DE3775417D1 - Verfahren und vorrichtung zum nachweis von musterfehlern fuer mikroelektronische anordnungen. - Google Patents

Verfahren und vorrichtung zum nachweis von musterfehlern fuer mikroelektronische anordnungen.

Info

Publication number
DE3775417D1
DE3775417D1 DE8787100518T DE3775417T DE3775417D1 DE 3775417 D1 DE3775417 D1 DE 3775417D1 DE 8787100518 T DE8787100518 T DE 8787100518T DE 3775417 T DE3775417 T DE 3775417T DE 3775417 D1 DE3775417 D1 DE 3775417D1
Authority
DE
Germany
Prior art keywords
detecting pattern
pattern errors
microelectronic
arrangements
microelectronic arrangements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8787100518T
Other languages
English (en)
Inventor
Akihiro Kk Toyoda Jido Yoshida
Takahide Kk Toyoda Jidosh Iida
Hiroshi Kk Toyoda Jidos Miyake
Shuzo Hattori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Industries Corp
HATTORI SHUZO
Original Assignee
HATTORI SHUZO
Toyoda Jidoshokki Seisakusho KK
Toyoda Automatic Loom Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP61228980A external-priority patent/JPS62259454A/ja
Application filed by HATTORI SHUZO, Toyoda Jidoshokki Seisakusho KK, Toyoda Automatic Loom Works Ltd filed Critical HATTORI SHUZO
Application granted granted Critical
Publication of DE3775417D1 publication Critical patent/DE3775417D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/10—Scanning
    • G01N2201/103—Scanning by mechanical motion of stage

Landscapes

  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
DE8787100518T 1986-01-18 1987-01-16 Verfahren und vorrichtung zum nachweis von musterfehlern fuer mikroelektronische anordnungen. Expired - Lifetime DE3775417D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP839186 1986-01-18
JP61228980A JPS62259454A (ja) 1986-01-18 1986-09-27 パタ−ンの欠陥検出方法および装置

Publications (1)

Publication Number Publication Date
DE3775417D1 true DE3775417D1 (de) 1992-02-06

Family

ID=26342905

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787100518T Expired - Lifetime DE3775417D1 (de) 1986-01-18 1987-01-16 Verfahren und vorrichtung zum nachweis von musterfehlern fuer mikroelektronische anordnungen.

Country Status (3)

