JP5638924B2 - 有機発光素子 - Google Patents
有機発光素子 Download PDFInfo
- Publication number
- JP5638924B2 JP5638924B2 JP2010264826A JP2010264826A JP5638924B2 JP 5638924 B2 JP5638924 B2 JP 5638924B2 JP 2010264826 A JP2010264826 A JP 2010264826A JP 2010264826 A JP2010264826 A JP 2010264826A JP 5638924 B2 JP5638924 B2 JP 5638924B2
- Authority
- JP
- Japan
- Prior art keywords
- organic light
- conductive filler
- heat conductive
- light emitting
- sealing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007789 sealing Methods 0.000 claims description 75
- 239000011231 conductive filler Substances 0.000 claims description 59
- 239000000758 substrate Substances 0.000 claims description 56
- 239000000463 material Substances 0.000 claims description 37
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 28
- 239000011521 glass Substances 0.000 claims description 22
- 239000000919 ceramic Substances 0.000 claims description 16
- 230000002265 prevention Effects 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 6
- 229910010293 ceramic material Inorganic materials 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 5
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 238000010292 electrical insulation Methods 0.000 claims description 3
- 229910017083 AlN Inorganic materials 0.000 claims description 2
- 229910016525 CuMo Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000012212 insulator Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 238000009826 distribution Methods 0.000 description 18
- 239000010410 layer Substances 0.000 description 17
- 239000011347 resin Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 13
- 230000017525 heat dissipation Effects 0.000 description 12
- 239000010408 film Substances 0.000 description 8
- 239000012790 adhesive layer Substances 0.000 description 7
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 7
- 239000000945 filler Substances 0.000 description 7
- 239000002826 coolant Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000003973 paint Substances 0.000 description 6
- 239000010949 copper Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 239000000615 nonconductor Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000002274 desiccant Substances 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 239000003463 adsorbent Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8794—Arrangements for heating and cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Description
1A 封止板
2 第2可堯性基板
3 第1電極
4 有機発光体
5 第2電極
6 伝熱性充填材
7 封止板
7A 封止板
7B 封止板
8 伝熱性充填材
10 基板
11 冷却材
12 放熱塗料
13A クロメート被膜
13B クロメート被膜
14 絶縁層
15 接着層
16 反り防止材
70 金属封止板
Claims (8)
- ガラス基板と、
前記ガラス基板上に形成された有機発光体と、
前記有機発光体を埋め込むように該有機発光体の周囲に形成され、電気的絶縁性を有する第1の伝熱性充填材と、
前記第1の伝熱性充填材とは異なる材料であって前記第1の伝熱性充填材の周囲に形成された接着性を有する材料による第2の伝熱性充填材と、
前記第1の伝熱性充填材及び前記第2の伝熱性充填材上に配置された金属封止板と、
前記金属封止板上に配置されたセラミックス材料からなる反り防止材とを備えたことを特徴とする有機発光素子。 - 前記反り防止材はAlNセラミックスで構成されていることを特徴とする請求項1に記載の有機発光素子。
- 前記第1の伝熱性充填材及び前記第2の伝熱性充填材と前記金属封止板との間には絶縁層が形成されていることを特徴とする請求項1又は請求項2に記載の有機発光素子。
- 前記絶縁層はセラミックス絶縁体で構成されていることを特徴とする請求項3に記載の有機発光素子。
- 前記金属封止板は、Cu、Al、Ni、CuMo合金、AlN、Al 2 O 3 のいずれかで構成されていることを特徴とする請求項1〜請求項4のいずれか1項に記載の有機発光素子。
- 前記第1の伝熱性充填材は、液体又は固体で構成されていることを特徴とする請求項1〜請求項5のいずれか1項に記載の有機発光素子。
- 前記第1の伝熱性充填材は、不活性材料の液体であることを特徴とする請求項6に記載の有機発光素子。
- 前記第1の伝熱性充填材は、ゲッター機能を有する固体であることを特徴とする請求項6に記載の有機発光素子。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010264826A JP5638924B2 (ja) | 2010-11-29 | 2010-11-29 | 有機発光素子 |
US13/305,725 US8847269B2 (en) | 2010-11-29 | 2011-11-28 | Organic light-emitting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010264826A JP5638924B2 (ja) | 2010-11-29 | 2010-11-29 | 有機発光素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012119064A JP2012119064A (ja) | 2012-06-21 |
JP5638924B2 true JP5638924B2 (ja) | 2014-12-10 |
Family
ID=46126030
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010264826A Expired - Fee Related JP5638924B2 (ja) | 2010-11-29 | 2010-11-29 | 有機発光素子 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8847269B2 (ja) |
JP (1) | JP5638924B2 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5369240B2 (ja) * | 2012-02-28 | 2013-12-18 | 日東電工株式会社 | 有機el素子の製造方法及び有機el素子 |
FR2998096B1 (fr) * | 2012-11-14 | 2015-01-30 | Astron Fiamm Safety | Connexion electrique d'un dispositif oled |
JP2017068895A (ja) * | 2014-02-10 | 2017-04-06 | パナソニックIpマネジメント株式会社 | 有機エレクトロルミネッセンス素子及び照明装置 |
WO2017038655A1 (ja) * | 2015-08-28 | 2017-03-09 | 合同会社プレアデステクノロジーズ | 生体適用光照射デバイス、生体適用光照射デバイスの使用方法、生体適用光照射デバイスの封止体、生体適用光照射デバイスの封止体の製造方法、生体適用光照射デバイスの封止体の使用方法、セット、皮膚疾患治療装置および美容施術装置 |
DE102016101788A1 (de) * | 2016-02-02 | 2017-08-03 | Osram Oled Gmbh | Optoelektronische Baugruppe und Verfahren zum Herstellen einer optoelektronischen Baugruppe |
JP2018107449A (ja) * | 2016-12-27 | 2018-07-05 | 株式会社半導体エネルギー研究所 | 発光素子、発光装置、電子機器、および照明装置 |
CN107768530B (zh) * | 2017-11-15 | 2020-01-17 | 武汉华星光电半导体显示技术有限公司 | 柔性基板及其制作方法 |
CN111972044B (zh) * | 2018-03-28 | 2024-02-13 | 夏普株式会社 | 显示装置及显示装置的制造方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1074582A (ja) * | 1996-08-30 | 1998-03-17 | Sanyo Electric Co Ltd | 有機elディスプレイ |
JP2004119277A (ja) * | 2002-09-27 | 2004-04-15 | Toshiba Corp | 有機el表示装置およびその製造方法 |
US7402946B2 (en) * | 2003-11-28 | 2008-07-22 | Lg Display Co., Ltd. | Organic electroluminescence device with absorbent film and fabrication method thereof |
US20060275952A1 (en) * | 2005-06-07 | 2006-12-07 | General Electric Company | Method for making electronic devices |
KR20080002338A (ko) * | 2006-06-30 | 2008-01-04 | 엘지.필립스 엘시디 주식회사 | 유기 전계발광 표시장치와 그의 제조 방법 |
JP5144041B2 (ja) * | 2006-07-26 | 2013-02-13 | パナソニック株式会社 | 有機エレクトロルミネッセンス発光装置及び有機エレクトロルミネッセンス照明装置 |
DE102007063656A1 (de) * | 2007-08-14 | 2009-07-02 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Organische elektronische Bauelemente |
JP5189829B2 (ja) * | 2007-11-28 | 2013-04-24 | ローム株式会社 | 有機発光素子及びその製造方法 |
JP2009193801A (ja) * | 2008-02-14 | 2009-08-27 | Seiko Epson Corp | 有機elパネル、有機el装置、及び有機elパネルの駆動方法 |
JP5297072B2 (ja) * | 2008-04-14 | 2013-09-25 | ローム株式会社 | 有機発光装置及び有機発光装置の製造方法 |
JP2009272073A (ja) * | 2008-05-01 | 2009-11-19 | Seiko Epson Corp | 有機el装置及び電子機器 |
JP2010080289A (ja) * | 2008-09-26 | 2010-04-08 | Dainippon Printing Co Ltd | 有機エレクトロルミネッセンスパネル、及びその製造方法 |
JP5314409B2 (ja) * | 2008-12-17 | 2013-10-16 | 住友化学株式会社 | 有機エレクトロルミネッセンス素子 |
JP5146356B2 (ja) * | 2009-02-24 | 2013-02-20 | 豊田合成株式会社 | 発光装置及びその製造方法 |
JP5947297B2 (ja) * | 2010-08-05 | 2016-07-06 | ハンワ ケミカル コーポレイション | 炭素素材を用いた高効率放熱塗料組成物 |
KR20120066352A (ko) * | 2010-12-14 | 2012-06-22 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 및 이의 제조 방법 |
JP2013084557A (ja) * | 2011-07-21 | 2013-05-09 | Rohm Co Ltd | 照明装置 |
-
2010
- 2010-11-29 JP JP2010264826A patent/JP5638924B2/ja not_active Expired - Fee Related
-
2011
- 2011-11-28 US US13/305,725 patent/US8847269B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2012119064A (ja) | 2012-06-21 |
US20120132950A1 (en) | 2012-05-31 |
US8847269B2 (en) | 2014-09-30 |
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