DE60017004D1 - Hochfrequenz-Kommunikationsgerät - Google Patents

Hochfrequenz-Kommunikationsgerät

Info

Publication number
DE60017004D1
DE60017004D1 DE60017004T DE60017004T DE60017004D1 DE 60017004 D1 DE60017004 D1 DE 60017004D1 DE 60017004 T DE60017004 T DE 60017004T DE 60017004 T DE60017004 T DE 60017004T DE 60017004 D1 DE60017004 D1 DE 60017004D1
Authority
DE
Germany
Prior art keywords
communication device
radio frequency
frequency communication
radio
frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60017004T
Other languages
English (en)
Other versions
DE60017004T2 (de
Inventor
Hiroshi Kondoh
Hiroshi Shinoda
Kenji Sekine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE60017004D1 publication Critical patent/DE60017004D1/de
Application granted granted Critical
Publication of DE60017004T2 publication Critical patent/DE60017004T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/16—Auxiliary devices for mode selection, e.g. mode suppression or mode promotion; for mode conversion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/207—Hollow waveguide filters
    • H01P1/211—Waffle-iron filters; Corrugated structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/141—Analog devices
    • H01L2924/1423—Monolithic Microwave Integrated Circuit [MMIC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/1616—Cavity shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
DE60017004T 1999-04-26 2000-04-26 Hochfrequenz-Kommunikationsgerät Expired - Lifetime DE60017004T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11804799 1999-04-26
JP11804799A JP3739230B2 (ja) 1999-04-26 1999-04-26 高周波通信装置

Publications (2)

Publication Number Publication Date
DE60017004D1 true DE60017004D1 (de) 2005-02-03
DE60017004T2 DE60017004T2 (de) 2006-04-27

Family

ID=14726720

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60017004T Expired - Lifetime DE60017004T2 (de) 1999-04-26 2000-04-26 Hochfrequenz-Kommunikationsgerät

Country Status (4)

Country Link
US (2) US6337661B1 (de)
EP (1) EP1049192B1 (de)
JP (1) JP3739230B2 (de)
DE (1) DE60017004T2 (de)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3739230B2 (ja) * 1999-04-26 2006-01-25 株式会社日立製作所 高周波通信装置
JP3589137B2 (ja) * 2000-01-31 2004-11-17 株式会社日立製作所 高周波通信装置およびその製造方法
DE10024852C1 (de) * 2000-05-19 2001-11-15 Siemens Ag Verfahren zur Innenraum-/Außenraumerkennung eines mit einer Basisstation drahtlos kommunizierenden Antwortgebers sowie Kommunikationssystem
US7280011B2 (en) 2001-11-27 2007-10-09 Intel Corporation Waveguide and method of manufacture
JP4028765B2 (ja) * 2002-06-18 2007-12-26 京セラ株式会社 電磁波吸収体及びこれを用いた高周波回路用パッケージ
JP4028769B2 (ja) * 2002-06-21 2007-12-26 京セラ株式会社 電磁波吸収体及びこれを用いた高周波回路用パッケージ
JP3764877B2 (ja) * 2002-10-16 2006-04-12 株式会社日立製作所 レーダ装置
GB2395481B (en) * 2002-11-19 2006-06-28 C Tech Innovation Ltd Control of biocatalysis reactions
JP2005012103A (ja) * 2003-06-20 2005-01-13 Yokohama Rubber Co Ltd:The 電波吸収筐体及びその製造方法
GB0328246D0 (en) * 2003-12-04 2004-06-16 Qinetiq Ltd Improvements relating to electronic circuit packages
US7880282B2 (en) 2003-12-18 2011-02-01 Rf Module & Optical Design Ltd. Semiconductor package with integrated heatsink and electromagnetic shield
CN1926933B (zh) * 2004-03-01 2010-12-08 新田株式会社 电磁波吸收体
FR2871618A1 (fr) * 2004-06-09 2005-12-16 Thomson Licensing Sa Filtre basse-bande hyperfrequence de type finline
DE102005022473B4 (de) * 2005-05-14 2007-05-24 Forschungszentrum Karlsruhe Gmbh Vorrichtung zur Dämpfung von Reflexionen elektromagnetischer Wellen, Verfahren zu ihrer Herstellung und ihre Verwendung
JP4575247B2 (ja) * 2005-07-11 2010-11-04 株式会社東芝 高周波パッケージ装置
JP2007250938A (ja) * 2006-03-17 2007-09-27 Nippon Telegr & Teleph Corp <Ntt> Ｉｃチップ実装モジュール及びｉｃチップ実装方法
JP4641286B2 (ja) * 2006-06-21 2011-03-02 株式会社豊田中央研究所 半導体パッケージ
JP4286855B2 (ja) * 2006-09-07 2009-07-01 株式会社日立製作所 レーダ装置
JP4983219B2 (ja) * 2006-11-22 2012-07-25 株式会社村田製作所 部品内蔵基板
JP4627527B2 (ja) * 2006-12-28 2011-02-09 日立オートモティブシステムズ株式会社 高周波半導体装置およびその実装方法
FR2914506B1 (fr) * 2007-03-29 2010-09-17 Centre Nat Rech Scient Antenne a resonateur equipe d'un revetement filtrant et systeme incorporant cette antenne.
US7733288B2 (en) * 2007-03-30 2010-06-08 Microwave Mitigation And Detection (“Mmad”) Passive anti-jamming antenna system and method
US7968978B2 (en) * 2007-06-14 2011-06-28 Raytheon Company Microwave integrated circuit package and method for forming such package
US8514036B2 (en) * 2007-08-14 2013-08-20 Wemtec, Inc. Apparatus and method for mode suppression in microwave and millimeterwave packages
US9000869B2 (en) 2007-08-14 2015-04-07 Wemtec, Inc. Apparatus and method for broadband electromagnetic mode suppression in microwave and millimeterwave packages
US8816798B2 (en) * 2007-08-14 2014-08-26 Wemtec, Inc. Apparatus and method for electromagnetic mode suppression in microwave and millimeterwave packages
JP2010074588A (ja) * 2008-09-19 2010-04-02 New Japan Radio Co Ltd 導波管フィルタ
JP5281504B2 (ja) * 2009-07-02 2013-09-04 株式会社ユポ・コーポレーション 電磁波遮蔽体
JP5573027B2 (ja) * 2009-07-09 2014-08-20 富士ゼロックス株式会社 電子回路を収容する容器及び電子装置
JP2011044623A (ja) * 2009-08-24 2011-03-03 Hitachi Ltd 低輻射構造を備えた電子機器
KR101725470B1 (ko) 2009-12-25 2017-04-10 세이지 까가와 복합 전자파 흡수 필름
JP2011233642A (ja) * 2010-04-26 2011-11-17 Nitto Denko Corp 電磁波吸収体
JP5831450B2 (ja) * 2010-07-12 2015-12-09 日本電気株式会社 電子機器
DE102010038517A1 (de) * 2010-07-28 2012-02-02 Robert Bosch Gmbh Radom für einen Radarsensor in einem Kraftfahrzeug und entsprechender Radarsensor
JP5555087B2 (ja) 2010-07-30 2014-07-23 株式会社豊田中央研究所 レーダ装置
US9386688B2 (en) * 2010-11-12 2016-07-05 Freescale Semiconductor, Inc. Integrated antenna package
US9553371B2 (en) 2010-11-12 2017-01-24 Nxp Usa, Inc. Radar module
JP5566933B2 (ja) 2011-03-23 2014-08-06 古河電気工業株式会社 高周波通信装置
GB2496835B (en) * 2011-09-23 2015-12-30 Radio Physics Solutions Ltd Package for high frequency circuits
JP6361252B2 (ja) * 2014-04-14 2018-07-25 富士通株式会社 半導体装置
JP6184610B2 (ja) * 2014-10-29 2017-08-23 三菱電機株式会社 高周波装置及び高周波装置の製造方法
JP6346373B2 (ja) * 2015-03-19 2018-06-20 株式会社東芝 電子機器
JP6723754B2 (ja) * 2016-02-08 2020-07-15 キヤノン株式会社 電子機器
US10433417B2 (en) 2016-02-08 2019-10-01 Canon Kabushiki Kaisha Electronic apparatus
JP6687469B2 (ja) 2016-06-14 2020-04-22 日立オートモティブシステムズ株式会社 ミリ波帯通信装置
JP6971119B2 (ja) * 2017-10-13 2021-11-24 株式会社ヨコオ パッチアンテナおよび車載用アンテナ装置
KR102442131B1 (ko) * 2018-01-26 2022-09-13 삼성전자 주식회사 안테나 장치 및 안테나 장치를 포함하는 전자 장치
JP2019179790A (ja) * 2018-03-30 2019-10-17 日本電信電話株式会社 高周波モジュール
JP7095582B2 (ja) * 2018-12-11 2022-07-05 日本電信電話株式会社 高周波モジュール
CN109887904A (zh) * 2019-04-16 2019-06-14 中国电子科技集团公司第十三研究所 一种毫米波芯片的封装结构及印刷电路板
US11925009B2 (en) * 2021-03-09 2024-03-05 Hamilton Sundstrand Corporation Adaptive design and fabrication of radiation shielding inserts for electronic components

