DE502005009279D1 - Schmelzsicherung für einen chip - Google Patents

Schmelzsicherung für einen chip

Info

Publication number
DE502005009279D1
DE502005009279D1 DE502005009279T DE502005009279T DE502005009279D1 DE 502005009279 D1 DE502005009279 D1 DE 502005009279D1 DE 502005009279 T DE502005009279 T DE 502005009279T DE 502005009279 T DE502005009279 T DE 502005009279T DE 502005009279 D1 DE502005009279 D1 DE 502005009279D1
Authority
DE
Germany
Prior art keywords
intermediate layer
metallic conductor
thermal conductivity
carrier substrate
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE502005009279T
Other languages
English (en)
Inventor
Werner Blum
Reiner Friedrich
Wolfgang Werner
Reimer Hinrichs
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vishay BCcomponents Beyschlag GmbH
Original Assignee
Vishay BCcomponents Beyschlag GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vishay BCcomponents Beyschlag GmbH filed Critical Vishay BCcomponents Beyschlag GmbH
Publication of DE502005009279D1 publication Critical patent/DE502005009279D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046—Fuses formed as printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
    • H01H69/02—Manufacture of fuses
    • H01H69/022—Manufacture of fuses of printed circuit fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/0039—Means for influencing the rupture process of the fusible element
    • H01H85/0047—Heating means
    • H01H85/006—Heat reflective or insulating layer on the casing or on the fuse support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/0411—Miniature fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/0411—Miniature fuses
    • H01H2085/0414—Surface mounted fuses
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49107—Fuse making

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Fuses (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
  • Polysaccharides And Polysaccharide Derivatives (AREA)
DE502005009279T 2004-07-08 2005-06-27 Schmelzsicherung für einen chip Active DE502005009279D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004033251A DE102004033251B3 (de) 2004-07-08 2004-07-08 Schmelzsicherung für einem Chip
PCT/EP2005/006894 WO2006005435A1 (de) 2004-07-08 2005-06-27 Schmelzsicherung für einen chip

Publications (1)

Publication Number Publication Date
DE502005009279D1 true DE502005009279D1 (de) 2010-05-06

Family

ID=35414553

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102004033251A Active DE102004033251B3 (de) 2004-07-08 2004-07-08 Schmelzsicherung für einem Chip
DE502005009279T Active DE502005009279D1 (de) 2004-07-08 2005-06-27 Schmelzsicherung für einen chip

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102004033251A Active DE102004033251B3 (de) 2004-07-08 2004-07-08 Schmelzsicherung für einem Chip

Country Status (9)

Country Link
US (2) US9368308B2 (de)
EP (1) EP1766648B1 (de)
JP (1) JP2008505466A (de)
KR (1) KR101128250B1 (de)
CN (1) CN101010768B (de)
AT (1) ATE462194T1 (de)
DE (2) DE102004033251B3 (de)
TW (1) TWI413146B (de)
WO (1) WO2006005435A1 (de)

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* Cited by examiner, † Cited by third party
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DE102004033251B3 (de) 2004-07-08 2006-03-09 Vishay Bccomponents Beyschlag Gmbh Schmelzsicherung für einem Chip
TWI323906B (en) * 2007-02-14 2010-04-21 Besdon Technology Corp Chip-type fuse and method of manufacturing the same
DE102007014334A1 (de) * 2007-03-26 2008-10-02 Robert Bosch Gmbh Schmelzlegierungselement, Thermosicherung mit einem Schmelzlegierungselement sowie Verfahren zum Herstellen einer Thermosicherung
US20090009281A1 (en) * 2007-07-06 2009-01-08 Cyntec Company Fuse element and manufacturing method thereof
JP4510858B2 (ja) * 2007-08-08 2010-07-28 釜屋電機株式会社 チップヒューズ及びその製造方法
JP5287154B2 (ja) * 2007-11-08 2013-09-11 パナソニック株式会社 回路保護素子およびその製造方法
US9190235B2 (en) * 2007-12-29 2015-11-17 Cooper Technologies Company Manufacturability of SMD and through-hole fuses using laser process
US20110163840A1 (en) * 2008-10-28 2011-07-07 Nanjing Sart Science & Technology Development Co., Ltd. High reliability blade fuse and the manufacturing method thereof
CN102891051B (zh) * 2011-07-22 2017-04-12 阿提瓦公司 并排保险丝组件及具该并排保险丝组件的电池阵列
CN107492473B (zh) * 2017-08-17 2019-01-04 中国振华集团云科电子有限公司 片式熔断器阻挡层的加工方法
US11636993B2 (en) 2019-09-06 2023-04-25 Eaton Intelligent Power Limited Fabrication of printed fuse

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JPS5915394B2 (ja) * 1978-08-31 1984-04-09 富士通株式会社 厚膜微細パタ−ン生成方法
JPS57138961A (en) * 1981-02-23 1982-08-27 Fujitsu Ltd Crossover formation for thermal head
US4685203A (en) * 1983-09-13 1987-08-11 Mitsubishi Denki Kabushiki Kaisha Hybrid integrated circuit substrate and method of manufacturing the same
US4626818A (en) * 1983-11-28 1986-12-02 Centralab, Inc. Device for programmable thick film networks
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JPH09129115A (ja) 1995-10-30 1997-05-16 Kyocera Corp チップヒューズ
JPH09153328A (ja) * 1995-11-30 1997-06-10 Kyocera Corp チップヒューズ
US5699032A (en) * 1996-06-07 1997-12-16 Littelfuse, Inc. Surface-mount fuse having a substrate with surfaces and a metal strip attached to the substrate using layer of adhesive material
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JP2003173728A (ja) * 2001-12-06 2003-06-20 Koa Corp チップ型電流ヒューズの製造方法
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JP2004265618A (ja) * 2003-02-05 2004-09-24 Sony Chem Corp 保護素子
JP2003234057A (ja) * 2003-03-10 2003-08-22 Koa Corp ヒューズ抵抗器およびその製造方法
US8680443B2 (en) * 2004-01-06 2014-03-25 Watlow Electric Manufacturing Company Combined material layering technologies for electric heaters
DE102004033251B3 (de) 2004-07-08 2006-03-09 Vishay Bccomponents Beyschlag Gmbh Schmelzsicherung für einem Chip
US8976001B2 (en) * 2010-11-08 2015-03-10 Cyntec Co., Ltd. Protective device

Also Published As

Publication number Publication date
US9368308B2 (en) 2016-06-14
US20080303626A1 (en) 2008-12-11
EP1766648B1 (de) 2010-03-24
US20160372293A1 (en) 2016-12-22
EP1766648A1 (de) 2007-03-28
JP2008505466A (ja) 2008-02-21
WO2006005435A1 (de) 2006-01-19
TWI413146B (zh) 2013-10-21
KR101128250B1 (ko) 2012-03-23
DE102004033251B3 (de) 2006-03-09
KR20070038143A (ko) 2007-04-09
CN101010768A (zh) 2007-08-01
ATE462194T1 (de) 2010-04-15
US10354826B2 (en) 2019-07-16
TW200612453A (en) 2006-04-16
CN101010768B (zh) 2011-03-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition