DE4026233A1 - Leiterplatte mit elektrischen bauelementen, insbesondere in smd-ausfuehrung - Google Patents

Leiterplatte mit elektrischen bauelementen, insbesondere in smd-ausfuehrung

Info

Publication number
DE4026233A1
DE4026233A1 DE4026233A DE4026233A DE4026233A1 DE 4026233 A1 DE4026233 A1 DE 4026233A1 DE 4026233 A DE4026233 A DE 4026233A DE 4026233 A DE4026233 A DE 4026233A DE 4026233 A1 DE4026233 A1 DE 4026233A1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
contact
component
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE4026233A
Other languages
German (de)
English (en)
Other versions
DE4026233C2 (https=
Inventor
Peter Hiller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE4026233A priority Critical patent/DE4026233A1/de
Priority to PCT/DE1991/000648 priority patent/WO1992003901A1/de
Priority to EP91914556A priority patent/EP0556184B1/de
Priority to US08/090,141 priority patent/US5420755A/en
Publication of DE4026233A1 publication Critical patent/DE4026233A1/de
Application granted granted Critical
Publication of DE4026233C2 publication Critical patent/DE4026233C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/184—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10583—Cylindrically shaped component; Fixing means therefore
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10659—Different types of terminals for the same component, e.g. solder balls combined with leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Multi-Conductor Connections (AREA)
DE4026233A 1990-08-18 1990-08-18 Leiterplatte mit elektrischen bauelementen, insbesondere in smd-ausfuehrung Granted DE4026233A1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE4026233A DE4026233A1 (de) 1990-08-18 1990-08-18 Leiterplatte mit elektrischen bauelementen, insbesondere in smd-ausfuehrung
PCT/DE1991/000648 WO1992003901A1 (de) 1990-08-18 1991-08-15 Leiterplatte mit elektrischen bauelementen, insbesondere in smd-ausführung
EP91914556A EP0556184B1 (de) 1990-08-18 1991-08-15 Leiterplatte mit elektrischen bauelementen, insbesondere in smd-ausführung
US08/090,141 US5420755A (en) 1990-08-18 1991-09-15 Circuit board with electrical components, in particular surface-mounted devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4026233A DE4026233A1 (de) 1990-08-18 1990-08-18 Leiterplatte mit elektrischen bauelementen, insbesondere in smd-ausfuehrung

Publications (2)

Publication Number Publication Date
DE4026233A1 true DE4026233A1 (de) 1992-02-20
DE4026233C2 DE4026233C2 (https=) 1992-05-27

Family

ID=6412519

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4026233A Granted DE4026233A1 (de) 1990-08-18 1990-08-18 Leiterplatte mit elektrischen bauelementen, insbesondere in smd-ausfuehrung

Country Status (4)

Country Link
US (1) US5420755A (https=)
EP (1) EP0556184B1 (https=)
DE (1) DE4026233A1 (https=)
WO (1) WO1992003901A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5629428A (en) * 1993-05-12 1997-05-13 Hoechst Aktiengesellschaft 3-Chloropyridines, and their use in liquid-crystal mixtures
DE10246576B4 (de) * 2002-10-05 2004-11-04 Hella Kgaa Hueck & Co. Leiterplatte