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7810942A (nl) * 1978-11-03 1980-05-07 Philips Nv Ondersteunde microstriplijn voor de propagatie van een oneven golfmodus.
JPS5834602A (ja) * 1981-08-25 1983-03-01 Tdk Corp 電波吸収体
GB2251338B (en) * 1985-10-15 1992-09-16 Secr Defence Microwave absorber
US4771294A (en) * 1986-09-10 1988-09-13 Harris Corporation Modular interface for monolithic millimeter wave antenna array
US5223849A (en) * 1986-11-25 1993-06-29 Chomerics, Inc. Broadband electromagnetic energy absorber
US5576710A (en) * 1986-11-25 1996-11-19 Chomerics, Inc. Electromagnetic energy absorber
DE3738506A1 (de) * 1987-11-13 1989-06-01 Dornier System Gmbh Antennenstruktur
US5384575A (en) 1988-09-26 1995-01-24 Hughes Aircraft Company Bandpass frequency selective surface
US5030935A (en) * 1989-05-11 1991-07-09 Ball Corporation Method and apparatus for dampening resonant modes in packaged microwave circuits
IT1245423B (it) * 1991-02-27 1994-09-20 Alenia Aeritalia & Selenia Struttura dicroica discriminante in frequenza con banda passante variabile, e sue applicazioni
FI87854C (fi) * 1991-04-12 1993-02-25 Lk Products Oy Foerfarande foer att tillverka ett hoegfrekvensfilter samt hoegfrekvensfilter tillverkat enligt foerfarandet
GB9115970D0 (en) * 1991-07-24 1999-08-11 Secr Defence Brit Frequency selective radar absorbent structure
JPH08288684A (ja) * 1995-04-20 1996-11-01 K Lab:Kk 電磁波吸収体
US5886671A (en) * 1995-12-21 1999-03-23 The Boeing Company Low-cost communication phased-array antenna
JPH09246803A (ja) * 1996-03-01 1997-09-19 Murata Mfg Co Ltd 誘電体一体型ｎｒｄ線路超電導帯域通過フィルタ装置
JPH09321521A (ja) * 1996-05-31 1997-12-12 Hitachi Ltd 携帯無線端末
US6204825B1 (en) * 1997-04-10 2001-03-20 Intermec Ip Corp. Hybrid printed circuit board shield and antenna
JP3786497B2 (ja) * 1997-06-13 2006-06-14 富士通株式会社 アンテナ素子を内蔵する半導体モジュール
JPH11261283A (ja) * 1998-03-09 1999-09-24 Shimizu Corp 反射波干渉低減型電磁遮蔽建物
JP3739230B2 (ja) * 1999-04-26 2006-01-25 株式会社日立製作所 高周波通信装置

Also Published As

Publication number Publication date
EP1049192A2 (de) 2000-11-02
JP3739230B2 (ja) 2006-01-25
US20020067313A1 (en) 2002-06-06
EP1049192B1 (de) 2004-12-29
US6862001B2 (en) 2005-03-01
EP1049192A3 (de) 2002-02-06
JP2000307305A (ja) 2000-11-02
US6337661B1 (en) 2002-01-08
DE60017004T2 (de) 2006-04-27

Similar Documents

Publication Publication Date Title
DE60017004D1 (de) Hochfrequenz-Kommunikationsgerät
DE69935715D1 (de) Funkkommunikationssystem
DE60133614D1 (de) Funkkommunikationsgerät
FI20011247A (fi) Radiotaajuusmoduuli
DE60128132D1 (de) Funkkommunikationssystem
DE60210554D1 (de) Funkfrequenzvorrichtung und dazugehöriges Kommunikationsgerät
DE69907748D1 (de) Kooperation unterschiedlicher funknetzwerke
DK1067627T3 (da) Tobånds radioapparat
DE60044379D1 (de) Mobilfunkendgerät
DE60020204D1 (de) Drahtloses Kommunikationssystem
EP1083680A4 (de) Funkkommunikationsgerät mit gruppenantenna
DE60032116D1 (de) Rundfunkempfänger
DE60032216D1 (de) Funk-kommunikationssystem
FI20002637A (fi) Menetelmä lyhyen kantaman radiotaajuuskommunikoinnissa
DE69921475D1 (de) Funkendgerät
DE60122089D1 (de) Radiokommunikationsvorrichtung
DE60029044T8 (de) Tragbares schnurloses Kommunikationsgerät
DE60038850D1 (de) Drahtloses Kommunikationsgerät
DE59911153D1 (de) Programmierbares mobilfunk-endgerät
DE60019091D1 (de) Funkkommunikationssystem
DE69902430T2 (de) Mobile drahtlose Einrichtung
DE60234262D1 (de) Funkkommunikationsvorrichtung
DE60107908D1 (de) Drahtloses Kommunikationsgerät
DE60041018D1 (de) Funkendgerät
EP1063784A4 (de) Funkübertragungsgerät

Legal Events

Date Code Title Description
8364 No opposition during term of opposition