Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/18—Printed circuits structurally associated with non-printed electric components
  • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
  • H05K1/184—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10007—Types of components
  • H05K2201/10166—Transistor
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10431—Details of mounted components
  • H05K2201/10583—Cylindrically shaped component; Fixing means therefore
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
  • H05K2201/10621—Components characterised by their electrical contacts
  • H05K2201/10659—Different types of terminals for the same component, e.g. solder balls combined with leads
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
  • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
  • H05K3/341—Surface mounted components
  • H05K3/3421—Leaded components
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
  • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
  • H05K3/341—Surface mounted components
  • H05K3/3431—Leadless components
  • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
  • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
  • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire

Definitions

• the invention relates to a circuit board with electrical components, in which the components with their insulated structures are used in through holes in the circuit board, on the Lei terp Lattenuntersei te and the top of the circuit board protrude slightly and in these areas carry contact surfaces that are soldered to the conductor tracks of the circuit board, wherein the lower ends of the components run out as half balls or rounded conical tips and have corresponding lower contact surfaces which protrude into conductor tracks in the printed circuit board and are soldered to them.
• Such a circuit board is e.g. known from DE 31 15 303 A1 or US-PS 48 78 155.
• Each component is designed as an individual element, such as a resistor, capacitor, diode or the like, so that a high packing density of the components cannot be achieved on the printed circuit board.
• This object is achieved according to the invention in that the upper ends of the components carry a plurality of mutually insulated upper contact surfaces, which are connected to projecting contact elements on the component body, which are connected at a distance around the holes of the circuit board by means of solder paste to conductor tracks of the top of the circuit board.
• the components are designed as multiple elements with individual contact elements, which are connected with solder paste without the risk of solder bridges to the conductor tracks on the Lei terp Lattenoberse te, while the lower contact element is connected to the conductor track on the underside of the circuit board.
• one embodiment provides that the upper contact elements m t of the top side of the circuit board form an acute angle.
• the upper contact surface can be formed with the contact elements in the form of arcuate contact springs which only extend over parts of the circumference of the upper end of the component. If it is provided according to a further embodiment that the upper end of the component is polygonal in cross section, which are provided on the outer surfaces with individual contact elements, then the component can also extend beyond the bore and thus be substantially expanded in construction, and offers the possibility of attaching several upper contact elements.
• the mechanical fixing of the components in the holes in the printed circuit board can be done by a known snug fit and / or press fit.
• Elastic outer layers of the component can also be advantageous.
• Another possibility of mechanical fixing is that the structural element of the component is kept sealed in the area of the hole in the circuit board by means of circumferential webs.
• connection variations for the component can be expanded further in that the lower contact surface and the pad are divided into several contact points that are insulated from one another.
• Fig. 2 is a perspective view of a component with an enlarged upper end and differently designed contact elements
• Fig. 3 in perspective shear view another embodiment of the top of the components.
• a part of the circuit board 9 is shown with a bore 10.
• the component with the structure 3 is inserted into this bore 10 and mechanically held therein, for example by a snug fit and / or an interference fit.
• the lower end of the component which is preferably manufactured in SMD, is designed as a spherical cap which protrudes from the lower end of the bore 10.
• the underside of the circuit board carries the pad 7, which comes close to the bore 10.
• the structure 3 insulates the lower contact surface 4, which extends beyond the hemisphere in part into the bore 10.
• the contact surface 4 only gradually reaches the bore in order to achieve an increase in the solder 8 during the soldering process.
• the upper end of the component protrudes from the upper side of the printed circuit board and carries the upper contact surface 1.1 and 1.2, which is connected to the contact elements 2.1 and 2.2.
• the ring-shaped but divided conductor track 6, on which solder paste 5 is applied extends around the bore.
• the contact elements 2.1 and 2.2 are designed as projecting contact springs which are at an acute angle to the structure 3 and themselves Support electrically conductive on the ring-shaped, divided conductor track 6 via the solder paste 5. The component thus sits ' protected in the bore 10 of the circuit board 9 and requires no through-hole for its electrical connection and very little space around the bore 10.
• the distance of the divided conductor 6 from the bore 10 ensures that when placing of the component no solder pads can get into the hole.
• the solder eye 7 on the underside of the circuit board must be so large that it is wetted with solder in the soldering bath itself and also the lower contact surface 4, a groove being formed which, in addition to an excellent electrical connection, also brings good fastening for the component .
• the component is pressed from the printed circuit board upper side into the bore 10 until the contacts elements 2.1 and 2.2 are immersed in the solder paste 5 located on the divided conductor track 6.
• the component is fixed by the adhesive force of the solder paste 5 as well as by the pressing and / or fitting force between the bore 10 and the component and thus temporarily fixed. Clinching or gluing is therefore not necessary.
• the circuit board is placed in the oven (low soldering). This is also necessary for SMD components. Finally, the underside of the circuit board is soldered in the solder bath (wave soldering).
• Fig. 2 shows the component compared to FIG. 1 on a reduced scale and clearly shows its compact shape.
• the upper contact surface is divided into two mutually insulated contact surfaces 1.1 and 1.2, which are then connected via the contact elements 2.1 and 2.2 with arcuate partial conductor tracks 6 become.
• the contact elements 2.1 and 2.2 only extend over part of the circumference of the upper end of the component.
• the lower contact area 4 can also be subdivided into a plurality of part contact areas which are insulated from one another. In this way, double resistors, double diodes or double capacitors and multipole semiconductors can be accommodated in the structure 3. It is also possible to integrate multipole circuits.
• the upper end of the body 3 can also have a polygonal head 3.2 and cover the bore 10 on all sides.
• the outer surfaces of the head 3.2 can all or alternately be provided with contact surfaces and contact elements 2.1 and 2.2.

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
• Multi-Conductor Connections (AREA)

Priority Applications (2)

Applications Claiming Priority (2)

Publications (1)

Family

ID=6412519

Family Applications (1)

Country Status (4)

Families Citing this family (16)

Citations (3)

Family Cites Families (3)

• 1990
  • 1990-08-18 DE DE4026233A patent/DE4026233A1/de active Granted
• 1991
  • 1991-08-15 EP EP91914556A patent/EP0556184B1/de not_active Expired - Lifetime
  • 1991-08-15 WO PCT/DE1991/000648 patent/WO1992003901A1/de not_active Ceased
  • 1991-09-15 US US08/090,141 patent/US5420755A/en not_active Expired - Fee Related

Patent Citations (3)

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