JPS578273A - Adhesive composition for laminate - Google Patents

Adhesive composition for laminate

Info

Publication number
JPS578273A
JPS578273A JP8308680A JP8308680A JPS578273A JP S578273 A JPS578273 A JP S578273A JP 8308680 A JP8308680 A JP 8308680A JP 8308680 A JP8308680 A JP 8308680A JP S578273 A JPS578273 A JP S578273A
Authority
JP
Japan
Prior art keywords
electron beam
adhesive composition
curing
contg
giving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8308680A
Other languages
Japanese (ja)
Inventor
Hirotaka Tsuchiya
Masahiro Shimoyamada
Sumiyuki Yamakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP8308680A priority Critical patent/JPS578273A/en
Publication of JPS578273A publication Critical patent/JPS578273A/en
Pending legal-status Critical Current

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

PURPOSE: The titled electron beam-curing composition capable of giving a bonding layer with excellent flexibility and adhesion, which comprises an ethylenically unsaturated bond-contg. compound and a linear saturated polyester resin.
CONSTITUTION: An electron beam-curing adhesive composition for a laminate comprising an ethylenically unsaturated bond-contg. compound such as a polyester (meth) acrylate and 5W60wt%, based on the total composition, linear saturated polyester resin such as one of MW 10,000W30,000, intrinsic viscosity 0.5W1.0 and ≤10°C glass trainsition temp. consisting of a terephthalic acid residue and a polyethylene glycol residue. The adhesive composition essentially contains no solvent and is capable of giving an odorless laminated film from the same or different kinds of films such as paper, plastic or metal, by completely curing by means of electron beam, which is extremely useful as a packaging material for foods, drugs. etc.
COPYRIGHT: (C)1982,JPO&Japio
JP8308680A 1980-06-19 1980-06-19 Adhesive composition for laminate Pending JPS578273A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8308680A JPS578273A (en) 1980-06-19 1980-06-19 Adhesive composition for laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8308680A JPS578273A (en) 1980-06-19 1980-06-19 Adhesive composition for laminate

Publications (1)

Publication Number Publication Date
JPS578273A true JPS578273A (en) 1982-01-16

Family

ID=13792363

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8308680A Pending JPS578273A (en) 1980-06-19 1980-06-19 Adhesive composition for laminate

Country Status (1)

Country Link
JP (1) JPS578273A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5986676A (en) * 1982-11-09 1984-05-18 Nippon Steel Corp Electron beam-curable adhesive composition for laminated metal sheet
JPS6254777A (en) * 1985-09-04 1987-03-10 Bando Chem Ind Ltd Pressure-sensitives adhesion composition and pressure-sensitive adhesive sheet
JPS6254776A (en) * 1985-09-04 1987-03-10 Bando Chem Ind Ltd Pressure-sensitive adhesion composition and pressure-sensitive adhesive sheet
JPS63284279A (en) * 1987-05-15 1988-11-21 Alpha Giken:Kk 2-cyanoacrylate adhesive composition
JPH0225786A (en) * 1988-07-14 1990-01-29 Nec Corp Speed detecting device
US5367125A (en) * 1989-01-20 1994-11-22 Dassault Electronique Aluminum based article having an insert with vitreous material hermetically sealed thereto
US5538527A (en) * 1989-01-20 1996-07-23 Dassault Electronique Method of sealing glass to aluminum, particularly for electrical feed-through connectors
WO2001018144A1 (en) * 1999-09-06 2001-03-15 Sekisui Chemical Co., Ltd. Photocurable pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet
EP1411077A1 (en) * 2002-10-17 2004-04-21 Rohm And Haas Company Method for preparing a bonded composite
US7323078B2 (en) 2003-10-15 2008-01-29 Rohm And Haas Company Method for preparing a bonded composite
JP2015189867A (en) * 2014-03-28 2015-11-02 Dic株式会社 Active energy ray-curable resin composition, cured product, adhesive and laminate film

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51138730A (en) * 1975-05-12 1976-11-30 Ucb Sa Photopolymerizable adhesive

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51138730A (en) * 1975-05-12 1976-11-30 Ucb Sa Photopolymerizable adhesive

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5986676A (en) * 1982-11-09 1984-05-18 Nippon Steel Corp Electron beam-curable adhesive composition for laminated metal sheet
JPS6254777A (en) * 1985-09-04 1987-03-10 Bando Chem Ind Ltd Pressure-sensitives adhesion composition and pressure-sensitive adhesive sheet
JPS6254776A (en) * 1985-09-04 1987-03-10 Bando Chem Ind Ltd Pressure-sensitive adhesion composition and pressure-sensitive adhesive sheet
JPS63284279A (en) * 1987-05-15 1988-11-21 Alpha Giken:Kk 2-cyanoacrylate adhesive composition
JPH0225786A (en) * 1988-07-14 1990-01-29 Nec Corp Speed detecting device
JPH083529B2 (en) * 1988-07-14 1996-01-17 日本電気株式会社 Speed detector
US5367125A (en) * 1989-01-20 1994-11-22 Dassault Electronique Aluminum based article having an insert with vitreous material hermetically sealed thereto
US5538527A (en) * 1989-01-20 1996-07-23 Dassault Electronique Method of sealing glass to aluminum, particularly for electrical feed-through connectors
WO2001018144A1 (en) * 1999-09-06 2001-03-15 Sekisui Chemical Co., Ltd. Photocurable pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet
EP1411077A1 (en) * 2002-10-17 2004-04-21 Rohm And Haas Company Method for preparing a bonded composite
US7323078B2 (en) 2003-10-15 2008-01-29 Rohm And Haas Company Method for preparing a bonded composite
JP2015189867A (en) * 2014-03-28 2015-11-02 Dic株式会社 Active energy ray-curable resin composition, cured product, adhesive and laminate film

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