DE3886283D1 - Halbleiterbauelement mit Bereichen unterschiedlicher Störstellenkonzentration. - Google Patents
Halbleiterbauelement mit Bereichen unterschiedlicher Störstellenkonzentration.Info
- Publication number
- DE3886283D1 DE3886283D1 DE88110709T DE3886283T DE3886283D1 DE 3886283 D1 DE3886283 D1 DE 3886283D1 DE 88110709 T DE88110709 T DE 88110709T DE 3886283 T DE3886283 T DE 3886283T DE 3886283 D1 DE3886283 D1 DE 3886283D1
- Authority
- DE
- Germany
- Prior art keywords
- areas
- impurity concentration
- semiconductor component
- different impurity
- different
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000012535 impurity Substances 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823493—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the wells or tubs, e.g. twin tubs, high energy well implants, buried implanted layers for lateral isolation [BILLI]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/37—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor being at least partially in a trench in the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/105—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Memories (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Dram (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62172231A JPH0752755B2 (ja) | 1987-07-10 | 1987-07-10 | 半導体装置の製造方法 |
JP15653888 | 1988-06-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3886283D1 true DE3886283D1 (de) | 1994-01-27 |
DE3886283T2 DE3886283T2 (de) | 1994-05-11 |
Family
ID=26484251
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE88110709T Expired - Fee Related DE3886283T2 (de) | 1987-07-10 | 1988-07-05 | Halbleiterbauelement mit Bereichen unterschiedlicher Störstellenkonzentration. |
DE3855945T Expired - Fee Related DE3855945T2 (de) | 1987-07-10 | 1988-07-05 | Halbleiterbauelement mit Bereichen unterschiedlicher Störstellenkonzentration |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3855945T Expired - Fee Related DE3855945T2 (de) | 1987-07-10 | 1988-07-05 | Halbleiterbauelement mit Bereichen unterschiedlicher Störstellenkonzentration |
Country Status (3)
Country | Link |
---|---|
US (1) | US5079613A (de) |
EP (2) | EP0509565B1 (de) |
DE (2) | DE3886283T2 (de) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5324982A (en) | 1985-09-25 | 1994-06-28 | Hitachi, Ltd. | Semiconductor memory device having bipolar transistor and structure to avoid soft error |
US6740958B2 (en) | 1985-09-25 | 2004-05-25 | Renesas Technology Corp. | Semiconductor memory device |
US5260226A (en) * | 1987-07-10 | 1993-11-09 | Kabushiki Kaisha Toshiba | Semiconductor device having different impurity concentration wells |
US5726475A (en) * | 1987-07-10 | 1998-03-10 | Kabushiki Kaisha Toshiba | Semiconductor device having different impurity concentration wells |
DE3900769A1 (de) * | 1989-01-12 | 1990-08-09 | Fraunhofer Ges Forschung | Integrierte schaltung mit zumindest einem n-kanal-fet und zumindest einem p-kanal-fet |
JP2754072B2 (ja) * | 1990-02-07 | 1998-05-20 | 三菱電機株式会社 | 半導体装置の入力回路 |
JP2523409B2 (ja) * | 1990-05-02 | 1996-08-07 | 三菱電機株式会社 | 半導体記憶装置およびその製造方法 |
JP2619119B2 (ja) * | 1990-06-21 | 1997-06-11 | 株式会社東芝 | 半導体集積回路 |
DE4143521C2 (de) * | 1990-06-28 | 1995-04-06 | Mitsubishi Electric Corp | Halbleiterspeichervorrichtung |
KR950009893B1 (ko) * | 1990-06-28 | 1995-09-01 | 미쓰비시 뎅끼 가부시끼가이샤 | 반도체기억장치 |
JPH0567753A (ja) * | 1991-04-17 | 1993-03-19 | Mitsubishi Electric Corp | 二重構造ウエルを有する半導体装置およびその製造方法 |
DE4212822C2 (de) * | 1991-04-17 | 1994-06-16 | Mitsubishi Electric Corp | Halbleitervorrichtung mit Wannen und Verfahren zum Herstellen einer solchen |
KR930009132B1 (ko) * | 1991-04-24 | 1993-09-23 | 삼성전자 주식회사 | 초고집적 반도체 메모리장치의 제조방법 |
JP3128262B2 (ja) * | 1991-05-28 | 2001-01-29 | 株式会社東芝 | 半導体集積回路装置 |
KR950009815B1 (ko) * | 1991-12-23 | 1995-08-28 | 삼성전자주식회사 | 트리플웰 구조를 가지는 고집적 반도체 메모리 장치 |
US5250829A (en) * | 1992-01-09 | 1993-10-05 | International Business Machines Corporation | Double well substrate plate trench DRAM cell array |
US5264716A (en) * | 1992-01-09 | 1993-11-23 | International Business Machines Corporation | Diffused buried plate trench dram cell array |
