DE60112675T2 - Elektrisch isolierendes Material und dessen Herstellungsverfahren - Google Patents
Elektrisch isolierendes Material und dessen Herstellungsverfahren Download PDFInfo
- Publication number
- DE60112675T2 DE60112675T2 DE60112675T DE60112675T DE60112675T2 DE 60112675 T2 DE60112675 T2 DE 60112675T2 DE 60112675 T DE60112675 T DE 60112675T DE 60112675 T DE60112675 T DE 60112675T DE 60112675 T2 DE60112675 T2 DE 60112675T2
- Authority
- DE
- Germany
- Prior art keywords
- particle size
- particles
- acid anhydride
- epoxy resin
- microns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000012777 electrically insulating material Substances 0.000 title claims description 27
- 238000004519 manufacturing process Methods 0.000 title description 8
- 239000002245 particle Substances 0.000 claims description 136
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 62
- 239000003822 epoxy resin Substances 0.000 claims description 51
- 229920000647 polyepoxide Polymers 0.000 claims description 51
- 229920001971 elastomer Polymers 0.000 claims description 46
- 239000005060 rubber Substances 0.000 claims description 46
- 229920005989 resin Polymers 0.000 claims description 41
- 239000011347 resin Substances 0.000 claims description 41
- 239000011159 matrix material Substances 0.000 claims description 29
- 229920001187 thermosetting polymer Polymers 0.000 claims description 27
- 239000003795 chemical substances by application Substances 0.000 claims description 26
- 150000008065 acid anhydrides Chemical class 0.000 claims description 25
- 239000000377 silicon dioxide Substances 0.000 claims description 22
- 239000010954 inorganic particle Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 16
- KNRCVAANTQNTPT-UHFFFAOYSA-N methyl-5-norbornene-2,3-dicarboxylic anhydride Chemical group O=C1OC(=O)C2C1C1(C)C=CC2C1 KNRCVAANTQNTPT-UHFFFAOYSA-N 0.000 claims description 12
- 238000002156 mixing Methods 0.000 claims description 12
- 230000009477 glass transition Effects 0.000 claims description 9
- KNDQHSIWLOJIGP-UHFFFAOYSA-N 826-62-0 Chemical compound C1C2C3C(=O)OC(=O)C3C1C=C2 KNDQHSIWLOJIGP-UHFFFAOYSA-N 0.000 claims description 7
- -1 acid anhydride Methyl-5-norbornene-2,3-dicarboxylic anhydride Chemical class 0.000 claims description 7
- 238000009826 distribution Methods 0.000 claims description 7
- KNDQHSIWLOJIGP-UMRXKNAASA-N (3ar,4s,7r,7as)-rel-3a,4,7,7a-tetrahydro-4,7-methanoisobenzofuran-1,3-dione Chemical compound O=C1OC(=O)[C@@H]2[C@H]1[C@]1([H])C=C[C@@]2([H])C1 KNDQHSIWLOJIGP-UMRXKNAASA-N 0.000 claims description 6
- 238000005266 casting Methods 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 6
- 238000005984 hydrogenation reaction Methods 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims description 2
- 239000000203 mixture Substances 0.000 description 27
- 239000011162 core material Substances 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 14
- 239000003989 dielectric material Substances 0.000 description 13
- 239000006185 dispersion Substances 0.000 description 10
- 239000011256 inorganic filler Substances 0.000 description 10
- 229910003475 inorganic filler Inorganic materials 0.000 description 10
- 239000004593 Epoxy Substances 0.000 description 7
- 229930185605 Bisphenol Natural products 0.000 description 6
- 229920000800 acrylic rubber Polymers 0.000 description 6
- 238000004220 aggregation Methods 0.000 description 6
- 230000002776 aggregation Effects 0.000 description 6
