh) * 2002-03-05 2009-08-12 特兰斯泰克制药公司 抑制配体与高级糖化终产物受体相互作用的单和双环吡咯衍生物
CN1805743A (zh) * 2003-05-20 2006-07-19 特兰斯泰克制药公司 用作逆转淀粉样变性及其他与之相关疾病的rage拮抗剂
EP1646054A4 (de) * 2003-07-11 2010-05-19 Ube Industries Säuren-basen-mischung und aus einer solchen mischung zusammengesetzter ionenleiter
WO2011025040A1 (ja) * 2009-08-31 2011-03-03 日本合成化学工業株式会社 エポキシ樹脂用硬化剤
WO2011041198A1 (en) 2009-09-30 2011-04-07 Transtech Pharma, Inc. Substituted imidazole derivatives for treatment of alzheimers disease
JP6030028B2 (ja) * 2013-07-11 2016-11-24 株式会社Adeka 新規化合物、熱硬化剤及びエポキシ樹脂組成物
US9546243B2 (en) * 2013-07-17 2017-01-17 Air Products And Chemicals, Inc. Amines and polymeric phenols and usage thereof as curing agents in one component epoxy resin compositions
JP6161464B2 (ja) * 2013-08-08 2017-07-12 株式会社Adeka 一液型硬化性樹脂組成物
EP3497147A1 (de) 2016-08-15 2019-06-19 Evonik Degussa GmbH Anhydridepoxidhärter mit imidazolsalzadditiven für epoxidharzsysteme
CN110062783A (zh) 2016-12-12 2019-07-26 赢创德固赛有限公司 新的低温酸酐环氧固化体系
CN111032724B (zh) 2017-08-22 2022-04-29 盛势达技研株式会社 固化性组合物
DE102018121012A1 (de) * 2018-08-28 2020-03-05 Alzchem Trostberg Gmbh Verfahren zur Herstellung eines Druckgasbehälters
KR102197406B1 (ko) * 2019-12-05 2020-12-31 주식회사 제일화성 친환경 바이오매스 기반의 아이소소바이드 에폭시를 활용한 고체상 에폭시 수지의 제조 방법
KR102197405B1 (ko) * 2019-12-05 2020-12-31 주식회사 제일화성 친환경 바이오매스 기반의 아이소소바이드 에폭시 원료를 이용한 고체상 에폭시 수지의 제조 방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL130329C (de) 1964-04-20
US3356645A (en) * 1964-04-20 1967-12-05 Shell Oil Co Process for curing epoxy resins with a salt of an imidazole and compositions thereof
US3329652A (en) 1965-02-15 1967-07-04 Shell Oil Co Process for curing polyepoxides with anhydrides and activators therefor
US3632427A (en) 1970-05-15 1972-01-04 Air Prod & Chem Epoxy resin and imidazole alkyl acid phosphate fiber treatment
US3631150A (en) 1970-05-20 1971-12-28 Dexter Corp Synergistic composition for curing polyepoxides comprising an imidazole compound and dicyandiamide
US3755253A (en) 1971-09-24 1973-08-28 Shell Oil Co Catalization of diaminodiphenylsulfone cure of polyepoxides with an imidazole compound or a salt thereof
JPS5883023A (ja) 1981-11-11 1983-05-18 Taoka Chem Co Ltd 硬化性組成物
JPS5920371A (ja) 1982-07-27 1984-02-02 Toyo Ink Mfg Co Ltd 導電性接着剤
DE3624177A1 (de) 1986-07-17 1988-01-21 Huels Chemische Werke Ag Pulverlacke, deren herstellung und verwendung
JPH0253777A (ja) 1988-08-18 1990-02-22 Shikoku Chem Corp １−ベンジルイミダゾール化合物の合成方法
WO1994014866A1 (en) 1992-12-21 1994-07-07 Alliedsignal, Inc. Solvent free epoxy resin compositions
US5508328A (en) * 1994-11-17 1996-04-16 Alliedsignal Inc. Curing epoxy resins using dicy, imidazole and acid

Also Published As

Publication number Publication date
ATE317867T1 (de) 2006-03-15
JP2002161127A (ja) 2002-06-04
EP1203782B1 (de) 2006-02-15
DE60117212T2 (de) 2006-07-27
CN1258560C (zh) 2006-06-07
CN1351092A (zh) 2002-05-29
EP1203782A1 (de) 2002-05-08
JP2004010618A (ja) 2004-01-15
US6441064B1 (en) 2002-08-27
JP3509799B2 (ja) 2004-03-22

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