TW200943663A - A semiconductor integrated circuit - Google Patents
A semiconductor integrated circuitInfo
- Publication number
- TW200943663A TW200943663A TW098102880A TW98102880A TW200943663A TW 200943663 A TW200943663 A TW 200943663A TW 098102880 A TW098102880 A TW 098102880A TW 98102880 A TW98102880 A TW 98102880A TW 200943663 A TW200943663 A TW 200943663A
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor chip
- integrated circuit
- semiconductor integrated
- electronic components
- end connected
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/647—Resistive arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/62—Protection against overvoltage, e.g. fuses, shunts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/46—Accumulators structurally combined with charging apparatus
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/0029—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with safety or protection devices or circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Charge And Discharge Circuits For Batteries Or The Like (AREA)
- Semiconductor Integrated Circuits (AREA)
- Protection Of Static Devices (AREA)
- Secondary Cells (AREA)
Abstract
This invention is a semiconductor integrated circuit with a reduced number of electronic components, and a reduced production cost, and a reduced installation surface area. A single semiconductor chip is packaged, or a single semiconductor chip along with its surrounding electronic components all together is installed onto a substrate. The semiconductor integrated circuit that is molded by an insulating material has a current limiting resistor (R10) inside the aforementioned semiconductor chip having one end connected to an external terminal of the semiconductor chip and the other end connected to a diode (D1) for electrostatic protection; and a fuse (FS) inside the aforementioned semiconductor chip in parallel between the two ends of the current limiting resistor (R10).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008025286A JP5286809B2 (en) | 2008-02-05 | 2008-02-05 | Semiconductor integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200943663A true TW200943663A (en) | 2009-10-16 |
Family
ID=40977116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW098102880A TW200943663A (en) | 2008-02-05 | 2009-01-23 | A semiconductor integrated circuit |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5286809B2 (en) |
KR (1) | KR101028784B1 (en) |
CN (1) | CN101504943B (en) |
TW (1) | TW200943663A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103023005A (en) * | 2012-11-30 | 2013-04-03 | 无锡中星微电子有限公司 | Electrostatic protection circuit and battery protection circuit |
US9940986B2 (en) | 2015-12-16 | 2018-04-10 | Globalfoundries Inc. | Electrostatic discharge protection structures for eFuses |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102397624A (en) * | 2010-09-17 | 2012-04-04 | 鼎迈医疗科技(苏州)有限公司 | Implanted active electronic device with overcurrent protection circuit and electrical stimulation system |
CN103378070B (en) * | 2012-04-16 | 2016-04-13 | 富士电机株式会社 | Semiconductor device |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2563783B2 (en) * | 1986-10-22 | 1996-12-18 | セイコーエプソン株式会社 | Static electricity protection circuit |
JPH09219521A (en) * | 1997-03-24 | 1997-08-19 | Seiko Epson Corp | Semiconductor device |
JP2001189428A (en) * | 1999-10-19 | 2001-07-10 | Citizen Watch Co Ltd | Protective circuit of semiconductor integrated circuit |
KR100450181B1 (en) * | 2002-04-15 | 2004-09-24 | 삼성에스디아이 주식회사 | A battery pack having a second protection circuit isolated spatially |
JP3958269B2 (en) * | 2003-09-09 | 2007-08-15 | 日本テキサス・インスツルメンツ株式会社 | Demodulator and data recording apparatus having the same |
JP4046106B2 (en) * | 2004-06-16 | 2008-02-13 | 株式会社村田製作所 | Battery pack protection circuit and battery pack |
JP2006073553A (en) * | 2004-08-31 | 2006-03-16 | Nec Electronics Corp | Fuse trimming circuit |
JP2007088192A (en) * | 2005-09-22 | 2007-04-05 | Sanyo Electric Co Ltd | Semiconductor device |
-
2008
- 2008-02-05 JP JP2008025286A patent/JP5286809B2/en active Active
- 2008-10-29 KR KR1020080106281A patent/KR101028784B1/en active IP Right Grant
-
2009
- 2009-01-20 CN CN200910005434XA patent/CN101504943B/en active Active
- 2009-01-23 TW TW098102880A patent/TW200943663A/en unknown
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103023005A (en) * | 2012-11-30 | 2013-04-03 | 无锡中星微电子有限公司 | Electrostatic protection circuit and battery protection circuit |
CN103023005B (en) * | 2012-11-30 | 2015-02-04 | 无锡中星微电子有限公司 | Electrostatic protection circuit and battery protection circuit |
US9940986B2 (en) | 2015-12-16 | 2018-04-10 | Globalfoundries Inc. | Electrostatic discharge protection structures for eFuses |
Also Published As
Publication number | Publication date |
---|---|
CN101504943B (en) | 2012-07-04 |
KR101028784B1 (en) | 2011-04-14 |
KR20090086019A (en) | 2009-08-10 |
JP2009189127A (en) | 2009-08-20 |
JP5286809B2 (en) | 2013-09-11 |
CN101504943A (en) | 2009-08-12 |
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