DE60030619T2 - Schutzvorrichtung - Google Patents
Schutzvorrichtung Download PDFInfo
- Publication number
- DE60030619T2 DE60030619T2 DE60030619T DE60030619T DE60030619T2 DE 60030619 T2 DE60030619 T2 DE 60030619T2 DE 60030619 T DE60030619 T DE 60030619T DE 60030619 T DE60030619 T DE 60030619T DE 60030619 T2 DE60030619 T2 DE 60030619T2
- Authority
- DE
- Germany
- Prior art keywords
- fuse element
- protection device
- temperature
- fuse
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/46—Circuit arrangements not adapted to a particular application of the protective device
- H01H85/463—Circuit arrangements not adapted to a particular application of the protective device with printed circuit fuse
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/46—Circuit arrangements not adapted to a particular application of the protective device
- H01H2085/466—Circuit arrangements not adapted to a particular application of the protective device with remote controlled forced fusing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/055—Fusible members
- H01H85/06—Fusible members characterised by the fusible material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10181—Fuse
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49107—Fuse making
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fuses (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11016399 | 1999-04-16 | ||
JP11110163A JP2000306477A (ja) | 1999-04-16 | 1999-04-16 | 保護素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60030619D1 DE60030619D1 (de) | 2006-10-26 |
DE60030619T2 true DE60030619T2 (de) | 2007-09-13 |
Family
ID=14528655
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60030619T Expired - Lifetime DE60030619T2 (de) | 1999-04-16 | 2000-04-12 | Schutzvorrichtung |
Country Status (5)
Country | Link |
---|---|
US (1) | US6452475B1 (ja) |
EP (1) | EP1045418B1 (ja) |
JP (1) | JP2000306477A (ja) |
KR (1) | KR100473470B1 (ja) |
DE (1) | DE60030619T2 (ja) |
Families Citing this family (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001325868A (ja) | 2000-05-17 | 2001-11-22 | Sony Chem Corp | 保護素子 |
JP2001325869A (ja) | 2000-05-17 | 2001-11-22 | Sony Chem Corp | 保護素子 |
JP3692042B2 (ja) | 2001-02-06 | 2005-09-07 | ソニーケミカル株式会社 | 保護回路付き二次電池 |
DE60109427T2 (de) * | 2001-05-29 | 2006-04-13 | Em Microelectronic-Marin S.A., Marin | Elektronische Vorrichtung und Verfahren zur Temperaturüberwachung eines Mediums |
DE10142091A1 (de) * | 2001-08-30 | 2003-03-20 | Wickmann Werke Gmbh | Verfahren zum Herstellen eines Schutzbauelements mit einem eingestellten Zeitverhalten des Wärmeübergangs von einem Heizelement zu einem Schmelzelement |
DE10245393A1 (de) * | 2002-09-28 | 2004-04-08 | Wickmann-Werke Gmbh | Mittels Lichtbogen selbst-konfigurierendes Bauelement |
JP2004214033A (ja) * | 2002-12-27 | 2004-07-29 | Sony Chem Corp | 保護素子 |
JP4110967B2 (ja) * | 2002-12-27 | 2008-07-02 | ソニーケミカル&インフォメーションデバイス株式会社 | 保護素子 |
JP2005171371A (ja) * | 2003-12-15 | 2005-06-30 | Uchihashi Estec Co Ltd | 合金型温度ヒューズ及び温度ヒューズエレメント用線材 |
DE102004033251B3 (de) * | 2004-07-08 | 2006-03-09 | Vishay Bccomponents Beyschlag Gmbh | Schmelzsicherung für einem Chip |
DE102005024346B4 (de) * | 2005-05-27 | 2012-04-26 | Infineon Technologies Ag | Sicherungselement mit Auslöseunterstützung |
WO2007041529A2 (en) * | 2005-10-03 | 2007-04-12 | Littelfuse, Inc. | Fuse with cavity forming enclosure |
TWI323906B (en) * | 2007-02-14 | 2010-04-21 | Besdon Technology Corp | Chip-type fuse and method of manufacturing the same |
JP2008311161A (ja) * | 2007-06-18 | 2008-12-25 | Sony Chemical & Information Device Corp | 保護素子 |
US20090009281A1 (en) * | 2007-07-06 | 2009-01-08 | Cyntec Company | Fuse element and manufacturing method thereof |
JP5287154B2 (ja) * | 2007-11-08 | 2013-09-11 | パナソニック株式会社 | 回路保護素子およびその製造方法 |
TW200929310A (en) * | 2007-12-21 | 2009-07-01 | Chun-Chang Yen | Surface Mounted Technology type thin film fuse structure and the manufacturing method thereof |
JP5117917B2 (ja) * | 2008-04-21 | 2013-01-16 | デクセリアルズ株式会社 | 保護素子及びその製造方法 |
JP5072796B2 (ja) * | 2008-05-23 | 2012-11-14 | ソニーケミカル&インフォメーションデバイス株式会社 | 保護素子及び二次電池装置 |
US20110163840A1 (en) * | 2008-10-28 | 2011-07-07 | Nanjing Sart Science & Technology Development Co., Ltd. | High reliability blade fuse and the manufacturing method thereof |
JP5301298B2 (ja) * | 2009-01-21 | 2013-09-25 | デクセリアルズ株式会社 | 保護素子 |
JP5130233B2 (ja) * | 2009-01-21 | 2013-01-30 | デクセリアルズ株式会社 | 保護素子 |
JP5130232B2 (ja) * | 2009-01-21 | 2013-01-30 | デクセリアルズ株式会社 | 保護素子 |
JP5351860B2 (ja) * | 2009-09-04 | 2013-11-27 | 乾坤科技股▲ふん▼有限公司 | 保護装置 |
US9129769B2 (en) * | 2009-09-04 | 2015-09-08 | Cyntec Co., Ltd. | Protective device |
US9025295B2 (en) | 2009-09-04 | 2015-05-05 | Cyntec Co., Ltd. | Protective device and protective module |
US8659384B2 (en) * | 2009-09-16 | 2014-02-25 | Littelfuse, Inc. | Metal film surface mount fuse |
US8531263B2 (en) * | 2009-11-24 | 2013-09-10 | Littelfuse, Inc. | Circuit protection device |
DE102010011150B4 (de) * | 2010-03-11 | 2012-03-29 | Auto-Kabel Managementgesellschaft Mbh | Elektrische Sicherung für Kraftfahrzeugenergieleitungen und Herstellungsverfahren für eine solche Sicherung |
JP5260592B2 (ja) * | 2010-04-08 | 2013-08-14 | デクセリアルズ株式会社 | 保護素子、バッテリ制御装置、及びバッテリパック |
EP2408277B1 (de) * | 2010-07-16 | 2016-02-17 | Schurter AG | Sicherungselement |
CN201774742U (zh) * | 2010-08-19 | 2011-03-23 | 依必安派特风机(上海)有限公司 | 集成于印刷电路板上的保险单元以及印刷电路板 |
US8976001B2 (en) * | 2010-11-08 | 2015-03-10 | Cyntec Co., Ltd. | Protective device |
JP5958841B2 (ja) * | 2011-06-17 | 2016-08-02 | エルジー・ケム・リミテッド | 二次電池用部品及びその製造方法、並びに該部品を使用して製造された二次電池及びマルチ電池システム |
JP5844669B2 (ja) * | 2012-03-26 | 2016-01-20 | デクセリアルズ株式会社 | 保護素子 |
JP6249600B2 (ja) * | 2012-03-29 | 2017-12-20 | デクセリアルズ株式会社 | 保護素子 |
FR2989825B1 (fr) * | 2012-04-18 | 2014-06-06 | Centre Nat Rech Scient | Dispositif electrique et procede de fabrication de celui-ci |
KR101401141B1 (ko) * | 2012-11-26 | 2014-05-30 | 스마트전자 주식회사 | 비정상상태의 전류 및 전압을 차단하는 복합보호소자 |
KR101388354B1 (ko) * | 2012-11-26 | 2014-04-24 | 스마트전자 주식회사 | 비정상상태의 전류 및 전압을 차단하는 복합보호소자 |
JP6151550B2 (ja) * | 2013-04-25 | 2017-06-21 | デクセリアルズ株式会社 | 保護素子 |
TWI625754B (zh) * | 2013-07-02 | 2018-06-01 | Tyco Electronics Japan G K | Protective member |
US20150200067A1 (en) * | 2014-01-10 | 2015-07-16 | Littelfuse, Inc. | Ceramic chip fuse with offset fuse element |
KR101504133B1 (ko) * | 2014-02-28 | 2015-03-19 | 스마트전자 주식회사 | 복합보호소자 |
DE102015102292A1 (de) * | 2014-02-28 | 2015-09-03 | Smart Electronics Inc. | Komplexe Schutzvorrichtung zum Blockieren eines abnormalen Zustands von Strom und Spannung |