- 230000008901 benefit Effects 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 229920000058 polyacrylate Polymers 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 239000000945 filler Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 230000009467 reduction Effects 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 3
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000012778 molding material Substances 0.000 description 3
- 239000004848 polyfunctional curative Substances 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- LKAVYBZHOYOUSX-UHFFFAOYSA-N buta-1,3-diene;2-methylprop-2-enoic acid;styrene Chemical compound C=CC=C.CC(=C)C(O)=O.C=CC1=CC=CC=C1 LKAVYBZHOYOUSX-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 229920003145 methacrylic acid copolymer Polymers 0.000 description 2
- 229940117841 methacrylic acid copolymer Drugs 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 239000012766 organic filler Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 235000011089 carbon dioxide Nutrition 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000007385 chemical modification Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 230000006735 deficit Effects 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000004870 electrical engineering Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003733 fiber-reinforced composite Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000010125 resin casting Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000011856 silicon-based particle Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 230000001225 therapeutic effect Effects 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Insulating Materials (AREA)
- Epoxy Resins (AREA)
- Inorganic Insulating Materials (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000195584A JP4319332B2 (ja) | 2000-06-29 | 2000-06-29 | 電気絶縁材料およびその製造方法 |
| JP2000195584 | 2000-06-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE60112675D1 DE60112675D1 (de) | 2005-09-22 |
| DE60112675T2 true DE60112675T2 (de) | 2006-06-08 |
Family
ID=18694233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60112675T Expired - Lifetime DE60112675T2 (de) | 2000-06-29 | 2001-06-29 | Elektrisch isolierendes Material und dessen Herstellungsverfahren |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP1176171B1 (https=) |
| JP (1) | JP4319332B2 (https=) |
| DE (1) | DE60112675T2 (https=) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003026771A (ja) * | 2001-07-23 | 2003-01-29 | Fujitsu Ltd | エポキシ封止樹脂組成物 |
| JP4883264B2 (ja) * | 2005-07-26 | 2012-02-22 | 株式会社スリーボンド | 加熱硬化型一液性樹脂組成物 |
| KR101235933B1 (ko) * | 2005-02-17 | 2013-02-21 | 가부시끼가이샤 쓰리본드 | 가열 경화형 일액성 수지 조성물 |
| JP4996080B2 (ja) * | 2005-08-26 | 2012-08-08 | 株式会社東芝 | 電気絶縁材料 |
| JP2008075069A (ja) * | 2006-08-23 | 2008-04-03 | Toshiba Corp | 注型樹脂組成物およびそれを用いた絶縁材料、絶縁構造体 |
| JP5642917B2 (ja) * | 2007-02-09 | 2014-12-17 | 京セラケミカル株式会社 | モールドコイル含浸用エポキシ樹脂組成物及びモールドコイル装置 |
| JP5544162B2 (ja) * | 2007-02-28 | 2014-07-09 | 株式会社カネカ | ゴム状重合体粒子分散熱硬化性樹脂組成物、及びその製造方法 |
| JP5189818B2 (ja) * | 2007-10-10 | 2013-04-24 | 京セラケミカル株式会社 | 注型用エポキシ樹脂組成物、イグニッションコイルおよびその製造方法 |
| JP2009260122A (ja) * | 2008-04-18 | 2009-11-05 | Kyocera Chemical Corp | 高電圧コイルおよびその製造方法 |
| WO2010005710A1 (en) * | 2008-06-16 | 2010-01-14 | 3M Innovative Properties Company | Toughened curable compositions |
| DE102009012195A1 (de) * | 2009-03-06 | 2010-09-09 | Siemens Aktiengesellschaft | Gießharzsystem für Isolatoren mit erhöhter Wärmeformbeständigkeit |
