DK1956647T3 - Circuit arrangement with connecting device and method for making it - Google Patents
Circuit arrangement with connecting device and method for making itInfo
- Publication number
- DK1956647T3 DK1956647T3 DK08000989T DK08000989T DK1956647T3 DK 1956647 T3 DK1956647 T3 DK 1956647T3 DK 08000989 T DK08000989 T DK 08000989T DK 08000989 T DK08000989 T DK 08000989T DK 1956647 T3 DK1956647 T3 DK 1956647T3
- Authority
- DK
- Denmark
- Prior art keywords
- component
- circuit arrangement
- connection device
- making
- connecting device
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
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- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L24/38—Structure, shape, material or disposition of the strap connectors prior to the connecting process of a plurality of strap connectors
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- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
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- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L24/41—Structure, shape, material or disposition of the strap connectors after the connecting process of a plurality of strap connectors
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- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
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- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
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- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
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- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
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- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/832—Applying energy for connecting
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Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Use Of Switch Circuits For Exchanges And Methods Of Control Of Multiplex Exchanges (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The arrangement has strip conductors (22a, 22b) arranged on a main surface of a substrate (2), and a semiconductor component (3) arranged on one of the conductors. An electrically conductive connection device (4) e.g. metallic foil (40), is provided to contact surfaces (34, 36) of a main surface of the component. An electrical connection of the component with the conductor (22a) and/or the connection device is designed as a print-interconnection. An insulator (6) is arranged between the connection device and an edge of the component. The insulator is made of a silicon compound. An independent claim is also included for a method for manufacturing a circuit arrangement.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007006706A DE102007006706B4 (en) | 2007-02-10 | 2007-02-10 | Circuit arrangement with connecting device and manufacturing method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
DK1956647T3 true DK1956647T3 (en) | 2009-11-09 |
Family
ID=39322584
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK08000989T DK1956647T3 (en) | 2007-02-10 | 2008-01-19 | Circuit arrangement with connecting device and method for making it |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP1956647B1 (en) |
AT (1) | ATE439683T1 (en) |
DE (2) | DE102007006706B4 (en) |
DK (1) | DK1956647T3 (en) |
ES (1) | ES2328188T3 (en) |
PL (1) | PL1956647T3 (en) |
PT (1) | PT1956647E (en) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008017454B4 (en) * | 2008-04-05 | 2010-02-04 | Semikron Elektronik Gmbh & Co. Kg | Power semiconductor module with hermetically sealed circuit arrangement and manufacturing method for this purpose |
DE102008033410B4 (en) * | 2008-07-16 | 2011-06-30 | SEMIKRON Elektronik GmbH & Co. KG, 90431 | Power electronic connection device with a power semiconductor component and manufacturing method for this purpose |
US8293586B2 (en) * | 2008-09-25 | 2012-10-23 | Infineon Technologies Ag | Method of manufacturing an electronic system |
DE102009000888B4 (en) | 2009-02-16 | 2011-03-24 | Semikron Elektronik Gmbh & Co. Kg | A semiconductor device |
DE102009017733B4 (en) | 2009-04-11 | 2011-12-08 | Semikron Elektronik Gmbh & Co. Kg | Power semiconductor module with a connection device and formed as a contact spring internal connection elements |
EP2242094A1 (en) * | 2009-04-17 | 2010-10-20 | Nxp B.V. | Foil and method for foil-based bonding and resulting package |
DE102009020733B4 (en) * | 2009-05-11 | 2011-12-08 | Danfoss Silicon Power Gmbh | Process for the contact sintering of band-shaped contact elements |
DE102009022660B3 (en) * | 2009-05-26 | 2010-09-16 | Semikron Elektronik Gmbh & Co. Kg | Attachment of a component to a substrate and / or a connection element to the component and / or to the substrate by pressure sintering |
DE102009024370B4 (en) * | 2009-06-09 | 2014-04-30 | Semikron Elektronik Gmbh & Co. Kg | Converter arrangement with cooling device and manufacturing method for this purpose |
EP2270855A1 (en) * | 2009-06-29 | 2011-01-05 | ABB Research Ltd. | An electrical module |
DE102010011719A1 (en) | 2010-03-17 | 2011-09-22 | Semikron Elektronik Gmbh & Co. Kg | Method for producing an electrically conductive connection of a contact with a mating contact |
DE102010039824B4 (en) | 2010-08-26 | 2018-03-29 | Semikron Elektronik Gmbh & Co. Kg | Power module with a flexible connection device |
DE102010062547B4 (en) | 2010-12-07 | 2021-10-28 | Semikron Elektronik Gmbh & Co. Kg | Method for producing a circuit arrangement |
DE102011078811B3 (en) * | 2011-07-07 | 2012-05-24 | Semikron Elektronik Gmbh & Co. Kg | Power electronic system with a cooling device |
DE102011078806B4 (en) * | 2011-07-07 | 2014-10-30 | Semikron Elektronik Gmbh & Co. Kg | Manufacturing method for a power electronic system with a cooling device |
DE102012222012B4 (en) | 2012-11-30 | 2017-04-06 | Semikron Elektronik Gmbh & Co. Kg | Power semiconductor device and a method for producing a power semiconductor device |
DE102012222791A1 (en) * | 2012-12-11 | 2014-06-12 | Robert Bosch Gmbh | Method for contacting a semiconductor and semiconductor device with increased stability to thermomechanical influences |
DE102013102828B4 (en) | 2013-03-20 | 2018-04-12 | Semikron Elektronik Gmbh & Co. Kg | Power module with a trained as a film composite connection device |
DE102013104949B3 (en) | 2013-05-14 | 2014-04-24 | Semikron Elektronik Gmbh & Co. Kg | Power electronic switching device and arrangement hereby |
DE102013108185B4 (en) | 2013-07-31 | 2021-09-23 | Semikron Elektronik Gmbh & Co. Kg | Method for producing a power electronic switching device and power electronic switching device |
DE102013215592A1 (en) * | 2013-08-07 | 2015-02-12 | Siemens Aktiengesellschaft | Power electronic circuit with planar electrical contacting |
DE102015103779A1 (en) * | 2015-03-16 | 2016-09-22 | Pac Tech-Packaging Technologies Gmbh | Chip arrangement and method for forming a contact connection |
DE102015116165A1 (en) | 2015-09-24 | 2017-03-30 | Semikron Elektronik Gmbh & Co. Kg | Method for producing a power electronic switching device and power electronic switching device |
DE102015120154B4 (en) | 2015-11-20 | 2023-02-09 | Semikron Elektronik Gmbh & Co. Kg | Power semiconductor device with a substrate and a power semiconductor component |
DE102015120157A1 (en) | 2015-11-20 | 2017-05-24 | Semikron Elektronik Gmbh & Co. Kg | Power electronic switching device with a plurality of potential surfaces |
DE102015120156B4 (en) | 2015-11-20 | 2019-07-04 | Semikron Elektronik Gmbh & Co. Kg | Device for the material connection of connection partners of a Leistungselekronik component and use of such a device |
DE102019113762B4 (en) * | 2019-05-23 | 2022-04-14 | Semikron Elektronik Gmbh & Co. Kg | Process for manufacturing a power semiconductor module |
DE102019126623B4 (en) * | 2019-10-02 | 2024-03-14 | Semikron Elektronik Gmbh & Co. Kg Patentabteilung | Power electronic switching device with a casting compound |
DE102020121033B4 (en) | 2020-08-10 | 2024-08-29 | Semikron Elektronik Gmbh & Co. Kg | Power electronic switching device, power semiconductor module therewith and method for manufacturing |
DE102020122784B4 (en) | 2020-09-01 | 2022-04-28 | Semikron Elektronik Gmbh & Co. Kg | Electronic power switching device with a three-dimensionally preformed insulating body and method for its production |
EP4141922A1 (en) * | 2021-08-26 | 2023-03-01 | Siemens Aktiengesellschaft | Power electronics assembly |
DE102022111579A1 (en) | 2022-05-10 | 2023-11-16 | Semikron Elektronik Gmbh & Co. Kg | Method for producing a power electronic switching device and power electronic switching device |
Family Cites Families (11)
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DE3414065A1 (en) * | 1984-04-13 | 1985-12-12 | Siemens AG, 1000 Berlin und 8000 München | Configuration comprising at least one electronic component fixed on a substrate, and process for fabricating a configuration of this type |
DE19617055C1 (en) * | 1996-04-29 | 1997-06-26 | Semikron Elektronik Gmbh | High-density multilayer prepreg semiconductor power module |
DE10121970B4 (en) * | 2001-05-05 | 2004-05-27 | Semikron Elektronik Gmbh | Power semiconductor module in pressure contact |
CN1575511A (en) | 2001-09-28 | 2005-02-02 | 西门子公司 | Method for contacting electrical contact surfaces of a substrate and device consisting of a substrate having electrical contact surfaces |
DE10221970A1 (en) | 2002-05-17 | 2003-11-27 | Deutsche Telekom Ag | Microscopic investigation of specimens involves using optical detector with resolution in nanometer range by examining image of specimen formed on light converter that converts it to signal pattern |
JP2004281538A (en) | 2003-03-13 | 2004-10-07 | Seiko Epson Corp | Electronic device and its manufacturing method, circuit board and electronic apparatus |
DE10355925B4 (en) * | 2003-11-29 | 2006-07-06 | Semikron Elektronik Gmbh & Co. Kg | Power semiconductor module and method of its manufacture |
DE102004019567B3 (en) * | 2004-04-22 | 2006-01-12 | Semikron Elektronik Gmbh & Co. Kg | Securing electronic components to substrate by subjecting the electronic component, supporting film and paste-like layer to pressure and connecting the substrate and the component by sintering |
JP4613590B2 (en) * | 2004-11-16 | 2011-01-19 | セイコーエプソン株式会社 | Mounting board and electronic equipment |
DE102004057421B4 (en) * | 2004-11-27 | 2009-07-09 | Semikron Elektronik Gmbh & Co. Kg | Pressure-contacted power semiconductor module for high ambient temperatures and method for its production |
DE102005047567B3 (en) * | 2005-10-05 | 2007-03-29 | Semikron Elektronik Gmbh & Co. Kg | Power semiconductor module comprises a housing, connecting elements and an electrically insulated substrate arranged within the housing and semiconductor components with a connecting element and an insulating molded body |
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2007
- 2007-02-10 DE DE102007006706A patent/DE102007006706B4/en active Active
-
2008
- 2008-01-19 AT AT08000989T patent/ATE439683T1/en active
- 2008-01-19 PT PT08000989T patent/PT1956647E/en unknown
- 2008-01-19 EP EP08000989A patent/EP1956647B1/en active Active
- 2008-01-19 DE DE502008000072T patent/DE502008000072D1/en active Active
- 2008-01-19 PL PL08000989T patent/PL1956647T3/en unknown
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Also Published As
Publication number | Publication date |
---|---|
EP1956647A1 (en) | 2008-08-13 |
ES2328188T3 (en) | 2009-11-10 |
DE502008000072D1 (en) | 2009-09-24 |
PT1956647E (en) | 2009-12-07 |
ATE439683T1 (en) | 2009-08-15 |
DE102007006706A1 (en) | 2008-08-21 |
EP1956647B1 (en) | 2009-08-12 |
PL1956647T3 (en) | 2009-12-31 |
DE102007006706B4 (en) | 2011-05-26 |
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