US5595925A (en) * | 1994-04-29 | 1997-01-21 | Texas Instruments Incorporated | Method for fabricating a multiple well structure for providing multiple substrate bias for DRAM device formed therein |
JP4037470B2 (ja) * | 1994-06-28 | 2008-01-23 | エルピーダメモリ株式会社 | 半導体装置 |
US5696721A (en) * | 1995-05-05 | 1997-12-09 | Texas Instruments Incorporated | Dynamic random access memory having row decoder with level translator for driving a word line voltage above and below an operating supply voltage range |
JP3400891B2 (ja) * | 1995-05-29 | 2003-04-28 | 三菱電機株式会社 | 半導体記憶装置およびその製造方法 |
US5908310A (en) * | 1995-12-27 | 1999-06-01 | International Business Machines Corporation | Method to form a buried implanted plate for DRAM trench storage capacitors |
JPH1084045A (ja) * | 1996-09-06 | 1998-03-31 | Matsushita Electron Corp | 半導体集積回路装置およびその製造方法 |
US6433392B1 (en) * | 1998-04-08 | 2002-08-13 | Texas Instruments Incorporated | Electrostatic discharge device and method |
US6589834B1 (en) | 1998-10-06 | 2003-07-08 | Alliance Semiconductor Corporation | Semiconductor chip that isolates DRAM cells from the peripheral circuitry and reduces the cell leakage current |
JP2000216277A (ja) * | 1999-01-20 | 2000-08-04 | Nec Corp | 半導体装置及びその製造方法 |
US6214675B1 (en) * | 1999-02-08 | 2001-04-10 | Lucent Technologies Inc. | Method for fabricating a merged integrated circuit device |
JP2000277629A (ja) * | 1999-03-23 | 2000-10-06 | Nec Corp | 半導体記憶装置及びその製造方法 |
US6917095B1 (en) | 2000-05-30 | 2005-07-12 | Altera Corporation | Integrated radio frequency circuits |
JP2003258120A (ja) * | 2002-03-07 | 2003-09-12 | Seiko Epson Corp | 半導体装置の製造方法 |
US7176530B1 (en) | 2004-03-17 | 2007-02-13 | National Semiconductor Corporation | Configuration and fabrication of semiconductor structure having n-channel channel-junction field-effect transistor |
JP4938262B2 (ja) * | 2004-08-25 | 2012-05-23 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
US7095094B2 (en) * | 2004-09-29 | 2006-08-22 | Agere Systems Inc. | Multiple doping level bipolar junctions transistors and method for forming |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5472691A (en) * | 1977-11-21 | 1979-06-11 | Toshiba Corp | Semiconductor device |
US4413401A (en) * | 1979-07-23 | 1983-11-08 | National Semiconductor Corporation | Method for making a semiconductor capacitor |
JPS57192070A (en) * | 1981-05-22 | 1982-11-26 | Hitachi Ltd | Semiconductor memory unit |
JPS57210665A (en) * | 1981-06-19 | 1982-12-24 | Mitsubishi Electric Corp | Semiconductor memory device |
JPS587860A (ja) * | 1981-07-06 | 1983-01-17 | Hitachi Ltd | 半導体記憶装置 |
JPS5848959A (ja) * | 1981-09-18 | 1983-03-23 | Toshiba Corp | 半導体装置 |
GB2148589B (en) * | 1983-10-18 | 1987-04-23 | Standard Telephones Cables Ltd | Improvements in intergrated circuits |
JPS60206163A (ja) * | 1984-03-30 | 1985-10-17 | Toshiba Corp | 半導体記憶装置 |
US4672410A (en) * | 1984-07-12 | 1987-06-09 | Nippon Telegraph & Telephone | Semiconductor memory device with trench surrounding each memory cell |
US4673962A (en) * | 1985-03-21 | 1987-06-16 | Texas Instruments Incorporated | Vertical DRAM cell and method |
JPH0793282B2 (ja) * | 1985-04-15 | 1995-10-09 | 株式会社日立製作所 | 半導体装置の製造方法 |
US4918502A (en) * | 1986-11-28 | 1990-04-17 | Hitachi, Ltd. | Semiconductor memory having trench capacitor formed with sheath electrode |
-
1988
- 1988-07-05 EP EP92112501A patent/EP0509565B1/de not_active Expired - Lifetime
- 1988-07-05 EP EP88110709A patent/EP0298421B1/de not_active Expired - Lifetime
- 1988-07-05 DE DE88110709T patent/DE3886283T2/de not_active Expired - Fee Related
- 1988-07-05 DE DE3855945T patent/DE3855945T2/de not_active Expired - Fee Related
-
1990
- 1990-11-07 US US07/609,076 patent/US5079613A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE3886283T2 (de) | 1994-05-11 |
US5079613A (en) | 1992-01-07 |
EP0298421A3 (en) | 1989-03-15 |
DE3855945D1 (de) | 1997-07-24 |
EP0298421A2 (de) | 1989-01-11 |
DE3855945T2 (de) | 1997-11-13 |
EP0509565A2 (de) | 1992-10-21 |
EP0509565A3 (en) | 1993-04-14 |
EP0509565B1 (de) | 1997-06-18 |
EP0298421B1 (de) | 1993-12-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |