US4835466A
(en)
*
|
1987-02-06 |
1989-05-30 |
Fairchild Semiconductor Corporation |
Apparatus and method for detecting spot defects in integrated circuits
|
US4918377A
(en)
*
|
1988-12-05 |
1990-04-17 |
The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration |
Integrated circuit reliability testing
|
CA2004436C
(en)
*
|
1989-12-01 |
1999-06-29 |
Alain Comeau |
Test chip for use in semiconductor fault analysis
|
JP2752486B2
(ja)
*
|
1989-12-29 |
1998-05-18 |
キヤノン株式会社 |
インクジェット記録ヘッドおよびその検査方法ならびにインクジェット記録装置
|
JP3017871B2
(ja)
*
|
1991-01-02 |
2000-03-13 |
テキサス インスツルメンツ インコーポレイテツド |
Icデバイスに対するチップ上のバラツキ検知回路
|
US5184516A
(en)
*
|
1991-07-31 |
1993-02-09 |
Hughes Aircraft Company |
Conformal circuit for structural health monitoring and assessment
|
US5217304A
(en)
*
|
1991-08-02 |
1993-06-08 |
The United States Of America As Represented By The United States Department Of Energy |
Electrical network method for the thermal or structural characterization of a conducting material sample or structure
|
US5857258A
(en)
*
|
1992-03-13 |
1999-01-12 |
The United States Of America As Represented By The Secretary Of Commerce |
Electrical test structure and method for measuring the relative locations of conductive features on an insulating substrate
|
TW248612B
(de)
*
|
1993-03-31 |
1995-06-01 |
Siemens Ag |
|
US5346307A
(en)
*
|
1993-06-03 |
1994-09-13 |
Regents Of The University Of California |
Using electrical resistance tomography to map subsurface temperatures
|
US5502390A
(en)
*
|
1994-03-15 |
1996-03-26 |
International Business Machines Corporation |
Adiabatic conductor analyzer method and system
|
US5699282A
(en)
*
|
1994-04-28 |
1997-12-16 |
The United States Of America As Represented By The Secretary Of Commerce |
Methods and test structures for measuring overlay in multilayer devices
|
US5485095A
(en)
*
|
1994-11-10 |
1996-01-16 |
International Business Machines Corporation |
Fabrication test circuit and method for signalling out-of-spec resistance in integrated circuit structure
|
JP3986571B2
(ja)
*
|
1994-12-09 |
2007-10-03 |
日本テキサス・インスツルメンツ株式会社 |
歩留り予測装置とその方法
|
US5570027A
(en)
*
|
1995-04-19 |
1996-10-29 |
Photocircuits Corporation |
Printed circuit board test apparatus and method
|
US5670891A
(en)
*
|
1995-06-07 |
1997-09-23 |
Advanced Micro Devices, Inc. |
Structures to extract defect size information of poly and source-drain semiconductor devices and method for making the same
|
US6001663A
(en)
*
|
1995-06-07 |
1999-12-14 |
Advanced Micro Devices, Inc. |
Apparatus for detecting defect sizes in polysilicon and source-drain semiconductor devices and method for making the same
|
JPH0972870A
(ja)
*
|
1995-07-06 |
1997-03-18 |
Toyota Central Res & Dev Lab Inc |
劣化検出方法及び劣化検出装置
|
JP3473218B2
(ja)
*
|
1995-10-24 |
2003-12-02 |
日産自動車株式会社 |
半導体集積回路
|
US5712571A
(en)
*
|
1995-11-03 |
1998-01-27 |
Analog Devices, Inc. |
Apparatus and method for detecting defects arising as a result of integrated circuit processing
|
US5670883A
(en)
*
|
1995-11-20 |
1997-09-23 |
Analog Devices, Inc. |
Integrated circuit interlevel conductor defect characterization test structure and system
|
US6239604B1
(en)
*
|
1996-10-04 |
2001-05-29 |
U.S. Philips Corporation |
Method for inspecting an integrated circuit by measuring a voltage drop in a supply line of sub-circuit thereof
|
US5942900A
(en)
*
|
1996-12-17 |
1999-08-24 |
Lexmark International, Inc. |
Method of fault detection in ink jet printhead heater chips
|
CH692162A5
(fr)
*
|
1997-03-24 |
2002-02-28 |
Em Microelectronic Marin Sa |
Procédé de mesure pour détecter un court-circuit entre des spires d'une bobine intégrée sur une puce, et structure de circuit intégré adaptée à un tel procédé de mesure.
|
US5952836A
(en)
*
|
1997-04-28 |
1999-09-14 |
Mcdonnell Douglas Corporation |
Device and method for detecting workpiece fractures
|
US6111269A
(en)
|
1997-05-30 |
2000-08-29 |
Cypress Semiconductor Corp. |
Circuit, structure and method of testing a semiconductor, such as an integrated circuit
|
US5952674A
(en)
*
|
1998-03-18 |
1999-09-14 |
International Business Machines Corporation |
Topography monitor
|
US6297644B1
(en)
|
1999-03-04 |
2001-10-02 |
Advanced Micro Devices, Inc. |
Multipurpose defect test structure with switchable voltage contrast capability and method of use
|
US6268717B1
(en)
*
|
1999-03-04 |
2001-07-31 |
Advanced Micro Devices, Inc. |
Semiconductor test structure with intentional partial defects and method of use
|
US6452412B1
(en)
|
1999-03-04 |
2002-09-17 |
Advanced Micro Devices, Inc. |
Drop-in test structure and methodology for characterizing an integrated circuit process flow and topography
|
US6426516B1
(en)
*
|
1999-08-16 |
2002-07-30 |
International Business Machines Corporation |
Kerf contact to silicon redesign for defect isolation and analysis
|
US6429452B1
(en)
*
|
1999-08-17 |
2002-08-06 |
Advanced Micro Devices, Inc. |
Test structure and methodology for characterizing ion implantation in an integrated circuit fabrication process
|
US6261956B1
(en)
*
|
1999-09-17 |
2001-07-17 |
Advanced Micro Devices, Inc. |
Modified product mask for bridging detection
|
US6978229B1
(en)
|
1999-11-18 |
2005-12-20 |
Pdf Solutions, Inc. |
Efficient method for modeling and simulation of the impact of local and global variation on integrated circuits
|
US6449749B1
(en)
*
|
1999-11-18 |
2002-09-10 |
Pdf Solutions, Inc. |
System and method for product yield prediction
|
US6475871B1
(en)
|
1999-11-18 |
2002-11-05 |
Pdf Solutions, Inc. |
Passive multiplexor test structure for integrated circuit manufacturing
|
AU1780701A
(en)
|
1999-11-18 |
2001-05-30 |
Pdf Solutions, Inc. |
System and method for product yield prediction using a logic characterization vehicle
|
GB0030346D0
(en)
*
|
2000-12-13 |
2001-01-24 |
Mitel Semiconductor Ltd |
Integrated circuit test structure
|
AU2002360244A1
(en)
*
|
2001-08-31 |
2003-04-07 |
Pdf Solutions, Inc. |
Test structures and models for estimating the yield impact of dishing and/or voids
|
US6639396B2
(en)
*
|
2001-09-26 |
2003-10-28 |
Compeq Manufacturing Company Limited |
Detecting structure formed on a PCB to detect unavailability of the lines
|
US6521910B1
(en)
*
|
2001-11-02 |
2003-02-18 |
United Microelectronics Corp. |
Structure of a test key for monitoring salicide residue
|
CN1650296A
(zh)
|
2002-02-28 |
2005-08-03 |
Pdf技术公司 |
线复制测试设备的后端
|
US6873146B2
(en)
*
|
2003-03-12 |
2005-03-29 |
Texas Instruments Incorporated |
Integrated circuit testing device and a method of use therefor
|
KR100555504B1
(ko)
*
|
2003-06-27 |
2006-03-03 |
삼성전자주식회사 |
결함 크기를 검출할 수 있는 반도체 소자의 테스트 구조및 이를 이용한 테스트 방법
|
US7253436B2
(en)
*
|
2003-07-25 |
2007-08-07 |
Matsushita Electric Industrial Co., Ltd. |
Resistance defect assessment device, resistance defect assessment method, and method for manufacturing resistance defect assessment device
|
JP2006038988A
(ja)
*
|
2004-07-23 |
2006-02-09 |
Seiko Epson Corp |
電気光学装置、電子機器、および実装構造体
|
US7688083B2
(en)
*
|
2004-09-23 |
2010-03-30 |
Nxp B.V. |
Analogue measurement of alignment between layers of a semiconductor device
|
JP2006108231A
(ja)
*
|
2004-10-01 |
2006-04-20 |
Denso Corp |
半導体装置
|
US7088115B1
(en)
*
|
2004-12-16 |
2006-08-08 |
Battelle Energy Alliance, Llc |
Electrochemical impedance spectroscopy system and methods for determining spatial locations of defects
|
US7749778B2
(en)
*
|
2007-01-03 |
2010-07-06 |
International Business Machines Corporation |
Addressable hierarchical metal wire test methodology
|
US7592827B1
(en)
*
|
2007-01-12 |
2009-09-22 |
Pdf Solutions, Inc. |
Apparatus and method for electrical detection and localization of shorts in metal interconnect lines
|
US20080244475A1
(en)
*
|
2007-03-30 |
2008-10-02 |
Tseng Chin Lo |
Network based integrated circuit testline generator
|
US7782073B2
(en)
*
|
2007-03-30 |
2010-08-24 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
High accuracy and universal on-chip switch matrix testline
|
US7679384B2
(en)
|
2007-06-08 |
2010-03-16 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Parametric testline with increased test pattern areas
|
CN101373756B
(zh)
*
|
2007-08-21 |
2010-09-29 |
中芯国际集成电路制造(上海)有限公司 |
金属制程工艺中凹陷现象的测试结构及方法
|
US8159254B2
(en)
*
|
2008-02-13 |
2012-04-17 |
Infineon Technolgies Ag |
Crack sensors for semiconductor devices
|
US7825678B2
(en)
*
|
2008-08-22 |
2010-11-02 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Test pad design for reducing the effect of contact resistances
|
JP2010182932A
(ja)
*
|
2009-02-06 |
2010-08-19 |
Renesas Electronics Corp |
半導体装置及び半導体装置の不良解析方法
|
US9252202B2
(en)
*
|
2011-08-23 |
2016-02-02 |
Wafertech, Llc |
Test structure and method for determining overlay accuracy in semiconductor devices using resistance measurement
|
US9691671B2
(en)
*
|
2014-08-28 |
2017-06-27 |
United Microelectronics Corp. |
Test key array
|
CN205959980U
(zh)
*
|
2016-08-26 |
2017-02-15 |
合肥鑫晟光电科技有限公司 |
膜层测试结构及阵列基板
|