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2321135B (en) * 1997-01-11 2001-06-27 Furse W J & Co Ltd Improvements in or relating to thermal trip arrangements
DE59708222D1 (de) * 1996-03-18 2002-10-24 Krone Ag Leiterplatte und Verfahren zum lagegegenauen Bestücken und Löten von elektronischen Bauelementen auf der Oberfläche der Leiterplatte
JP2004506309A (ja) 1997-12-31 2004-02-26 エルパック（ユーエスエー）、インコーポレイテッド モールドされた電子パッケージ、製作方法およびシールディング方法
US6160714A (en) 1997-12-31 2000-12-12 Elpac (Usa), Inc. Molded electronic package and method of preparation
US20090021871A1 (en) * 2001-10-04 2009-01-22 Ise Corporation Energy Storage Pack Having Overvoltage Protection and Method of Protection
US20070020513A1 (en) * 2001-10-04 2007-01-25 Ise Corporation Energy Storage Cell Support Separator and Cooling System for a Multiple Cell Module
US7085112B2 (en) * 2001-10-04 2006-08-01 Ise Corporation High-power ultracapacitor energy storage pack and method of use
US6714391B2 (en) 2001-10-04 2004-03-30 Ise Research Corporation Ultracapacitor energy storage cell pack and methods of assembling and cooling the same
US7218489B2 (en) * 2001-10-04 2007-05-15 Ise Corporation High-power ultracapacitor energy storage pack and method of use
US20080068801A1 (en) * 2001-10-04 2008-03-20 Ise Corporation High-Power Ultracapacitor Energy Storage Cell Pack and Coupling Method
US20090190273A1 (en) * 2001-10-04 2009-07-30 Ise Corporation Ultracapacitor Overvoltage Protection Circuit With Self Verification
US20070002518A1 (en) * 2001-10-04 2007-01-04 Ise Corporation High-Power Ultracapacitor Energy Storage Pack and Method of Use
US20060257725A1 (en) * 2001-10-04 2006-11-16 Ise Corporation Energy Storage Cell Support Separator System for a Multiple Cell Module and Method of Use
PL355404A1 (en) * 2002-08-08 2004-02-09 Advanced Digital Broadcast Ltd. Pronted circuit board with electronic components to be fitted on a pronted circuit board and method of fitting electronic components on printed circuit board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3115303A1 (de) * 1981-04-15 1982-11-04 Becker Autoradiowerk Gmbh, 7516 Karlsbad "verfahren zum bestuecken von gedruckten leiterplatten mit drahtlosen miniaturbauelementen und mit solchen miniaturbauelementen bestueckte leiterplatte"
US4878155A (en) * 1987-09-25 1989-10-31 Conley Larry R High speed discrete wire pin panel assembly with embedded capacitors

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1514009A1 (de) * 1965-04-23 1969-06-26 Imp Rundfunk Und Fernsehwerk G Keramischer Mehrfachkondensator
US3529212A (en) * 1967-12-26 1970-09-15 Corning Glass Works Printed circuit assembly
DE2346924A1 (de) * 1973-09-18 1975-03-27 Siemens Ag Abschlusswiderstand fuer eine microstripleitung
DE3430849A1 (de) * 1984-08-22 1986-03-06 Gerd 7742 St Georgen Kammerer Verfahren zur raeumlichen ausweitung der elektrischen verbindung zwischen den anschlusskontakten hochintegrierter elektronischer bauelemente und den kontaktstellen einer elektrischen anschlussvorrichtung auf einem bauelementetraeger

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3115303A1 (de) * 1981-04-15 1982-11-04 Becker Autoradiowerk Gmbh, 7516 Karlsbad "verfahren zum bestuecken von gedruckten leiterplatten mit drahtlosen miniaturbauelementen und mit solchen miniaturbauelementen bestueckte leiterplatte"
US4878155A (en) * 1987-09-25 1989-10-31 Conley Larry R High speed discrete wire pin panel assembly with embedded capacitors

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5629428A (en) * 1993-05-12 1997-05-13 Hoechst Aktiengesellschaft 3-Chloropyridines, and their use in liquid-crystal mixtures
DE10246576B4 (de) * 2002-10-05 2004-11-04 Hella Kgaa Hueck & Co. Leiterplatte

Also Published As

Publication number Publication date
WO1992003901A1 (de) 1992-03-05
EP0556184A1 (de) 1993-08-25
EP0556184B1 (de) 1996-02-28
DE4026233C2 (https=) 1992-05-27
US5420755A (en) 1995-05-30

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee