ATE554486T1 - CERAMIC CHIP ARRANGEMENT - Google Patents

CERAMIC CHIP ARRANGEMENT

Info

Publication number
ATE554486T1
ATE554486T1 AT09012025T AT09012025T ATE554486T1 AT E554486 T1 ATE554486 T1 AT E554486T1 AT 09012025 T AT09012025 T AT 09012025T AT 09012025 T AT09012025 T AT 09012025T AT E554486 T1 ATE554486 T1 AT E554486T1
Authority
AT
Austria
Prior art keywords
ceramic base
pair
ceramic
ceramic chip
external electrodes
Prior art date
Application number
AT09012025T
Other languages
German (de)
Inventor
Sun-Ki Kim
Suk-Joo Lee
Original Assignee
Joinset Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Joinset Co Ltd filed Critical Joinset Co Ltd
Application granted granted Critical
Publication of ATE554486T1 publication Critical patent/ATE554486T1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Thermistors And Varistors (AREA)

Abstract

A ceramic chip assembly is provided. The ceramic chip assembly includes a ceramic base, a plurality of external electrodes, a pair of cylindrical metal lead wires, and an insulating protection material. The ceramic base has electrical characteristics of a semiconductor. The pair of external electrodes is oppositely formed on both side surfaces of the ceramic base, respectively. The cylindrical metal lead wire has one end thereof electrically and mechanically connected to the external electrodes by an electrical conductive adhesive, respectively, and has an external diameter identical to or greater than the thickness of the ceramic base. The insulating protection material includes a pair of insulating films and an insulating coating layer.
AT09012025T 2008-10-09 2009-09-22 CERAMIC CHIP ARRANGEMENT ATE554486T1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20080099110 2008-10-09
KR20090060215A KR101038755B1 (en) 2008-10-09 2009-07-02 Ceramic Chip Assembly

Publications (1)

Publication Number Publication Date
ATE554486T1 true ATE554486T1 (en) 2012-05-15

Family

ID=42216414

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09012025T ATE554486T1 (en) 2008-10-09 2009-09-22 CERAMIC CHIP ARRANGEMENT

Country Status (4)

Country Link
JP (1) JP2010093258A (en)
KR (1) KR101038755B1 (en)
CN (1) CN101719418B (en)
AT (1) ATE554486T1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012002523A1 (en) * 2010-07-02 2012-01-05 タイコエレクトロニクスジャパン合同会社 Ptc device and secondary battery having same
KR101036951B1 (en) * 2010-07-28 2011-05-25 김선기 Ceramic chip assembly
KR101008310B1 (en) 2010-07-30 2011-01-13 김선기 Ceramic chip assembly
KR101110482B1 (en) 2011-11-29 2012-02-20 디에스씨전자 주식회사 Highly insulated characteristics negative temperature coefficient thermistor
WO2013170685A1 (en) * 2012-05-14 2013-11-21 深圳市敏杰电子科技有限公司 Surface temperature measuring sensor
JP2013219404A (en) * 2013-08-02 2013-10-24 Sumida Corporation Method for manufacturing antenna component
US9653205B2 (en) * 2014-04-30 2017-05-16 Cyntec Co., Ltd. Electrode structure and the corresponding electrical component using the same and the fabrication method thereof
KR101494634B1 (en) * 2014-08-26 2015-02-23 한국세라믹기술원 Lifetime testing method of thermistor device
CN108028308B (en) * 2015-07-21 2019-07-23 皇家飞利浦有限公司 Transducer layer pressing plate
CN109563653A (en) * 2016-08-04 2019-04-02 株式会社村田制作所 The manufacturing method of electric function component, the textile article for having used the electric function component and electric function component
JP7082539B2 (en) * 2018-07-13 2022-06-08 ニチコン株式会社 PTC thermistor
CN112530650B (en) * 2020-12-22 2022-07-19 湖州浩通电子科技有限公司 Ceramic thermosensitive element

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5797907U (en) * 1980-12-03 1982-06-16
JPS6312125A (en) * 1987-05-22 1988-01-19 太陽誘電株式会社 Manufacture of electronic parts arrangement
JP3150180B2 (en) * 1991-12-19 2001-03-26 ティーディーケイ株式会社 Method for manufacturing a thermistor element
JPH05347201A (en) * 1992-06-15 1993-12-27 Tdk Corp Thin film resistor
CN2144852Y (en) * 1992-10-29 1993-10-27 蔡雅凤 Overcurrent protection quick response forward temp. coefficient thermal resistor
JP3494709B2 (en) * 1994-06-07 2004-02-09 石塚電子株式会社 Temperature sensor and its lead frame
JPH08128901A (en) * 1994-10-31 1996-05-21 Sanyo Electric Co Ltd Temperature sensor and pack battery
KR0174589B1 (en) * 1995-09-07 1999-04-01 우덕창 Leaded NTC Thermistors
JPH09297069A (en) * 1996-05-07 1997-11-18 Tdk Corp Temperature detecting sensor
JPH1154301A (en) * 1997-08-07 1999-02-26 Murata Mfg Co Ltd Chip thermister
JP2001141575A (en) * 1999-11-17 2001-05-25 Matsushita Electric Ind Co Ltd Temperature sensor element and temperature sensor using it
JP3516204B2 (en) * 1999-11-26 2004-04-05 Ｔｄｋ株式会社 How to assemble a sensor for detecting temperature and the sensor
JP4547475B2 (en) * 2004-08-20 2010-09-22 石塚電子株式会社 Flat plate temperature sensor
KR100734788B1 (en) * 2005-11-25 2007-07-04 주식회사 제임스텍 Ntc thermistor temperature sensor and manufacturing method thereof

Also Published As

Publication number Publication date
CN101719418B (en) 2011-08-31
KR101038755B1 (en) 2011-06-03
CN101719418A (en) 2010-06-02
JP2010093258A (en) 2010-04-22
KR20100040241A (en) 2010-04-19

Similar Documents

Publication Publication Date Title
ATE554486T1 (en) CERAMIC CHIP ARRANGEMENT
EA201390096A1 (en) GLASS WITH ELECTRIC CONNECTING ELEMENT
ATE439683T1 (en) CIRCUIT ARRANGEMENT WITH CONNECTION DEVICE AND PRODUCTION METHOD THEREOF
DE502007000284D1 (en) Power semiconductor module with mutually electrically insulated connection elements
ATE532126T1 (en) TOUCH SURFACE WITH INSULATING LAYER
EA201290855A1 (en) WINDOW GLASS WITH ELECTRIC CONNECTING ELEMENT
EP2175457A3 (en) Ceramic chip assembly
EP2343744A3 (en) Light emitting diode with patterned electrodes
GB2484634B (en) Fin anti-fuse with reduced programming voltage
JP2009513026A5 (en)
EP2445006A3 (en) Light-emitting device and method for manufacturing the same
ES2570133T3 (en) Pastes in the form of a thick film containing lead and tellurium oxides and their use in the manufacture of semiconductor devices
JP2013546199A5 (en)
WO2012074783A3 (en) Low-profile microelectronic package, method of manufacturing same, and electronic assembly containing same
EA201490205A1 (en) METHOD OF MANUFACTURING WINDOW GLASS WITH ELECTRIC CONNECTING ELEMENT
EP2093811A3 (en) Package structure of compound semiconductor device and fabricating method thereof
ATE535949T1 (en) MEMORY DEVICE AND CBRAM MEMORY WITH INCREASED RELIABILITY
EA201690890A1 (en) GLASS AT LEAST WITH TWO ELECTRIC CONNECTING ELEMENTS AND CONNECTING CONDUCTOR
FI20065247A (en) Electrical connection and electrical component
GB2532869A (en) Semiconductor die and package jigsaw submount
JP2008103653A5 (en)
TW201130093A (en) Substrate for mounting element, and method for manufacturing the substrate
RU2016133611A (en) INSTALLATION ELECTRICAL WIRE
US10181368B2 (en) Circuit protection device
ATE525731T1 (en) ELECTRICAL CONDUCTOR