WO2009021741A8 - Organische elektronische bauelemente - Google Patents

Organische elektronische bauelemente Download PDF

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Publication number
WO2009021741A8
WO2009021741A8 PCT/EP2008/006704 EP2008006704W WO2009021741A8 WO 2009021741 A8 WO2009021741 A8 WO 2009021741A8 EP 2008006704 W EP2008006704 W EP 2008006704W WO 2009021741 A8 WO2009021741 A8 WO 2009021741A8
Authority
WO
WIPO (PCT)
Prior art keywords
electronic components
organic electronic
layer
partially
cover element
Prior art date
Application number
PCT/EP2008/006704
Other languages
English (en)
French (fr)
Other versions
WO2009021741A2 (de
WO2009021741A3 (de
Inventor
Olaf Ruediger Hild
Original Assignee
Fraunhofer Ges Forschung
Olaf Ruediger Hild
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102007038324A external-priority patent/DE102007038324A1/de
Application filed by Fraunhofer Ges Forschung, Olaf Ruediger Hild filed Critical Fraunhofer Ges Forschung
Priority to JP2010520493A priority Critical patent/JP2010536155A/ja
Priority to US12/673,219 priority patent/US20110096504A1/en
Publication of WO2009021741A2 publication Critical patent/WO2009021741A2/de
Publication of WO2009021741A3 publication Critical patent/WO2009021741A3/de
Publication of WO2009021741A8 publication Critical patent/WO2009021741A8/de

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8722Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/87Arrangements for heating or cooling
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8423Metallic sealing arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8721Metallic sealing arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/8794Arrangements for heating and cooling

Abstract

Die vorliegende Erfindung bezieht sich auf organische elektronische Bauelemente. Zur Verfügung gestellt wird eine Substratbasis (1) und ein Abdeckelement (5) sowie zumindest teilweise zwischen der Substratbasis und dem Abdeckelement angeordnet: eine erste Elektrode (2), ein mindestens eine zumindest teilweise aus einem organischen Material bestehende Schicht aufweisendes organisches Schichtsystem (3) und eine zweite Elektrode (4), dadurch gekennzeichnet, dass zumindest teilweise zwischen der Substratbasis und dem Abdeckelement angeordnet sind: eine ein Trockenmaterial sowie ein thermisch leitfähiges Material enthaltende Trockenmittelschicht (6) und eine thermisch leitfähige Schicht (7), wobei die Trockenmittelschicht und die thermisch leitfähige Schicht thermisch miteinander gekoppelt sind.
PCT/EP2008/006704 2007-08-14 2008-08-14 Organische elektronische bauelemente WO2009021741A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010520493A JP2010536155A (ja) 2007-08-14 2008-08-14 有機電子素子
US12/673,219 US20110096504A1 (en) 2007-08-14 2008-08-14 Organic Electronic Components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007038324A DE102007038324A1 (de) 2007-08-14 2007-08-14 Organische elektronische Bauelemente
DE102007038324.1 2007-08-14

Publications (3)

Publication Number Publication Date
WO2009021741A2 WO2009021741A2 (de) 2009-02-19
WO2009021741A3 WO2009021741A3 (de) 2009-04-16
WO2009021741A8 true WO2009021741A8 (de) 2009-07-16

Family

ID=39956149

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/006704 WO2009021741A2 (de) 2007-08-14 2008-08-14 Organische elektronische bauelemente

Country Status (4)

Country Link
US (1) US20110096504A1 (de)
JP (1) JP2010536155A (de)
DE (1) DE102007063656A1 (de)
WO (1) WO2009021741A2 (de)