| PL2414444T3 (pl) | 2009-04-02 | 2013-09-30 | Huntsman Adv Mat Licensing Switzerland Gmbh | Bezpośrednie przeformowanie |
| JP6009727B2 (ja) * | 2009-04-24 | 2016-10-19 | 三菱レイヨン株式会社 | 重合体粒子含有分散体及び重合体粒子含有樹脂組成物の製造方法 |
| JP5269728B2 (ja) * | 2009-09-07 | 2013-08-21 | 株式会社日立エレクトリックシステムズ | 高靭性高熱伝導性硬化性樹脂組成物、その硬化物及びモールド電機機器 |
| JP5587248B2 (ja) | 2011-06-10 | 2014-09-10 | 株式会社日立産機システム | 電気絶縁材料およびこれを用いた高電圧機器 |
| DE102012202161A1 (de) * | 2012-02-14 | 2013-08-14 | Elantas Gmbh | Elektroisolierharz auf Basis von Isohexiddioldiglycidethern |
| JPWO2013121571A1 (ja) * | 2012-02-17 | 2015-05-11 | 株式会社日立製作所 | 電気絶縁用樹脂組成物及びその硬化物並びにこれらの製造方法並びにこれらを用いた高電圧機器及び送配電機器 |
| CN104094361A (zh) * | 2012-02-17 | 2014-10-08 | 株式会社日立制作所 | 电绝缘用树脂组合物及其固化物以及它们的制造方法以及使用了它们的高电压设备及送配电设备 |
| JP5849156B2 (ja) * | 2012-06-13 | 2016-01-27 | 株式会社日立製作所 | 絶縁材料並びにこれを用いた高電圧機器 |
| EP2722863A1 (en) | 2012-10-16 | 2014-04-23 | ABB Technology AG | Embedded pole part with an isolating housing |
| JP5986647B2 (ja) * | 2013-01-23 | 2016-09-06 | 株式会社日立製作所 | 電気機器用絶縁材及びこれを用いた電気機器 |
| WO2016021036A1 (ja) * | 2014-08-08 | 2016-02-11 | 株式会社日立製作所 | 回転電機用固定子及び回転電機 |
| DE102016208923A1 (de) | 2016-05-24 | 2017-11-30 | Volkswagen Aktiengesellschaft | Vergussmasse, Verfahren zum Herstellen der Vergussmasse, Elektronisches Bauteil und Kraftfahrzeug |
| FR3051797A1 (fr) * | 2016-05-24 | 2017-12-01 | Univ Claude Bernard Lyon | Materiau composite epoxyde / thermoplastique et son procede de preparation |
| KR102016735B1 (ko) * | 2016-11-24 | 2019-09-03 | 전자부품연구원 | 절연 잉크 조성물 및 그를 이용하여 절연막이 형성된 기판 |
| JP6808591B2 (ja) * | 2017-08-09 | 2021-01-06 | 株式会社日立産機システム | 開閉装置及びその製造方法 |
| US11786794B1 (en) * | 2018-07-13 | 2023-10-17 | Topgolf Callaway Brands Corp. | Golf club head impact location based on 3D magnetic field readings |
| US11344784B1 (en) * | 2018-07-13 | 2022-05-31 | Callaway Golf Company | Golf ball with wound core with integrated circuit |
| US10688366B1 (en) * | 2018-07-13 | 2020-06-23 | Callaway Golf Company | Golf ball with electrical components |
| US12502592B1 (en) * | 2018-07-13 | 2025-12-23 | Topgolf Callaway Brands Corp. | Launch monitor utilizing a smart golf ball |
| EP3825355A1 (de) * | 2019-11-22 | 2021-05-26 | Henkel AG & Co. KGaA | Formulierungen mit hohen glasübergangstemperaturen für laminate |
| US11958938B2 (en) * | 2020-04-28 | 2024-04-16 | 3M Innovative Properties Company | Curable composition |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61268750A (ja) * | 1985-05-22 | 1986-11-28 | Shin Etsu Chem Co Ltd | 半導体封止用エポキシ樹脂組成物 |
| DE59006274D1 (de) * | 1989-04-07 | 1994-08-04 | Asea Brown Boveri | Elektrischer Isolator. |
| JPH07109337A (ja) * | 1993-08-20 | 1995-04-25 | Toshiba Corp | エポキシ樹脂注型材料 |
| EP1165688B1 (de) * | 1999-03-16 | 2007-01-24 | Huntsman Advanced Materials (Switzerland) GmbH | Härtbare zusammensetzung mit besonderer eigenschaftskombination |
-
2000
- 2000-06-29 JP JP2000195584A patent/JP4319332B2/ja not_active Expired - Fee Related
-
2001
- 2001-06-29 DE DE60112675T patent/DE60112675T2/de not_active Expired - Lifetime
- 2001-06-29 EP EP01114866A patent/EP1176171B1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP1176171B1 (en) | 2005-08-17 |
| EP1176171A3 (en) | 2002-02-06 |
| DE60112675D1 (de) | 2005-09-22 |
| JP2002015621A (ja) | 2002-01-18 |
| JP4319332B2 (ja) | 2009-08-26 |
| EP1176171A2 (en) | 2002-01-30 |
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