DE60022951D1 - Metallischer Werkstoff für elektronische Bauelemente, elektronische Bauelemente, elektronische Geräte und Verfahren zum Behandeln metallischer Werkstoffe - Google Patents

Metallischer Werkstoff für elektronische Bauelemente, elektronische Bauelemente, elektronische Geräte und Verfahren zum Behandeln metallischer Werkstoffe

Info

Publication number
DE60022951D1
DE60022951D1 DE60022951T DE60022951T DE60022951D1 DE 60022951 D1 DE60022951 D1 DE 60022951D1 DE 60022951 T DE60022951 T DE 60022951T DE 60022951 T DE60022951 T DE 60022951T DE 60022951 D1 DE60022951 D1 DE 60022951D1
Authority
DE
Germany
Prior art keywords
electronic components
processes
electronic
treating
metallic material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60022951T
Other languages
English (en)
Other versions
DE60022951T2 (de
Inventor
Takashi Ueno
Katsuhisa Aratani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furuya Metal Co Ltd
Sony Corp
Original Assignee
Furuya Metal Co Ltd
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furuya Metal Co Ltd, Sony Corp filed Critical Furuya Metal Co Ltd
Application granted granted Critical
Publication of DE60022951D1 publication Critical patent/DE60022951D1/de
Publication of DE60022951T2 publication Critical patent/DE60022951T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133553—Reflecting elements
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53242—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being a noble metal, e.g. gold
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53242—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being a noble metal, e.g. gold
    • H01L23/53247—Noble-metal alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53242—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being a noble metal, e.g. gold
    • H01L23/53252—Additional layers associated with noble-metal layers, e.g. adhesion, barrier, cladding layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Physical Vapour Deposition (AREA)
  • Weting (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Liquid Crystal (AREA)
DE60022951T 1999-07-12 2000-07-07 Metallischer Werkstoff für elektronische Bauelemente, elektronische Bauelemente, elektronische Geräte und Verfahren zum Behandeln metallischer Werkstoffe Expired - Lifetime DE60022951T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP19687899 1999-07-12
JP19687899 1999-07-12
JP2000092980A JP4247863B2 (ja) 1999-07-12 2000-03-28 電子部品用金属材料、電子部品用配線材料、電子部品用電極材料、電子部品、電子機器、金属材料の加工方法及び電子光学部品
JP2000092980 2000-03-28

Publications (2)

Publication Number Publication Date
DE60022951D1 true DE60022951D1 (de) 2005-11-10
DE60022951T2 DE60022951T2 (de) 2006-07-20

Family

ID=26510042

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60022951T Expired - Lifetime DE60022951T2 (de) 1999-07-12 2000-07-07 Metallischer Werkstoff für elektronische Bauelemente, elektronische Bauelemente, elektronische Geräte und Verfahren zum Behandeln metallischer Werkstoffe

Country Status (11)

Country Link
US (1) US6723281B1 (de)
EP (1) EP1069194B1 (de)
JP (1) JP4247863B2 (de)
KR (1) KR100715405B1 (de)
CN (1) CN1165990C (de)
CA (1) CA2313767C (de)
DE (1) DE60022951T2 (de)
ID (1) ID26547A (de)
MX (1) MXPA00006720A (de)
MY (1) MY127011A (de)
TW (1) TW457650B (de)

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US7314657B2 (en) 2000-07-21 2008-01-01 Target Technology Company, Llc Metal alloys for the reflective or the semi-reflective layer of an optical storage medium
US7314659B2 (en) 2000-07-21 2008-01-01 Target Technology Company, Llc Metal alloys for the reflective or semi-reflective layer of an optical storage medium
US7374805B2 (en) 2000-07-21 2008-05-20 Target Technology Company, Llc Metal alloys for the reflective or the semi-reflective layer of an optical storage medium
US7316837B2 (en) 2000-07-21 2008-01-08 Target Technology Company, Llc Metal alloys for the reflective or the semi-reflective layer of an optical storage medium
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JP5228595B2 (ja) * 2008-04-21 2013-07-03 ソニー株式会社 半導体発光素子及びその製造方法、並びに、積層構造体及びその形成方法
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Also Published As

Publication number Publication date
CA2313767A1 (en) 2001-01-12
DE60022951T2 (de) 2006-07-20
JP4247863B2 (ja) 2009-04-02
US6723281B1 (en) 2004-04-20
ID26547A (id) 2001-01-18
CA2313767C (en) 2010-09-28
KR100715405B1 (ko) 2007-05-08
MXPA00006720A (es) 2007-05-08
CN1280387A (zh) 2001-01-17
TW457650B (en) 2001-10-01
MY127011A (en) 2006-11-30
CN1165990C (zh) 2004-09-08
JP2001192752A (ja) 2001-07-17
EP1069194B1 (de) 2005-10-05
KR20010029930A (ko) 2001-04-16
EP1069194A1 (de) 2001-01-17

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