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US9797567B2 (en) 2008-12-11 2017-10-24 Osram Oled Gmbh Organic-light-emitting diode and luminaire
WO2011049141A1 (ja) * 2009-10-21 2011-04-28 シャープ株式会社 有機エレクトロルミネッセンス素子を用いた発光装置、およびその製造方法、ならびに該発光装置を備えた有機エレクトロルミネッセンス表示装置
JP5732735B2 (ja) * 2010-03-29 2015-06-10 住友化学株式会社 発光装置
WO2012030421A1 (en) * 2010-05-25 2012-03-08 Qd Vision, Inc. Devices and methods
DE102010047397A1 (de) 2010-10-02 2012-04-05 Alanod Aluminium-Veredlung Gmbh & Co. Kg Organisches optisches Bauelement, sowie Verfahren und Halbzeug zu seiner Herstellung
DE202010017703U1 (de) 2010-10-02 2012-06-27 Alanod Aluminium-Veredlung Gmbh & Co. Kg Organisches optisches Bauelement, sowie Halbzeug zu seiner Herstellung
JP5638924B2 (ja) * 2010-11-29 2014-12-10 ローム株式会社 有機発光素子
KR101869062B1 (ko) * 2011-03-04 2018-06-20 삼성디스플레이 주식회사 유기 발광 디스플레이 장치
DE102011084276B4 (de) * 2011-10-11 2019-10-10 Osram Oled Gmbh Verkapselung für ein organisches elektronisches bauelement, ein organisches elektronisches bauelement mit der verkapselung und ein verfahren zur herstellung eines organischen elektronischen bauelements mit der verkapselung
US20130091866A1 (en) 2011-10-12 2013-04-18 International Business Machines Corporation Thermoelectric-enhanced, vapor-condenser facilitating immersion-cooling of electronic component(s)
US8713955B2 (en) 2011-10-12 2014-05-06 International Business Machines Corporation Intra-condenser contaminant extractor for a vapor-compression refrigeration apparatus
US9357677B2 (en) * 2012-09-26 2016-05-31 Panasonic Intellectual Property Management Co., Ltd. Electronic device with efficient heat radiation structure for electronic components
FR2998096B1 (fr) * 2012-11-14 2015-01-30 Astron Fiamm Safety Connexion electrique d'un dispositif oled
CN103904239A (zh) * 2012-12-25 2014-07-02 海洋王照明科技股份有限公司 有机电致发光器件及其制备方法
CN103293814B (zh) * 2013-05-31 2015-12-23 京东方科技集团股份有限公司 一种显示装置
CN105451503B (zh) * 2014-07-21 2019-03-08 联想(北京)有限公司 一种电子设备
JP6269387B2 (ja) 2014-08-21 2018-01-31 セイコーエプソン株式会社 表示装置及び電子機器
DE102015105484A1 (de) * 2015-01-13 2016-07-14 Osram Oled Gmbh Organisches Licht emittierendes Bauelement
JP2016149191A (ja) * 2015-02-10 2016-08-18 株式会社ジャパンディスプレイ 有機el表示装置
CN104701353A (zh) * 2015-03-27 2015-06-10 京东方科技集团股份有限公司 有机发光显示面板和显示装置
CN105609536A (zh) * 2016-02-15 2016-05-25 京东方科技集团股份有限公司 一种阵列基板、oled显示面板及显示装置
JP7195685B2 (ja) * 2018-09-03 2022-12-26 エルジー・ケム・リミテッド 封止フィルム
CN109950417B (zh) * 2019-03-14 2021-07-06 江苏壹光科技有限公司 一种有机电致发光器件的封装结构
WO2020257985A1 (zh) * 2019-06-24 2020-12-30 深圳市柔宇科技有限公司 柔性显示设备与柔性显示模组
CN111146189A (zh) * 2019-12-16 2020-05-12 深圳市华星光电半导体显示技术有限公司 一种显示模组及其制备方法及电子装置

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JP2002063985A (ja) * 2000-08-22 2002-02-28 Nec Corp 有機エレクトロルミネッセンス素子
JP2002093575A (ja) * 2000-09-19 2002-03-29 Hitachi Ltd 有機el表示装置
JP2003100447A (ja) * 2001-09-25 2003-04-04 Sanyo Electric Co Ltd 有機エレクトロルミネッセンス装置
JP2003323973A (ja) * 2002-04-26 2003-11-14 Sanyo Electric Co Ltd エレクトロルミネッセンス表示装置
AU2003281446A1 (en) * 2002-07-08 2004-01-23 Dynic Corporation Hygroscopic molding
JP2004265776A (ja) * 2003-03-03 2004-09-24 Hitachi Ltd 有機elディスプレイ装置
JP2005141194A (ja) * 2003-10-14 2005-06-02 Seiko Epson Corp 補強構造体、表示装置、及び電子機器
JP2007003699A (ja) * 2005-06-22 2007-01-11 Fuji Xerox Co Ltd 画像表示装置
KR101167318B1 (ko) * 2005-08-31 2012-07-19 엘지디스플레이 주식회사 입체 영상 표시 장치
KR100719706B1 (ko) * 2005-09-13 2007-05-17 삼성에스디아이 주식회사 평판표시장치 및 유기 발광표시장치
US20070132371A1 (en) * 2005-12-12 2007-06-14 General Electric Company Color tunable light-emitting devices and method of making the same

Also Published As

Publication number Publication date
WO2009021741A2 (de) 2009-02-19
JP2010536155A (ja) 2010-11-25
DE102007063656A1 (de) 2009-07-02
US20110096504A1 (en) 2011-04-28
WO2009021741A3 (de) 2009-04-16

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