DE3888666T2 - Polyimid-Harz und Isolationsschicht für elektrische oder elektronische Geräte. - Google Patents
Polyimid-Harz und Isolationsschicht für elektrische oder elektronische Geräte.Info
- Publication number
- DE3888666T2 DE3888666T2 DE19883888666 DE3888666T DE3888666T2 DE 3888666 T2 DE3888666 T2 DE 3888666T2 DE 19883888666 DE19883888666 DE 19883888666 DE 3888666 T DE3888666 T DE 3888666T DE 3888666 T2 DE3888666 T2 DE 3888666T2
- Authority
- DE
- Germany
- Prior art keywords
- electrical
- electronic devices
- insulation layer
- polyimide resin
- polyimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009413 insulation Methods 0.000 title 1
- 229920001721 polyimide Polymers 0.000 title 1
- 239000009719 polyimide resin Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
- C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/306—Polyimides or polyesterimides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
- H01L23/556—Protection against radiation, e.g. light or electromagnetic waves against alpha rays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Ceramic Engineering (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Organic Insulating Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63001935A JPH0682649B2 (ja) | 1988-01-08 | 1988-01-08 | 電気・電子デバイス用絶縁膜 |
JP63172157A JP2843333B2 (ja) | 1988-07-11 | 1988-07-11 | 低熱膨張性ポリイミド |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3888666D1 DE3888666D1 (de) | 1994-04-28 |
DE3888666T2 true DE3888666T2 (de) | 1994-11-03 |
Family
ID=26335228
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19883888666 Expired - Fee Related DE3888666T2 (de) | 1988-01-08 | 1988-12-29 | Polyimid-Harz und Isolationsschicht für elektrische oder elektronische Geräte. |
DE19883856028 Expired - Fee Related DE3856028T2 (de) | 1988-01-08 | 1988-12-29 | Elektrische und elektronische Geräte mit einer Polyimidharzisolationschicht |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19883856028 Expired - Fee Related DE3856028T2 (de) | 1988-01-08 | 1988-12-29 | Elektrische und elektronische Geräte mit einer Polyimidharzisolationschicht |
Country Status (4)
Country | Link |
---|---|
US (2) | US5059677A (de) |
EP (2) | EP0564009B1 (de) |
KR (1) | KR0136275B1 (de) |
DE (2) | DE3888666T2 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3941680A1 (de) * | 1989-12-18 | 1991-06-20 | Telefunken Electronic Gmbh | Kunststoffgehaeuse fuer elektronische bauteile |
US5260413A (en) * | 1990-02-05 | 1993-11-09 | E. I. Du Pont De Nemours And Company | Coated, heat-sealable aromatic polyimide film having superior compressive strength |
US5536584A (en) * | 1992-01-31 | 1996-07-16 | Hitachi, Ltd. | Polyimide precursor, polyimide and metalization structure using said polyimide |
JP3117103B2 (ja) * | 1992-06-23 | 2000-12-11 | 日産化学工業株式会社 | 新規な垂直配向処理剤 |
JP3203626B2 (ja) * | 1992-09-07 | 2001-08-27 | 日産化学工業株式会社 | 液晶セル用配向処理剤 |
US5711987A (en) * | 1996-10-04 | 1998-01-27 | Dow Corning Corporation | Electronic coatings |
US6982504B2 (en) * | 2003-01-24 | 2006-01-03 | Gsi Group Corporation | Galvanometer motor with composite stator assembly |
JP4375533B2 (ja) * | 2003-06-26 | 2009-12-02 | 三菱瓦斯化学株式会社 | 溶媒可溶性ポリイミドの製造方法 |
CN101146848B (zh) * | 2005-03-29 | 2011-07-06 | 日产化学工业株式会社 | 聚酰胺酸、聚酰亚胺及其制备方法 |
JP2007308676A (ja) * | 2006-04-18 | 2007-11-29 | Mitsubishi Gas Chem Co Inc | 熱硬化性ポリイミド樹脂組成物及びその硬化物 |
JP2009019105A (ja) | 2007-07-11 | 2009-01-29 | Nitto Denko Corp | ポリイミドからなる光半導体素子封止用樹脂 |
TW200923034A (en) * | 2007-09-20 | 2009-06-01 | Nippon Kayaku Kk | Primer resin for semiconductor device and semiconductor device |
KR20210084736A (ko) * | 2019-12-27 | 2021-07-08 | 삼성전자주식회사 | 반도체 패키지 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2702121C3 (de) * | 1977-01-20 | 1981-12-03 | Dr. Beck & Co Ag, 2000 Hamburg | Wäßrige Elektroisolierlacke, insbesondere Drahtlacke |
US4358579A (en) * | 1981-07-24 | 1982-11-09 | Standard Oil Company (Indiana) | Polyimides from tetramethylcyclobutane-1,2,3,4,-tetracarboxylic dianhydride and diamines |
JPS606726A (ja) * | 1983-06-25 | 1985-01-14 | Nissan Chem Ind Ltd | 新規ポリイミド樹脂及びその製造法 |
US4681928A (en) * | 1984-06-01 | 1987-07-21 | M&T Chemicals Inc. | Poly(amide-amide acid), polyamide acid, poly(esteramide acid), poly(amide-imide), polyimide, poly(esterimide) from poly arylene diamine |
JPH06100755B2 (ja) * | 1986-06-18 | 1994-12-12 | 日産化学工業株式会社 | 液晶セル用配向処理剤 |
-
1988
- 1988-12-29 EP EP19930109530 patent/EP0564009B1/de not_active Expired - Lifetime
- 1988-12-29 DE DE19883888666 patent/DE3888666T2/de not_active Expired - Fee Related
- 1988-12-29 DE DE19883856028 patent/DE3856028T2/de not_active Expired - Fee Related
- 1988-12-29 EP EP19880121856 patent/EP0323644B1/de not_active Expired - Lifetime
-
1989
- 1989-01-05 US US07/293,766 patent/US5059677A/en not_active Expired - Lifetime
- 1989-01-07 KR KR1019890000135A patent/KR0136275B1/ko not_active IP Right Cessation
-
1990
- 1990-04-26 US US07/514,945 patent/US5070182A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5070182A (en) | 1991-12-03 |
EP0323644B1 (de) | 1994-03-23 |
KR890011921A (ko) | 1989-08-23 |
EP0564009A1 (de) | 1993-10-06 |
DE3856028T2 (de) | 1998-02-05 |
DE3856028D1 (de) | 1997-10-23 |
US5059677A (en) | 1991-10-22 |
EP0323644A1 (de) | 1989-07-12 |
DE3888666D1 (de) | 1994-04-28 |
KR0136275B1 (ko) | 1998-04-25 |
EP0564009B1 (de) | 1997-09-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |