DE60022539D1 - Harzzusammensetzung und flexible leiterplattenanordung - Google Patents

Harzzusammensetzung und flexible leiterplattenanordung

Info

Publication number
DE60022539D1
DE60022539D1 DE60022539T DE60022539T DE60022539D1 DE 60022539 D1 DE60022539 D1 DE 60022539D1 DE 60022539 T DE60022539 T DE 60022539T DE 60022539 T DE60022539 T DE 60022539T DE 60022539 D1 DE60022539 D1 DE 60022539D1
Authority
DE
Germany
Prior art keywords
resin composition
flexible pcb
pcb assembly
assembly
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60022539T
Other languages
English (en)
Other versions
DE60022539T2 (de
Inventor
Akiyoshi Kawaguchi
Yoshiaki Ishii
Hideyuki Tsutsumi
Tomohiro Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Otsuka Chemical Co Ltd
Mitsubishi Plastics Inc
Original Assignee
Otsuka Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Otsuka Chemical Co Ltd filed Critical Otsuka Chemical Co Ltd
Publication of DE60022539D1 publication Critical patent/DE60022539D1/de
Application granted granted Critical
Publication of DE60022539T2 publication Critical patent/DE60022539T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/016—Additives defined by their aspect ratio
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE2000622539 1999-11-30 2000-11-29 Harzzusammensetzung und flexible leiterplattenanordung Expired - Lifetime DE60022539T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP34124699 1999-11-30
JP34124799 1999-11-30
JP34124699 1999-11-30
JP34124799 1999-11-30
PCT/JP2000/008414 WO2001040380A1 (fr) 1999-11-30 2000-11-29 Composition de resine et carte de circuit imprime souple

Publications (2)

Publication Number Publication Date
DE60022539D1 true DE60022539D1 (de) 2005-10-13
DE60022539T2 DE60022539T2 (de) 2006-06-29

Family

ID=26576925

Family Applications (2)

Application Number Title Priority Date Filing Date
DE2000622539 Expired - Lifetime DE60022539T2 (de) 1999-11-30 2000-11-29 Harzzusammensetzung und flexible leiterplattenanordung
DE2000632647 Expired - Lifetime DE60032647T2 (de) 1999-11-30 2000-11-29 Harzzusammensetzung und flexible Leiterplattenanordnung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE2000632647 Expired - Lifetime DE60032647T2 (de) 1999-11-30 2000-11-29 Harzzusammensetzung und flexible Leiterplattenanordnung

Country Status (8)

Country Link
US (3) US7361705B2 (de)
EP (2) EP1479729B1 (de)
JP (1) JP4017394B2 (de)
KR (1) KR100529640B1 (de)
CN (1) CN1181139C (de)
AU (1) AU1648701A (de)
DE (2) DE60022539T2 (de)
WO (1) WO2001040380A1 (de)

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EP1479729B1 (de) * 1999-11-30 2006-12-27 Otsuka Chemical Company, Limited Harzzusammensetzung und flexible Leiterplattenanordung
JP2002012778A (ja) * 2000-04-12 2002-01-15 Sumitomo Chem Co Ltd 液晶性樹脂組成物、フィルム及びそれらの製造方法
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JP3914858B2 (ja) * 2002-11-13 2007-05-16 出光興産株式会社 熱可塑性樹脂組成物配合用酸化チタン、熱可塑性樹脂組成物及びその成形体
US20060121272A1 (en) * 2003-01-29 2006-06-08 Tesa Ag Thermo-activated adhesive material for fpcb agglutinations
KR20060112587A (ko) * 2003-10-06 2006-11-01 신꼬오덴기 고교 가부시키가이샤 수지층에 비어홀을 형성하는 방법
JP2005194491A (ja) * 2003-12-09 2005-07-21 Mitsubishi Plastics Ind Ltd 樹脂組成物及びこれを用いた樹脂フィルム
JP2005220335A (ja) * 2004-01-09 2005-08-18 Mitsubishi Plastics Ind Ltd 樹脂組成物及びこれを用いた成形体
US7126215B2 (en) * 2004-03-30 2006-10-24 Intel Corporation Microelectronic packages including nanocomposite dielectric build-up materials and nanocomposite solder resist
KR101146958B1 (ko) * 2004-04-02 2012-05-22 동우 화인켐 주식회사 조성물, 조성물 용액 및 성형물
JP2005314523A (ja) * 2004-04-28 2005-11-10 Sumitomo Chemical Co Ltd 組成物、組成物溶液ならびに成形物
JP2006137011A (ja) * 2004-11-10 2006-06-01 Kuraray Co Ltd 金属張積層体およびその製造方法
JP4873903B2 (ja) * 2005-08-19 2012-02-08 三菱樹脂株式会社 熱可塑性樹脂フィルム及びその製造方法
US7651744B2 (en) * 2005-10-19 2010-01-26 Industrial Technology Research Institute Liquid crystal display
US7662449B2 (en) * 2005-11-22 2010-02-16 Industrial Technology Research Institute Liquid crystal display
KR100791421B1 (ko) 2006-08-10 2008-01-07 정재현 고품위 마이카 파우더의 제조방법
CN101583672A (zh) * 2007-01-18 2009-11-18 日本化学工业株式会社 无机填料和使用该无机填料的复合电介质材料
DE102007021896A1 (de) * 2007-05-10 2008-11-20 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Flexibles Leiterplattenmaterial und Verfahren zum Herstellen desselben
EP2209842A1 (de) * 2007-10-19 2010-07-28 Saint-Gobain Ceramics & Plastics, Inc. Anwendungen von geformtem nanoaluminiumoxidhydrat als barriereeigenschaftsverbesserer in polymeren
WO2009126532A2 (en) * 2008-04-11 2009-10-15 3M Innovative Properties Company Transparent adhesive sheet and image display device including the same
JP2009298832A (ja) * 2008-06-10 2009-12-24 Mitsubishi Plastics Inc 白色フィルム及び金属積層体
US8460768B2 (en) * 2008-12-17 2013-06-11 Saint-Gobain Ceramics & Plastics, Inc. Applications of shaped nano alumina hydrate in inkjet paper
JP2010275331A (ja) * 2009-05-26 2010-12-09 Mitsubishi Plastics Inc 白色フィルム、金属積層体及びｌｅｄ搭載用基板
JP2010275333A (ja) * 2009-05-26 2010-12-09 Mitsubishi Plastics Inc 白色フィルム、金属積層体及びｌｅｄ搭載用基板
JP5230532B2 (ja) * 2009-05-29 2013-07-10 三菱樹脂株式会社 白色フィルム、金属積層体、ｌｅｄ搭載用基板及び光源装置
DE102009045892A1 (de) 2009-10-21 2011-04-28 Evonik Degussa Gmbh Folie aus Polyarylenetherketon
JP5136720B2 (ja) 2011-04-06 2013-02-06 東レ株式会社 液晶性ポリエステル樹脂組成物およびそれを用いた金属複合成形品
DE102011007837A1 (de) * 2011-04-21 2012-10-25 Evonik Degussa Gmbh Kleberloser Verbund aus einer Polyarylenetherketon- und einer Metallfolie
WO2013080566A1 (ja) 2011-12-01 2013-06-06 東レ株式会社 ポリフェニレンスルフィド樹脂組成物、その製造方法、および反射板
DE102012008471B4 (de) 2012-04-27 2018-05-24 Sartorius Stedim Biotech Gmbh Filterelement mit verbesserter Prüfbarkeit nach trockenem Bedampfen, Verfahren zu dessen Herstellung und dessen Verwendung
JP6405818B2 (ja) * 2014-09-16 2018-10-17 株式会社村田製作所 電子回路基板用フィルムおよび電子回路基板
CN105916292A (zh) * 2016-06-16 2016-08-31 常州市超顺电子技术有限公司 可折弯的铝基覆铜板及其用途和制备方法
WO2020213527A1 (ja) * 2019-04-19 2020-10-22 信越ポリマー株式会社 樹脂フィルム、高周波回路基板及びその製造方法

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Also Published As

Publication number Publication date
EP1479729A1 (de) 2004-11-24
US20080099725A1 (en) 2008-05-01
AU1648701A (en) 2001-06-12
DE60032647T2 (de) 2007-10-18
DE60032647D1 (de) 2007-02-08
JP4017394B2 (ja) 2007-12-05
US20090159847A1 (en) 2009-06-25
US7737207B2 (en) 2010-06-15
EP1234857A1 (de) 2002-08-28
CN1181139C (zh) 2004-12-22
US20030078333A1 (en) 2003-04-24
US7361705B2 (en) 2008-04-22
EP1479729B1 (de) 2006-12-27
EP1234857A4 (de) 2003-01-08
CN1402760A (zh) 2003-03-12
EP1234857B1 (de) 2005-09-07
WO2001040380A1 (fr) 2001-06-07
DE60022539T2 (de) 2006-06-29
KR100529640B1 (ko) 2005-11-22
KR20020058061A (ko) 2002-07-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: MITSUBISHI PLASTICS, INC., TOKIO/TOKYO, JP

Owner name: OTSUKA CHEMICAL CO., LTD., OSAKA, JP