DE60011200D1 - Härtbare zweikomponenten-zusammensetzung und härtungsmittel dafür - Google Patents

Härtbare zweikomponenten-zusammensetzung und härtungsmittel dafür

Info

Publication number
DE60011200D1
DE60011200D1 DE60011200T DE60011200T DE60011200D1 DE 60011200 D1 DE60011200 D1 DE 60011200D1 DE 60011200 T DE60011200 T DE 60011200T DE 60011200 T DE60011200 T DE 60011200T DE 60011200 D1 DE60011200 D1 DE 60011200D1
Authority
DE
Germany
Prior art keywords
curable
curing agent
component composition
agent therefor
therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60011200T
Other languages
English (en)
Other versions
DE60011200T2 (de
Inventor
Hiroshi Ando
Yoshiteru Masaoka
Atsushi Fukunaga
Fumio Kawakubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaneka Corp
Original Assignee
Kaneka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka Corp filed Critical Kaneka Corp
Application granted granted Critical
Publication of DE60011200D1 publication Critical patent/DE60011200D1/de
Publication of DE60011200T2 publication Critical patent/DE60011200T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/544Silicon-containing compounds containing nitrogen
    • C08K5/5455Silicon-containing compounds containing nitrogen containing at least one group
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4085Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/681Metal alcoholates, phenolates or carboxylates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32Polymers modified by chemical after-treatment
    • C08G65/329Polymers modified by chemical after-treatment with organic compounds
    • C08G65/336Polymers modified by chemical after-treatment with organic compounds containing silicon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/0008Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0016Plasticisers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/01Hydrocarbons
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/05Alcohols; Metal alcoholates
    • C08K5/053Polyhydroxylic alcohols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/06Ethers; Acetals; Ketals; Ortho-esters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/10Esters; Ether-esters
    • C08K5/12Esters; Ether-esters of cyclic polycarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • C08L101/02Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C08L101/10Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
DE60011200T 1999-03-24 2000-03-22 Härtbare zweikomponenten-zusammensetzung und härtungsmittel dafür Expired - Lifetime DE60011200T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP7953399 1999-03-24
JP7953399 1999-03-24
PCT/JP2000/001750 WO2000056817A1 (fr) 1999-03-24 2000-03-22 Composition durcissable a deux composants et durcisseur associe

Publications (2)

Publication Number Publication Date
DE60011200D1 true DE60011200D1 (de) 2004-07-08
DE60011200T2 DE60011200T2 (de) 2005-07-07

Family

ID=13692641

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60011200T Expired - Lifetime DE60011200T2 (de) 1999-03-24 2000-03-22 Härtbare zweikomponenten-zusammensetzung und härtungsmittel dafür

Country Status (6)

Country Link
US (1) US6703442B1 (de)
EP (1) EP1090960B1 (de)
JP (1) JP4628548B2 (de)
CA (1) CA2333399A1 (de)
DE (1) DE60011200T2 (de)
WO (1) WO2000056817A1 (de)

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EP1041119B1 (de) * 1999-03-29 2006-08-16 Kaneka Corporation Härtbare Harzzusammensetzungen, geeignet zur Formulierung in einer Packung
JP2001311056A (ja) 2000-04-28 2001-11-09 Kanegafuchi Chem Ind Co Ltd 被着体の接着方法
US6664323B2 (en) * 2001-02-02 2003-12-16 General Electric Company Moisture curable sealants
CN102408646A (zh) 2001-09-25 2012-04-11 埃克森美孚化学专利公司 增塑聚氯乙烯
JP4101632B2 (ja) * 2002-11-01 2008-06-18 株式会社カネカ 硬化性組成物および復元性、クリープ性改善方法
CA2509837C (en) * 2002-12-20 2010-10-19 The Sherwin-Williams Company Coating composition
WO2004099318A1 (ja) * 2003-05-12 2004-11-18 Kaneka Corporation 硬化性組成物
JPWO2005017045A1 (ja) * 2003-08-13 2007-10-04 サンスター技研株式会社 2液硬化性組成物
IE20030601A1 (en) * 2003-08-14 2005-02-23 Loctite R & D Ltd Curable compositions having a reduced enthalpy output
US8003744B2 (en) * 2003-08-25 2011-08-23 Kaneka Corporation Curing composition with improved heat resistance
EP1734079B1 (de) * 2004-04-01 2016-01-20 Kaneka Corporation Einkomponentige härtbare zusammensetzung
WO2005097908A1 (ja) * 2004-04-01 2005-10-20 Kaneka Corporation 1液型硬化性組成物
DE102004022150A1 (de) * 2004-05-05 2005-12-01 Henkel Kgaa Zweikomponenten-Kleb-/ und Dichtstoff
WO2005121255A1 (ja) 2004-06-09 2005-12-22 Kaneka Corporation 硬化性組成物
WO2006006512A1 (ja) * 2004-07-14 2006-01-19 Kaneka Corporation 硬化性組成物
EP1832626B1 (de) 2004-12-28 2012-06-13 Kaneka Corporation Härtbare zusammensetzung
US8759435B2 (en) * 2005-04-15 2014-06-24 Kaneka Corporation Curable composition and cured article excellent in transparency
FR2887552B1 (fr) * 2005-06-24 2007-10-12 Rhodia Chimie Sa Utilisation d'une composition organopolysiloxanique vulcanisable des la temperature ambiante pour former un elastomere auto adherent
EP1939256B1 (de) * 2005-09-30 2012-02-15 Kaneka Corporation Härtbare zusammensetzung
US8013079B2 (en) * 2005-09-30 2011-09-06 Kaneka Corporation Curable composition
EP2366733B1 (de) 2005-09-30 2014-10-22 Kaneka Corporation Härtbare Zusammensetzung, mit verbesserter Härtbarkeit und Lagerungsstabilität
DE102006022834A1 (de) * 2006-05-16 2007-11-22 Wacker Chemie Ag Verbesserung der elastischen Rückstellung bei alkoxysilanvernetzten Polymeren
DE102006059473A1 (de) 2006-12-14 2008-06-19 Henkel Kgaa Silylgruppen enthaltende Mischung von Prepolymeren und deren Verwendung
GB0714256D0 (en) * 2007-07-23 2007-08-29 Dow Corning Moisture curing elastomer compositions
GB0721958D0 (en) * 2007-11-08 2007-12-19 Tremco Illbruck Internat Gmbh Insulating glass sealant
US7781513B2 (en) * 2007-11-14 2010-08-24 Momentive Performance Materials Inc. Two-part moisture-curable resin composition and adhesive, sealant and coating compositions based thereon
US8637157B2 (en) 2011-02-28 2014-01-28 Momentive Performance Materials Inc. Copolycarbonates, their derivatives and the use thereof in silicone hardcoat compositions
US9593271B2 (en) 2011-09-22 2017-03-14 Kaneka Corporation Curable composition and cured product thereof
CN102391819B (zh) * 2011-10-08 2013-11-06 北京天山新材料技术股份有限公司 快固化耐湿热老化的双组份密封粘接剂及其制备工艺
DE102012206489A1 (de) * 2012-04-19 2013-10-24 Wacker Chemie Ag Härterzusammensetzungen für kondensationsvernetzende RTV-2-Systeme
WO2014131757A1 (de) 2013-02-26 2014-09-04 Sika Technology Ag Zweikomponentige zusammensetzung
EP2806001A1 (de) 2013-05-21 2014-11-26 PPG Industries Ohio Inc. Beschichtungszusammensetzung
DE102013216787A1 (de) 2013-08-23 2015-02-26 Evonik Degussa Gmbh Guanidingruppen aufweisende semi-organische Siliciumgruppen enthaltende Verbindungen
DE102013216777A1 (de) 2013-08-23 2015-02-26 Evonik Industries Ag Bei Raumtemperatur härtbare Silikonharz-Zusammensetzungen
JP6237513B2 (ja) * 2014-07-14 2017-11-29 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物
CN107075119B (zh) * 2014-09-30 2021-01-05 株式会社钟化 硅氧烷树脂的制造方法
KR101946448B1 (ko) * 2018-08-07 2019-02-11 주식회사 한국씨앤에스 복층유리용 폴리설파이드 실란트 조성물
WO2020092483A1 (en) 2018-10-31 2020-05-07 Dow Silicones Corporation Adhesive
EP3874002A4 (de) * 2018-10-31 2022-06-01 Dow Silicones Corporation Klebstoff
KR102688786B1 (ko) * 2019-02-14 2024-07-26 와커 헤미 아게 오르가닐옥시실란 말단 중합체를 베이스로 하는 다성분 가교성 물질
CA3161841C (en) * 2019-12-17 2024-03-12 Jiang PENG Sealant composition

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Also Published As

Publication number Publication date
EP1090960A4 (de) 2002-01-09
WO2000056817A1 (fr) 2000-09-28
EP1090960A1 (de) 2001-04-11
JP4628548B2 (ja) 2011-02-09
US6703442B1 (en) 2004-03-09
DE60011200T2 (de) 2005-07-07
EP1090960B1 (de) 2004-06-02
CA2333399A1 (en) 2000-09-28

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