DE69402049T2 - Leiterplatte mit elektrischem Adaptorstift und dessen Herstellungsverfahren. - Google Patents

Leiterplatte mit elektrischem Adaptorstift und dessen Herstellungsverfahren.

Info

Publication number
DE69402049T2
DE69402049T2 DE69402049T DE69402049T DE69402049T2 DE 69402049 T2 DE69402049 T2 DE 69402049T2 DE 69402049 T DE69402049 T DE 69402049T DE 69402049 T DE69402049 T DE 69402049T DE 69402049 T2 DE69402049 T2 DE 69402049T2
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
manufacturing process
electrical adapter
adapter pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69402049T
Other languages
English (en)
Other versions
DE69402049D1 (de
Inventor
William Y Sinclair
James P Walter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aries Electronics Inc Frenchtown Nj Us
Aries Electronics Inc
Original Assignee
Aries Electronics Inc Frenchtown Nj Us
Aries Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aries Electronics Inc Frenchtown Nj Us, Aries Electronics Inc filed Critical Aries Electronics Inc Frenchtown Nj Us
Publication of DE69402049D1 publication Critical patent/DE69402049D1/de
Application granted granted Critical
Publication of DE69402049T2 publication Critical patent/DE69402049T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10704—Pin grid array [PGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/1081—Special cross-section of a lead; Different cross-sections of different leads; Matching cross-section, e.g. matched to a land
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10871—Leads having an integral insert stop
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y10T29/4914—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49151—Assembling terminal to base by deforming or shaping
    • Y10T29/49153—Assembling terminal to base by deforming or shaping with shaping or forcing terminal into base aperture

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DE69402049T 1994-02-18 1994-12-15 Leiterplatte mit elektrischem Adaptorstift und dessen Herstellungsverfahren. Expired - Lifetime DE69402049T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/199,764 US5410452A (en) 1994-02-18 1994-02-18 Printed circuit board electrical adaptor pin

Publications (2)

Publication Number Publication Date
DE69402049D1 DE69402049D1 (de) 1997-04-17
DE69402049T2 true DE69402049T2 (de) 1997-08-14

Family

ID=22738927

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69402049T Expired - Lifetime DE69402049T2 (de) 1994-02-18 1994-12-15 Leiterplatte mit elektrischem Adaptorstift und dessen Herstellungsverfahren.

Country Status (4)

Country Link
US (2) US5410452A (de)
EP (1) EP0668636B1 (de)
JP (1) JP3589494B2 (de)
DE (1) DE69402049T2 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5735446A (en) * 1995-07-05 1998-04-07 Ford Global Technologies, Inc. Friction welding non-metallics to metallics
US5589669A (en) * 1995-12-28 1996-12-31 Emc Corporation Electrical contact for printed circuit boards
GB9705277D0 (en) * 1997-03-14 1997-04-30 Kam Circuits Limited Improvements relating to printed circuit board pin location
US6300678B1 (en) 1997-10-03 2001-10-09 Fujitsu Limited I/O pin having solder dam for connecting substrates
US6179631B1 (en) 1997-11-21 2001-01-30 Emc Corporation Electrical contact for a printed circuit board
JP2003518759A (ja) * 1999-12-20 2003-06-10 シンクォール・インコーポレーテッド Ｄｃ／ｄｃコンバータのためのフランジ付きターミナルピン
US7085146B2 (en) 1999-12-20 2006-08-01 Synqor, Inc. Flanged terminal pins for DC/DC converters
US6896526B2 (en) 1999-12-20 2005-05-24 Synqor, Inc. Flanged terminal pins for DC/DC converters
US6509066B1 (en) 2000-05-02 2003-01-21 Bae Systems Information And Electronic Systems Integration Inc. Sensitized photoconductive infrared detectors
US20040173106A1 (en) * 2003-03-03 2004-09-09 Jean Rouleau Pneumatically driven wringer for use on an open barrell
US6796807B2 (en) * 2002-05-09 2004-09-28 Honeywell International, Inc. Adapter for surface mount devices to through hole applications
US7177143B1 (en) 2002-08-05 2007-02-13 Communication Associates, Inc. Molded electronic components
US7025604B2 (en) * 2003-03-31 2006-04-11 Astec International Limited High current output pin
DE10331840A1 (de) * 2003-07-14 2005-02-24 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Bauteil für eine Leiterplatte und Verfahren zum Bestücken der Leiterplatte mit diesem Bauteil
JP2007103079A (ja) * 2005-09-30 2007-04-19 Funai Electric Co Ltd Ｄｖｄ一体型ｃｒｔテレビジョンおよびコネクタ固定構造
DE102006019895A1 (de) * 2006-04-28 2007-11-15 Siemens Ag Strommessvorrichtung mit speziell kontaktierter Leiterplatte und entsprechendes Herstellungsverfahren
US7485017B2 (en) * 2007-06-05 2009-02-03 Intel Corporation Pin grid array package substrate including pins having anchoring elements
US20160278209A1 (en) * 2013-12-19 2016-09-22 Telefonaktiebolaget L M Ericsson (Publ) A connection pin, a converter assembly and a method for manufacturing a connection pin
US9138821B2 (en) * 2014-01-17 2015-09-22 Medtronic, Inc. Methods for simultaneously brazing a ferrule and lead pins
CN104812156A (zh) * 2014-01-23 2015-07-29 台达电子企业管理（上海）有限公司 插销以及印刷电路板
US9564697B2 (en) 2014-11-13 2017-02-07 Lear Corporation Press fit electrical terminal having a solder tab shorter than PCB thickness and method of using same

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3254323A (en) * 1963-05-07 1966-05-31 Projects Unlimted Inc Electrical connections
GB1060271A (en) * 1964-01-06 1967-03-01 Oxley Robert Frederick Improvements in and relating to connecting devices for printed circuit boards
US3790866A (en) * 1973-05-14 1974-02-05 Gen Motors Corp Semiconductor device enclosure and method of making same
US3866998A (en) * 1973-08-30 1975-02-18 Sealectro Corp Conductive terminal for flexible circuit boards
US4110904A (en) * 1977-05-19 1978-09-05 Allen-Bradley Company Substrate with terminal connections and method of making the same
JPS5919416B2 (ja) * 1978-04-27 1984-05-07 イ−・アイ・デユポン・デ・ニモアス・アンド・カンパニ− 電気用端子
US4257667A (en) * 1979-03-09 1981-03-24 Sealectro Corporation Non-insulated printed circuit jack with retaining feature
US4404172A (en) * 1981-01-05 1983-09-13 Western Electric Company, Inc. Method and apparatus for forming and growing a single crystal of a semiconductor compound
US4494172A (en) * 1982-01-28 1985-01-15 Mupac Corporation High-speed wire wrap board
FR2545312B1 (fr) * 1983-04-29 1986-05-30 Thomson Csf Picot de support de fixation de composant electronique sur circuit imprime et support comportant ces picots
JPH0234461B2 (ja) * 1983-06-20 1990-08-03 Intaanashonaru Bijinesu Mashiinzu Corp Hienkeipinanaakitasojudentaikibanoyobisonoseizohoho
US5129573A (en) * 1991-10-25 1992-07-14 Compaq Computer Corporation Method for attaching through-hole devices to a circuit board using solder paste
US5257165A (en) * 1992-02-13 1993-10-26 Jaton Technology Co., Ltd. Pin grid array adaptor mounting hardware

Also Published As

Publication number Publication date
EP0668636A1 (de) 1995-08-23
DE69402049D1 (de) 1997-04-17
US5410452A (en) 1995-04-25
US5533665A (en) 1996-07-09
EP0668636B1 (de) 1997-03-12
JP3589494B2 (ja) 2004-11-17
JPH07273421A (ja) 1995-10-20

Similar Documents

Publication Publication Date Title
DE69402049T2 (de) Leiterplatte mit elektrischem Adaptorstift und dessen Herstellungsverfahren.
DE69812570D1 (de) Gerät mit Leiterplatte und dessen Zusammenbauverfahren
DE69519226T2 (de) Verbinder mit integrierter Flachbaugruppe
EP0662614A3 (de) Adapter zur Aufnahme zu prüfenden Leiterplatten und Verfahren dazu.
DE69731719D1 (de) Steckverbinder mit integrierter Leiterplattenanordnung
DE69427767T2 (de) Elektrische Verbinder zum Kuppeln von zwei gedruckten Leiterplatten
DE69814322D1 (de) Verbinder für eine gedruckte Leiterplatte und Herstellungsverfahren dafür
DE69812179D1 (de) Gedruckte schaltungsplatine mit integrierter schmelzsicherung
HK1027899A1 (en) Circuit board having thereon coupled ceramic capacitors and method for the manufacture thereof.
DE68921117D1 (de) Randverbinder für Leiterplatten und Anschlusselement dafür.
DE69327765D1 (de) Leiterplatte mit darauf montierten elektrischen Bauelementen
DE69500584D1 (de) Flexible Leiterplatte und deren Herstellungsverfahren
EP0621746A3 (de) Zusammengesetzte Leiterplatte und Verfahren zu ihrer Herstellung.
FI972187A0 (fi) Kytkentäjärjestely päätepiirissä
DE69621566D1 (de) Winkelverbinder für zwei Leiterplatten mit Anti-Kapillarwirkungseigenschaften und dazugehöriges Kontaktelement
DE69300615D1 (de) Mehrschichtige Leiterplatte und Herstellungsverfahren.
GB2288075B (en) Circuit boards and their manufacture
DE69404891T2 (de) Verbinder mit Kurzschlusskontakt
DE3587566D1 (de) Leiterplatten und End-Steckverbinderanordnungen für dieselben.
DE9412680U1 (de) Steckverbinder für gedruckte Schaltungen
KR900007287A (ko) 인쇄회로 및 그 제조공정
DE69618070T2 (de) Gedruckte Schaltungskarte und Steckverbinder für eine gedruckte Schaltungskarte
SG54976A1 (en) Connection structure between connector and circuit board and connector for use with this connection structure
HK1036185A1 (en) Printed circuit board and manufacturing process thereof.
EP0670598A3 (de) Keramische Leiterplatte und Herstellungsverfahren.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition