KR890011921A - 전기 및 전자 장치용 폴리이미드 수지 및 절연막 - Google Patents

전기 및 전자 장치용 폴리이미드 수지 및 절연막 Download PDF

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KR890011921A
KR890011921A KR1019890000135A KR890000135A KR890011921A KR 890011921 A KR890011921 A KR 890011921A KR 1019890000135 A KR1019890000135 A KR 1019890000135A KR 890000135 A KR890000135 A KR 890000135A KR 890011921 A KR890011921 A KR 890011921A
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acid
polyimide resin
aminophenoxy
diamine
electrical
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KR1019890000135A
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KR0136275B1 (ko
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노리아끼 고오또오
다까시 고바야시
마사히꼬 유까와
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나까이 다께오
닛신가가꾸고오교 가부시끼가이샤
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Priority claimed from JP63001935A external-priority patent/JPH0682649B2/ja
Priority claimed from JP63172157A external-priority patent/JP2843333B2/ja
Application filed by 나까이 다께오, 닛신가가꾸고오교 가부시끼가이샤 filed Critical 나까이 다께오
Publication of KR890011921A publication Critical patent/KR890011921A/ko
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H01L23/556—Protection against radiation, e.g. light or electromagnetic waves against alpha rays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
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    • H01L29/51—Insulating materials associated therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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  • Electromagnetism (AREA)
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  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
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Abstract

내용 없음

Description

전기 및 전자 장치용 폴리이미드 수지 및 절연막
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 하기의 실시예 및 비교예의 금속 폴리이미드 산화물 밭도체[Metal Polyimide Semicond-cutor(MPOS)]모델 소자의 개략도이다.
제2도는 내지 10도는 C-V 특성도이고, 도에서 종축 C/C0는 바이어스 전압이 +15V 때의 정전용량의 비(%)를 횡측은 바이어스 전압(V)을 나타낸다. 하향 화살표는 양에서 음방향으로 소인(sweepage)을 나타내고 상향 화살표는 음에서 양방향으로의 소인을 나타낸다.

Claims (6)

  1. 하기 일반식(Ⅰ)의 반복 단위를 함유함을 특징으로 하는 폴리이미드 수지
    [식중, R1은 테트라카르복실산 또는 그 유도체를 구성하는 4가의 유기기로서, 4개의 카르보닐기에 직접 결합하는 4개의 원자는 불포화 결합을 함유하지 않은 탄소원자이고, R2는 디아민을 구성하는 2가의 유기기이다.]
  2. 제1항에 있어서, 테트라카르복실산 또는 그 유도체가 1,2,3,4-부탄테트라카르복실산, 시클로부탄테트라카르복실산, 시클로펜탄테트라카르복실산, 시클로헥산테트라카르복실산, 3,4-디카르복시-1,2,3,4-테트라하이드로-1-나프탈렌슥신산, 그으의 무수물, 디카르복실산 이산할로겐화물, 및 그의 혼합물로구성되는 군에서 선택된 것임을 특징으로 하는 폴리이미드 수지.
  3. 제1항에 있어서, 디아민이 p-페닐렌디아민, m-페닐렌디아민, 디아노디페닐메탄, 디아노디페닐에테르, 2,2-디아노디페닐프로판, 다아미노디페닐술폰, 디아미노벤조페논, 디아니노나프탈렌, 1,3-비스(4-아미노페녹시)벤젠, 1,4-비스(4-아미노페녹시)벤젠, 4,4'-디(4-아미노페녹시)디페닐술폰, 2,2'-비스[4-(4-아미노페녹시)페닐]프로판, 및 그의 혼합물로 구성되는 군에서 선택된 것임을 특징으로하는 폴리이미드 수지.
  4. 제1항에 있어서, 하기 일반식(Ⅲ)의 반복 단위를 함유하는 특징으로 하는 폴리이미드 수지
    로 구성되는 군에서 선택된 디아민을 구성하는 2가의 유기기로서 X는 수소원자, 알칼리, 아실기, 알콕시기 또는 할로겐 원자이다]
  5. 제1항에 정의한 바와 같은 폴리이미드 수지로 구성됨을 특징으로 하는 전기또는 전자 장치용 절연막.
  6. 제4항에 정의된 바와 같은 폴리이미드 수지로 구성됨을 특징으로 하는 전기또는 전자 장치용 절연막.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890000135A 1988-01-08 1989-01-07 전기 및 전자 장치용 폴리이미드 수지 및 절연막 KR0136275B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP63-1935 1988-01-08
JP63001935A JPH0682649B2 (ja) 1988-01-08 1988-01-08 電気・電子デバイス用絶縁膜
JP63-172157 1988-07-11
JP63172157A JP2843333B2 (ja) 1988-07-11 1988-07-11 低熱膨張性ポリイミド

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KR890011921A true KR890011921A (ko) 1989-08-23
KR0136275B1 KR0136275B1 (ko) 1998-04-25

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US (2) US5059677A (ko)
EP (2) EP0564009B1 (ko)
KR (1) KR0136275B1 (ko)
DE (2) DE3888666T2 (ko)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3941680A1 (de) * 1989-12-18 1991-06-20 Telefunken Electronic Gmbh Kunststoffgehaeuse fuer elektronische bauteile
US5260413A (en) * 1990-02-05 1993-11-09 E. I. Du Pont De Nemours And Company Coated, heat-sealable aromatic polyimide film having superior compressive strength
US5536584A (en) * 1992-01-31 1996-07-16 Hitachi, Ltd. Polyimide precursor, polyimide and metalization structure using said polyimide
JP3117103B2 (ja) * 1992-06-23 2000-12-11 日産化学工業株式会社 新規な垂直配向処理剤
JP3203626B2 (ja) * 1992-09-07 2001-08-27 日産化学工業株式会社 液晶セル用配向処理剤
US5711987A (en) * 1996-10-04 1998-01-27 Dow Corning Corporation Electronic coatings
US6982504B2 (en) * 2003-01-24 2006-01-03 Gsi Group Corporation Galvanometer motor with composite stator assembly
JP4375533B2 (ja) * 2003-06-26 2009-12-02 三菱瓦斯化学株式会社 溶媒可溶性ポリイミドの製造方法
CN101146848B (zh) * 2005-03-29 2011-07-06 日产化学工业株式会社 聚酰胺酸、聚酰亚胺及其制备方法
JP2007308676A (ja) * 2006-04-18 2007-11-29 Mitsubishi Gas Chem Co Inc 熱硬化性ポリイミド樹脂組成物及びその硬化物
JP2009019105A (ja) 2007-07-11 2009-01-29 Nitto Denko Corp ポリイミドからなる光半導体素子封止用樹脂
TW200923034A (en) * 2007-09-20 2009-06-01 Nippon Kayaku Kk Primer resin for semiconductor device and semiconductor device
KR20210084736A (ko) * 2019-12-27 2021-07-08 삼성전자주식회사 반도체 패키지

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2702121C3 (de) * 1977-01-20 1981-12-03 Dr. Beck & Co Ag, 2000 Hamburg Wäßrige Elektroisolierlacke, insbesondere Drahtlacke
US4358579A (en) * 1981-07-24 1982-11-09 Standard Oil Company (Indiana) Polyimides from tetramethylcyclobutane-1,2,3,4,-tetracarboxylic dianhydride and diamines
JPS606726A (ja) * 1983-06-25 1985-01-14 Nissan Chem Ind Ltd 新規ポリイミド樹脂及びその製造法
US4681928A (en) * 1984-06-01 1987-07-21 M&T Chemicals Inc. Poly(amide-amide acid), polyamide acid, poly(esteramide acid), poly(amide-imide), polyimide, poly(esterimide) from poly arylene diamine
JPH06100755B2 (ja) * 1986-06-18 1994-12-12 日産化学工業株式会社 液晶セル用配向処理剤

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Publication number Publication date
US5070182A (en) 1991-12-03
EP0323644B1 (en) 1994-03-23
DE3888666T2 (de) 1994-11-03
EP0564009A1 (en) 1993-10-06
DE3856028T2 (de) 1998-02-05
DE3856028D1 (de) 1997-10-23
US5059677A (en) 1991-10-22
EP0323644A1 (en) 1989-07-12
DE3888666D1 (de) 1994-04-28
KR0136275B1 (ko) 1998-04-25
EP0564009B1 (en) 1997-09-17

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