DE60005156D1 - Verteilte schnittstelle zur parallelen prüfung von mehreren vorrichtungen, wobei nur ein einzelner testkanal benutzt wird - Google Patents

Verteilte schnittstelle zur parallelen prüfung von mehreren vorrichtungen, wobei nur ein einzelner testkanal benutzt wird

Info

Publication number
DE60005156D1
DE60005156D1 DE60005156T DE60005156T DE60005156D1 DE 60005156 D1 DE60005156 D1 DE 60005156D1 DE 60005156 T DE60005156 T DE 60005156T DE 60005156 T DE60005156 T DE 60005156T DE 60005156 D1 DE60005156 D1 DE 60005156D1
Authority
DE
Germany
Prior art keywords
multiple devices
single test
test channel
parallel testing
distributed interface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60005156T
Other languages
English (en)
Other versions
DE60005156T2 (de
Inventor
S Roy
A Miller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FormFactor Inc filed Critical FormFactor Inc
Application granted granted Critical
Publication of DE60005156D1 publication Critical patent/DE60005156D1/de
Publication of DE60005156T2 publication Critical patent/DE60005156T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/48—Arrangements in static stores specially adapted for testing by means external to the store, e.g. using direct memory access [DMA] or using auxiliary access paths
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31917—Stimuli generation or application of test patterns to the device under test [DUT]
    • G01R31/31926—Routing signals to or from the device under test [DUT], e.g. switch matrix, pin multiplexing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/3193—Tester hardware, i.e. output processing circuits with comparison between actual response and known fault free response
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/56—External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • G11C29/18—Address generation devices; Devices for accessing memories, e.g. details of addressing circuits
    • G11C29/26—Accessing multiple arrays
    • G11C2029/2602—Concurrent test
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/56—External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
    • G11C2029/5606—Error catch memory
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • For Increasing The Reliability Of Semiconductor Memories (AREA)
  • Test And Diagnosis Of Digital Computers (AREA)
  • Measuring Leads Or Probes (AREA)
DE60005156T 1999-03-01 2000-02-24 Verteilte schnittstelle zur parallelen prüfung von mehreren vorrichtungen, wobei nur ein einzelner testkanal benutzt wird Expired - Lifetime DE60005156T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/260,463 US6499121B1 (en) 1999-03-01 1999-03-01 Distributed interface for parallel testing of multiple devices using a single tester channel
US260463 1999-03-01
PCT/US2000/004865 WO2000052488A1 (en) 1999-03-01 2000-02-24 Distributed interface for parallel testing of multiple devices using a single tester channel

Publications (2)

Publication Number Publication Date
DE60005156D1 true DE60005156D1 (de) 2003-10-16
DE60005156T2 DE60005156T2 (de) 2004-07-22

Family

ID=22989269

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60005156T Expired - Lifetime DE60005156T2 (de) 1999-03-01 2000-02-24 Verteilte schnittstelle zur parallelen prüfung von mehreren vorrichtungen, wobei nur ein einzelner testkanal benutzt wird

Country Status (8)

Country Link
US (2) US6499121B1 (de)
EP (2) EP1159630B1 (de)
JP (2) JP2002538465A (de)
KR (1) KR100599348B1 (de)
AU (1) AU3245900A (de)
DE (1) DE60005156T2 (de)
TW (1) TW548420B (de)
WO (1) WO2000052488A1 (de)

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WO2000052488A1 (en) 2000-09-08
DE60005156T2 (de) 2004-07-22
EP1369700A3 (de) 2004-03-10
US20030126534A1 (en) 2003-07-03
KR20010104719A (ko) 2001-11-26
EP1159630B1 (de) 2003-09-10
KR100599348B1 (ko) 2006-07-12
US6499121B1 (en) 2002-12-24
AU3245900A (en) 2000-09-21
US6678850B2 (en) 2004-01-13
JP2002174669A (ja) 2002-06-21
EP1159630A1 (de) 2001-12-05
JP2002538465A (ja) 2002-11-12
TW548420B (en) 2003-08-21

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