KR101434135B1 (ko) * | 2014-03-17 | 2014-08-26 | 스마트전자 주식회사 | 퓨즈 저항기 |
DE102015108758A1 (de) * | 2014-06-13 | 2015-12-17 | Smart Electronics Inc. | Komplexe Schutzvorrichtung |
JP6294165B2 (ja) * | 2014-06-19 | 2018-03-14 | Koa株式会社 | チップ型ヒューズ |
JP6203136B2 (ja) * | 2014-06-27 | 2017-09-27 | エヌイーシー ショット コンポーネンツ株式会社 | 保護素子およびその製造方法、ならびに保護素子用消散性フラックス |
DE102014215279A1 (de) * | 2014-08-04 | 2016-02-04 | Phoenix Contact Gmbh & Co. Kg | Schmelzsicherung für eine zu schützende Einrichtung |
KR101533996B1 (ko) * | 2014-10-23 | 2015-07-06 | 주식회사 에스엠하이테크 | 온도 퓨즈 기능을 가진 smd형 마이크로 복합 퓨즈 및 그 제조방법 |
KR102072613B1 (ko) * | 2015-03-24 | 2020-02-03 | 이승규 | 용융 스위치, 이를 포함하는 배터리 제어장치 및 제어방법 |
DE102015225377A1 (de) * | 2015-12-16 | 2017-06-22 | Phoenix Contact Gmbh & Co. Kg | Laststromtragende Sicherung mit internem Schaltelement |
JP6160788B1 (ja) * | 2017-01-13 | 2017-07-12 | 千住金属工業株式会社 | フラックス |
JP6433527B2 (ja) * | 2017-03-16 | 2018-12-05 | ショット日本株式会社 | 消散性フラックスおよびそれを用いた保護素子の製造方法 |
JP7231527B2 (ja) | 2018-12-28 | 2023-03-01 | ショット日本株式会社 | 保護素子用ヒューズ素子およびそれを利用した保護素子 |
CN114730679A (zh) * | 2019-11-21 | 2022-07-08 | 力特保险丝公司 | 具有正温度系数装置和备用熔断器的电路保护装置 |
JP7349954B2 (ja) * | 2020-04-13 | 2023-09-25 | ショット日本株式会社 | 保護素子 |
JP2023127740A (ja) * | 2022-03-02 | 2023-09-14 | デクセリアルズ株式会社 | 保護素子 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3445798A (en) * | 1967-08-04 | 1969-05-20 | Dieter R Lohrmann | Short-time melting fuse |
US4873506A (en) * | 1988-03-09 | 1989-10-10 | Cooper Industries, Inc. | Metallo-organic film fractional ampere fuses and method of making |
DE4222278C1 (de) * | 1992-07-07 | 1994-03-31 | Roederstein Kondensatoren | Verfahren zur Herstellung elektrischer Dickschichtsicherungen |
JP2790433B2 (ja) | 1993-08-31 | 1998-08-27 | ソニー株式会社 | 保護素子及び回路基板 |
JPH07122406A (ja) * | 1993-10-22 | 1995-05-12 | Hokuriku Electric Ind Co Ltd | チップ状ヒューズ抵抗器とその製造方法 |
JP2608031B2 (ja) * | 1994-07-21 | 1997-05-07 | 釜屋電機株式会社 | チップ型ヒューズ抵抗器 |
US5712610C1 (en) * | 1994-08-19 | 2002-06-25 | Sony Chemicals Corp | Protective device |
JP3067011B2 (ja) | 1994-11-30 | 2000-07-17 | ソニーケミカル株式会社 | 保護素子及びその製造方法 |
KR200203067Y1 (ko) * | 1994-10-13 | 2001-04-02 | 권호택 | 하이브리드 아이씨용 퓨즈저항 패턴 |
JP3768621B2 (ja) | 1996-10-12 | 2006-04-19 | 内橋エステック株式会社 | 保護素子の使用方法 |
JP3782176B2 (ja) | 1996-10-12 | 2006-06-07 | 内橋エステック株式会社 | 保護素子の使用方法及び保護装置 |
JPH10162715A (ja) * | 1996-11-28 | 1998-06-19 | Kyocera Corp | チップヒューズ |
US5939969A (en) * | 1997-08-29 | 1999-08-17 | Microelectronic Modules Corporation | Preformed thermal fuse |
-
1999
- 1999-04-16 JP JP11110163A patent/JP2000306477A/ja active Pending
-
2000
- 2000-04-04 US US09/542,882 patent/US6452475B1/en not_active Expired - Lifetime
- 2000-04-12 DE DE60030619T patent/DE60030619T2/de not_active Expired - Lifetime
- 2000-04-12 EP EP00107886A patent/EP1045418B1/en not_active Expired - Lifetime
- 2000-04-15 KR KR10-2000-0019802A patent/KR100473470B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
DE60030619D1 (de) | 2006-10-26 |
EP1045418B1 (en) | 2006-09-13 |
JP2000306477A (ja) | 2000-11-02 |
EP1045418A2 (en) | 2000-10-18 |
KR20010006986A (ko) | 2001-01-26 |
KR100473470B1 (ko) | 2005-03-07 |
US6452475B1 (en) | 2002-09-17 |
EP1045418A3 (en) | 2002-11-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |