DE60210554D1 - Funkfrequenzvorrichtung und dazugehöriges Kommunikationsgerät - Google Patents

Funkfrequenzvorrichtung und dazugehöriges Kommunikationsgerät

Info

Publication number
DE60210554D1
DE60210554D1 DE60210554T DE60210554T DE60210554D1 DE 60210554 D1 DE60210554 D1 DE 60210554D1 DE 60210554 T DE60210554 T DE 60210554T DE 60210554 T DE60210554 T DE 60210554T DE 60210554 D1 DE60210554 D1 DE 60210554D1
Authority
DE
Germany
Prior art keywords
radio frequency
associated communication
communication device
frequency device
radio
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60210554T
Other languages
English (en)
Other versions
DE60210554T2 (de
Inventor
Takehiko Yamakawa
Toru Yamada
Toshio Ishizaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE60210554D1 publication Critical patent/DE60210554D1/de
Publication of DE60210554T2 publication Critical patent/DE60210554T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/20Frequency-selective devices, e.g. filters
    • H01P1/201Filters for transverse electromagnetic waves
    • H01P1/203Strip line filters
    • H01P1/20327Electromagnetic interstage coupling
    • H01P1/20336Comb or interdigital filters
    • H01P1/20345Multilayer filters
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/10Auxiliary devices for switching or interrupting
    • H01P1/15Auxiliary devices for switching or interrupting by semiconductor devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/20Frequency-selective devices, e.g. filters
    • H01P1/213Frequency-selective devices, e.g. filters combining or separating two or more different frequencies
DE60210554T 2001-08-27 2002-08-27 Funkfrequenzvorrichtung und dazugehöriges Kommunikationsgerät Expired - Fee Related DE60210554T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001255685 2001-08-27
JP2001255685 2001-08-27

Publications (2)

Publication Number Publication Date
DE60210554D1 true DE60210554D1 (de) 2006-05-24
DE60210554T2 DE60210554T2 (de) 2006-08-24

Family

ID=19083614

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60210554T Expired - Fee Related DE60210554T2 (de) 2001-08-27 2002-08-27 Funkfrequenzvorrichtung und dazugehöriges Kommunikationsgerät

Country Status (4)

Country Link
US (1) US6985712B2 (de)
EP (1) EP1291954B1 (de)
CN (1) CN1226803C (de)
DE (1) DE60210554T2 (de)

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US7471146B2 (en) * 2005-02-15 2008-12-30 Paratek Microwave, Inc. Optimized circuits for three dimensional packaging and methods of manufacture therefore
US8229366B2 (en) * 2005-04-08 2012-07-24 Qualcomm, Incorporated Tunable duplexer with common node notch filter
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US9450665B2 (en) * 2005-10-19 2016-09-20 Qualcomm Incorporated Diversity receiver for wireless communication
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US7907044B2 (en) * 2006-01-31 2011-03-15 Hitachi Metals, Ltd. Laminate device and module comprising same
US8073398B2 (en) * 2006-03-24 2011-12-06 Nortel Networks Limited Method and apparatus for adaptive channel utilisation
US8183956B2 (en) * 2006-07-03 2012-05-22 Hitachi Metals, Ltd. Diplexer circuit, high-frequency circuit and high-frequency module
US7903592B2 (en) * 2007-03-02 2011-03-08 Alcatel Lucent Systems and methods of efficient band amplification
US8027699B2 (en) * 2007-03-02 2011-09-27 Alcatel Lucent Systems and methods of band amplification with a shared amplifier
US7917096B2 (en) * 2007-03-30 2011-03-29 Sony Ericsson Mobile Communications Ab Antenna interface circuits including multiple impedance matching networks that are respectively associated with multiple frequency bands and electronic devices incorporating the same
TWI337783B (en) * 2007-07-06 2011-02-21 Harvatek Corp Through hole type led chip package structure using ceramic material as a substrate and method of the same
WO2009072251A1 (ja) * 2007-12-03 2009-06-11 Panasonic Corporation 高周波フィルタ
WO2009100401A2 (en) * 2008-02-06 2009-08-13 Hmicro, Inc. Wireless communications systems using multiple radios
WO2010015364A2 (en) 2008-08-04 2010-02-11 Fractus, S.A. Antennaless wireless device capable of operation in multiple frequency regions
US20100309901A1 (en) * 2009-06-03 2010-12-09 Harris Corporation Systems and methods for maintaining a controlled power output at an antenna port over a range of frequencies defined by two or more frequency bands
US8306481B2 (en) * 2009-10-30 2012-11-06 Infineon Technologies Ag Single pole multi throw switch
US20110159823A1 (en) * 2009-12-25 2011-06-30 Shao-Chin Lo RF Front-end Circuit and Wireless Communication Device Using the Same
CN102111174A (zh) * 2009-12-25 2011-06-29 雷凌科技股份有限公司 射频前端电路及无线通信装置
KR20120064834A (ko) * 2010-12-10 2012-06-20 삼성전자주식회사 동시대기 단말의 알에스이(rse) 성능 개선 장치 및 방법
US9178669B2 (en) 2011-05-17 2015-11-03 Qualcomm Incorporated Non-adjacent carrier aggregation architecture
US9252827B2 (en) 2011-06-27 2016-02-02 Qualcomm Incorporated Signal splitting carrier aggregation receiver architecture
US9154179B2 (en) 2011-06-29 2015-10-06 Qualcomm Incorporated Receiver with bypass mode for improved sensitivity
US8923167B2 (en) * 2011-09-27 2014-12-30 Google Technology Holdings LLC Communication device for simultaneous transmission by multiple transceivers
US8774334B2 (en) 2011-11-09 2014-07-08 Qualcomm Incorporated Dynamic receiver switching
US9362958B2 (en) 2012-03-02 2016-06-07 Qualcomm Incorporated Single chip signal splitting carrier aggregation receiver architecture
US9172402B2 (en) 2012-03-02 2015-10-27 Qualcomm Incorporated Multiple-input and multiple-output carrier aggregation receiver reuse architecture
US9118439B2 (en) 2012-04-06 2015-08-25 Qualcomm Incorporated Receiver for imbalanced carriers
US9154356B2 (en) 2012-05-25 2015-10-06 Qualcomm Incorporated Low noise amplifiers for carrier aggregation
US9867194B2 (en) 2012-06-12 2018-01-09 Qualcomm Incorporated Dynamic UE scheduling with shared antenna and carrier aggregation
US9300420B2 (en) 2012-09-11 2016-03-29 Qualcomm Incorporated Carrier aggregation receiver architecture
US9543903B2 (en) 2012-10-22 2017-01-10 Qualcomm Incorporated Amplifiers with noise splitting
CN103050748B (zh) * 2012-12-07 2014-11-26 中国电子科技集团公司第五十五研究所 微屏蔽结构全密封式的层叠微机械滤波器
US8995591B2 (en) 2013-03-14 2015-03-31 Qualcomm, Incorporated Reusing a single-chip carrier aggregation receiver to support non-cellular diversity
KR101558100B1 (ko) * 2014-07-02 2015-10-06 삼성전기주식회사 복합 전자부품 및 그 실장 기판
US10177722B2 (en) 2016-01-12 2019-01-08 Qualcomm Incorporated Carrier aggregation low-noise amplifier with tunable integrated power splitter
JP2020120185A (ja) * 2019-01-21 2020-08-06 株式会社村田製作所 フロントエンドモジュール及び通信装置

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JPH04301901A (ja) 1991-03-28 1992-10-26 Sanyo Electric Co Ltd 高周波モジュール用基板
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JP3392630B2 (ja) * 1996-03-22 2003-03-31 松下電器産業株式会社 スペクトル拡散通信装置
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JP3406830B2 (ja) * 1998-03-06 2003-05-19 京セラ株式会社 高周波用電子装置
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JP3475858B2 (ja) 1999-06-03 2003-12-10 株式会社村田製作所 アンテナ共用器及び通信機装置
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JP2002111218A (ja) 2000-06-27 2002-04-12 Matsushita Electric Ind Co Ltd セラミック積層デバイス
JP3709770B2 (ja) * 2000-07-27 2005-10-26 株式会社村田製作所 半導体スイッチ回路および半導体装置
JP3570359B2 (ja) * 2000-08-24 2004-09-29 三菱電機株式会社 高周波モジュール

Also Published As

Publication number Publication date
DE60210554T2 (de) 2006-08-24
US6985712B2 (en) 2006-01-10
EP1291954B1 (de) 2006-04-12
EP1291954A2 (de) 2003-03-12
US20030068998A1 (en) 2003-04-10
CN1226803C (zh) 2005-11-09
EP1291954A3 (de) 2003-11-19
CN1407651A (zh) 2003-04-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8339 Ceased/non-payment of the annual fee