DE3784247T2 - Halbleiter-zusammenbau. - Google Patents

Halbleiter-zusammenbau.

Info

Publication number
DE3784247T2
DE3784247T2 DE8787906329T DE3784247T DE3784247T2 DE 3784247 T2 DE3784247 T2 DE 3784247T2 DE 8787906329 T DE8787906329 T DE 8787906329T DE 3784247 T DE3784247 T DE 3784247T DE 3784247 T2 DE3784247 T2 DE 3784247T2
Authority
DE
Germany
Prior art keywords
semiconductor assembly
semiconductor
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787906329T
Other languages
English (en)
Other versions
DE3784247D1 (de
Inventor
Graham Calver
Wayne Pearce
Erich Zielinski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eastman Kodak Co
Original Assignee
Eastman Kodak Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co
Application granted granted Critical
Publication of DE3784247D1 publication Critical patent/DE3784247D1/de
Publication of DE3784247T2 publication Critical patent/DE3784247T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE8787906329T 1986-09-10 1987-08-31 Halbleiter-zusammenbau. Expired - Fee Related DE3784247T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/905,903 US4691265A (en) 1986-09-10 1986-09-10 Semiconductor mounting assembly
PCT/US1987/002118 WO1988002184A1 (en) 1986-09-10 1987-08-31 Semiconducteur mounting assembly

Publications (2)

Publication Number Publication Date
DE3784247D1 DE3784247D1 (de) 1993-03-25
DE3784247T2 true DE3784247T2 (de) 1993-08-26

Family

ID=25421663

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787906329T Expired - Fee Related DE3784247T2 (de) 1986-09-10 1987-08-31 Halbleiter-zusammenbau.

Country Status (5)

Country Link
US (1) US4691265A (de)
EP (1) EP0324766B1 (de)
JP (1) JPH0447962Y2 (de)
DE (1) DE3784247T2 (de)
WO (1) WO1988002184A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0652831B2 (ja) * 1987-09-30 1994-07-06 株式会社日立製作所 自動車用電子回路装置の密封構造
US5057903A (en) * 1989-07-17 1991-10-15 Microelectronics And Computer Technology Corporation Thermal heat sink encapsulated integrated circuit
DE9007439U1 (de) * 1990-06-29 1991-11-14 IXYS Semiconductor GmbH, 68623 Lampertheim Leistungshalbleitermodul mit integrierter Ansteuerungs- und Fehlerschutzplatine
EP0605712B1 (de) * 1992-07-17 1999-09-08 Vlt Corporation Verpackung für elektronische komponenten
US5728600A (en) * 1994-11-15 1998-03-17 Vlt Corporation Circuit encapsulation process
US5945130A (en) 1994-11-15 1999-08-31 Vlt Corporation Apparatus for circuit encapsulation
US6316737B1 (en) 1999-09-09 2001-11-13 Vlt Corporation Making a connection between a component and a circuit board
US6262512B1 (en) * 1999-11-08 2001-07-17 Jds Uniphase Inc. Thermally actuated microelectromechanical systems including thermal isolation structures
US6549409B1 (en) 2000-08-21 2003-04-15 Vlt Corporation Power converter assembly
US7443229B1 (en) 2001-04-24 2008-10-28 Picor Corporation Active filtering
US6985341B2 (en) 2001-04-24 2006-01-10 Vlt, Inc. Components having actively controlled circuit elements
US7511967B2 (en) * 2007-02-20 2009-03-31 United Technologies Corporation Avionics enclosure

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3895267A (en) * 1974-03-11 1975-07-15 Analogic Corp Electronic circuit module with printed circuit board and grounding means
US4069497A (en) * 1975-08-13 1978-01-17 Emc Technology, Inc. High heat dissipation mounting for solid state devices and circuits
US4342068A (en) * 1980-11-10 1982-07-27 Teknational Industries Inc. Mounting assembly for semiconductor devices and particularly power transistors
US4484381A (en) * 1981-07-24 1984-11-27 Marconi Avionics Limited Clamp arrangements
DE3335377A1 (de) * 1983-09-29 1985-04-11 Siemens AG, 1000 Berlin und 8000 München Einrichtung zum festhalten eines kuehlkoerpers auf einem integrierten baustein
IT1213139B (it) * 1984-02-17 1989-12-14 Ates Componenti Elettron Componente elettronico integrato di tipo "single-in-line" eprocedimento per la sua fabbricazione.
DE3409037A1 (de) * 1984-03-13 1985-09-19 Robert Bosch Gmbh, 7000 Stuttgart Elektrisches schaltgeraet

Also Published As

Publication number Publication date
EP0324766A1 (de) 1989-07-26
JPH02500005U (de) 1990-03-01
JPH0447962Y2 (de) 1992-11-12
EP0324766B1 (de) 1993-02-17
US4691265A (en) 1987-09-01
WO1988002184A1 (en) 1988-03-24
DE3784247D1 (de) 1993-03-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee