BR0304464A - Método para preparar um compósito ligado curado, e, composição útil como um adesivo quando curada pela radiação de feixe de elétrons - Google Patents
Método para preparar um compósito ligado curado, e, composição útil como um adesivo quando curada pela radiação de feixe de elétronsInfo
- Publication number
- BR0304464A BR0304464A BR0304464A BR0304464A BR0304464A BR 0304464 A BR0304464 A BR 0304464A BR 0304464 A BR0304464 A BR 0304464A BR 0304464 A BR0304464 A BR 0304464A BR 0304464 A BR0304464 A BR 0304464A
- Authority
- BR
- Brazil
- Prior art keywords
- cured
- beam radiation
- preparing
- electron beam
- adhesive
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
- C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
"MéTODO PARA PREPARAR UM COMPóSITO LIGADO CURADO, E, COMPOSIçãO úTIL COMO UM ADESIVO QUANDO CURADA PELA RADIAçãO DE FEIXE DE ELéTRONS". Um método é fornecido para ligar substratos usando uma composição pré-polimérica que é curada com radiação de feixe de elétrons. A composição pré-polimérica fornecida para ligar os substratos contém pelo menos uma resina de poliéster e pelo menos um composto polimerizável.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US41913802P | 2002-10-17 | 2002-10-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
BR0304464A true BR0304464A (pt) | 2004-08-31 |
Family
ID=32043451
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR0304464A BR0304464A (pt) | 2002-10-17 | 2003-10-08 | Método para preparar um compósito ligado curado, e, composição útil como um adesivo quando curada pela radiação de feixe de elétrons |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1411077A1 (pt) |
JP (1) | JP4022507B2 (pt) |
CN (1) | CN100572044C (pt) |
BR (1) | BR0304464A (pt) |
TW (1) | TW200415184A (pt) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1621333A1 (de) * | 2004-07-01 | 2006-02-01 | Alcan Technology & Management Ltd. | Verfahren zur Herstellung eines Verpackungsmaterials |
DE502004003284D1 (de) * | 2004-07-01 | 2007-05-03 | Alcan Tech & Man Ltd | Verfahren zur Herstellung eines Verpackungsmaterials |
CN103443215B (zh) * | 2011-04-05 | 2016-08-24 | 湛新比利时股份有限公司 | 可辐射固化组合物 |
EP2508575A1 (en) | 2011-04-05 | 2012-10-10 | Cytec Surface Specialties, S.A. | Radiation curable compositions |
EP2508574A1 (en) * | 2011-04-05 | 2012-10-10 | Cytec Surface Specialties, S.A. | Radiation curable compositions |
EP2644634A1 (en) | 2012-03-30 | 2013-10-02 | Cytec Surface Specialties, S.A. | Radiation curable (meth)acrylated compounds |
EP2921536A1 (en) | 2014-03-20 | 2015-09-23 | ALLNEX AUSTRIA GmbH | Radiation curable composition comprising inert resins |
EP3138886A1 (en) | 2015-09-02 | 2017-03-08 | Allnex Belgium S.A. | Method for gluing involving the use of a radiation curable adhesive composition comprising short fibers |
EP3184565A1 (en) | 2015-12-22 | 2017-06-28 | Allnex IP S.à.r.l. | Radiation-curable urethane (meth)acrylates with residual isocyanate groups |
CN111918935B (zh) | 2018-03-27 | 2023-09-05 | 湛新比利时股份有限公司 | 可辐射固化的组合物 |
CN108611039A (zh) * | 2018-05-17 | 2018-10-02 | 苏州中来光伏新材股份有限公司 | 一种电子束固化胶黏剂及其制备方法和涂覆方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1538211A (en) * | 1975-05-12 | 1979-01-10 | Ucb Sa | Halogenated photopolymerisable adhesives |
JPS578273A (en) * | 1980-06-19 | 1982-01-16 | Dainippon Printing Co Ltd | Adhesive composition for laminate |
JPS59105068A (ja) * | 1982-12-08 | 1984-06-18 | Dainippon Printing Co Ltd | 電子線硬化型ラミネ−ト用接着剤 |
EP0313071B1 (en) * | 1987-10-22 | 1993-04-21 | Nichiban Co. Ltd. | Reactive pressure sensitive adhesive composition, sealer tape, sheet or molding by use thereof |
US5182133A (en) * | 1988-04-30 | 1993-01-26 | Nichiban Company, Limited | Sealer material and method for applying the same |
-
2003
- 2003-09-17 EP EP20030255807 patent/EP1411077A1/en not_active Withdrawn
- 2003-10-03 TW TW92127468A patent/TW200415184A/zh unknown
- 2003-10-08 BR BR0304464A patent/BR0304464A/pt not_active Application Discontinuation
- 2003-10-15 JP JP2003355575A patent/JP4022507B2/ja not_active Expired - Fee Related
- 2003-10-16 CN CNB2003101012690A patent/CN100572044C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1496819A (zh) | 2004-05-19 |
EP1411077A1 (en) | 2004-04-21 |
CN100572044C (zh) | 2009-12-23 |
TW200415184A (en) | 2004-08-16 |
JP2004160988A (ja) | 2004-06-10 |
JP4022507B2 (ja) | 2007-12-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B07A | Technical examination (opinion): publication of technical examination (opinion) | ||
B09B | Decision: refusal | ||
B09B | Decision: refusal |
Free format text: MANTIDO O INDEFERIMENTO UMA VEZ QUE NAO FOI APRESENTADO RECURSO DENTRO DO PRAZO LEGAL. |