Country Link
US (1) US4760265A (de)
EP (1) EP0230285B1 (de)
DE (1) DE3775417D1 (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4734923A (en) * 1986-05-19 1988-03-29 Hampshire Instruments, Inc Lithographic system mask inspection device
US4863252A (en) * 1988-02-11 1989-09-05 Tracor Northern, Inc. Objective lens positioning system for confocal tandem scanning reflected light microscope
IL99823A0 (en) * 1990-11-16 1992-08-18 Orbot Instr Ltd Optical inspection method and apparatus
JP2688123B2 (ja) * 1991-04-19 1997-12-08 富士写真フイルム株式会社 放射線画像情報記録読取装置
US5563702A (en) * 1991-08-22 1996-10-08 Kla Instruments Corporation Automated photomask inspection apparatus and method
JPH07335165A (ja) * 1994-06-10 1995-12-22 Hitachi Ltd 格子欠陥観察用電子顕微鏡
US6013355A (en) * 1996-12-30 2000-01-11 International Business Machines Corp. Testing laminates with x-ray moire interferometry
US6048422A (en) * 1998-09-16 2000-04-11 Kim, Ii; John Method of applying glitter and the like to non-planar surfaces and three-dimensional articles
US6489586B1 (en) * 1999-04-29 2002-12-03 Cad-Tech, Inc. Method and apparatus for verification of assembled printed circuit boards
US6236196B1 (en) 1999-06-03 2001-05-22 International Business Machines Corporation Thermal modulation system and method for locating a circuit defect such as a short or incipient open independent of a circuit geometry
US6414330B1 (en) * 1999-06-04 2002-07-02 Jim H. Johnson Method and apparatus for applying electron radiation to subcutaneous cells
US6693664B2 (en) 1999-06-30 2004-02-17 Negevtech Method and system for fast on-line electro-optical detection of wafer defects
US6369888B1 (en) * 1999-11-17 2002-04-09 Applied Materials, Inc. Method and apparatus for article inspection including speckle reduction
US6484306B1 (en) * 1999-12-17 2002-11-19 The Regents Of The University Of California Multi-level scanning method for defect inspection
EP1184725A1 (de) * 2000-09-04 2002-03-06 Infineon Technologies SC300 GmbH & Co. KG Verfahren zur Einstellung eines lithographischen Gerätes
US20020053647A1 (en) * 2000-11-06 2002-05-09 Masataka Shiratsuchi Pattern detection, processing and testing apparatus
US6611327B2 (en) * 2001-03-23 2003-08-26 Intel Corporation Detection of contaminants on low wavelength masks
US6847433B2 (en) * 2001-06-01 2005-01-25 Agere Systems, Inc. Holder, system, and process for improving overlay in lithography
US7525659B2 (en) * 2003-01-15 2009-04-28 Negevtech Ltd. System for detection of water defects
DE60324656D1 (de) * 2003-01-15 2008-12-24 Negevtech Ltd Verfahren und Gerät zur schnellen on-line und elektro-optischen Defekterkennung an Wafern
US6892013B2 (en) * 2003-01-15 2005-05-10 Negevtech Ltd. Fiber optical illumination system
US7486861B2 (en) * 2003-01-15 2009-02-03 Negevtech Ltd. Fiber optical illumination system
WO2006006148A2 (en) * 2004-07-12 2006-01-19 Negevtech Ltd. Multi mode inspection method and apparatus
US20060012781A1 (en) * 2004-07-14 2006-01-19 Negevtech Ltd. Programmable spatial filter for wafer inspection
US7813541B2 (en) * 2005-02-28 2010-10-12 Applied Materials South East Asia Pte. Ltd. Method and apparatus for detecting defects in wafers
US7804993B2 (en) * 2005-02-28 2010-09-28 Applied Materials South East Asia Pte. Ltd. Method and apparatus for detecting defects in wafers including alignment of the wafer images so as to induce the same smear in all images
US8031931B2 (en) 2006-04-24 2011-10-04 Applied Materials South East Asia Pte. Ltd. Printed fourier filtering in optical inspection tools
US7671990B1 (en) * 2006-07-28 2010-03-02 Kla-Tencor Technologies Corporation Cross hatched metrology marks and associated method of use
US7719674B2 (en) * 2006-11-28 2010-05-18 Applied Materials South East Asia Pte. Ltd. Image splitting in optical inspection systems
US7714998B2 (en) * 2006-11-28 2010-05-11 Applied Materials South East Asia Pte. Ltd. Image splitting in optical inspection systems
JP5322543B2 (ja) * 2008-09-08 2013-10-23 株式会社日立ハイテクノロジーズ 基板検査装置及び基板検査方法
US8575791B2 (en) * 2010-12-17 2013-11-05 National Formosa University Manufacturing-process equipment
US8692204B2 (en) * 2011-04-26 2014-04-08 Kla-Tencor Corporation Apparatus and methods for electron beam detection
DE102013016113B4 (de) * 2013-09-26 2018-11-29 Carl Zeiss Microscopy Gmbh Verfahren zum Detektieren von Elektronen, Elektronendetektor und Inspektionssystem
KR102372842B1 (ko) 2016-04-22 2022-03-08 어플라이드 머티어리얼스, 인코포레이티드 Pecvd 오버레이 개선을 위한 방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2146106B1 (de) * 1971-07-16 1977-08-05 Thomson Csf
US3742229A (en) * 1972-06-29 1973-06-26 Massachusetts Inst Technology Soft x-ray mask alignment system
US4260670A (en) * 1979-07-12 1981-04-07 Western Electric Company, Inc. X-ray mask
JPS56126750A (en) * 1980-03-11 1981-10-05 Mitsubishi Electric Corp Inspecting device for transmission of radiant ray
US4335313A (en) * 1980-05-12 1982-06-15 The Perkin-Elmer Corporation Method and apparatus for aligning an opaque mask with an integrated circuit wafer
DE3104052A1 (de) * 1981-02-06 1982-08-19 Philips Patentverwaltung Gmbh, 2000 Hamburg "roentgenuntersuchungsanordnung mit hoher ortsaufloesung"
US4467211A (en) * 1981-04-16 1984-08-21 Control Data Corporation Method and apparatus for exposing multi-level registered patterns interchangeably between stations of a multi-station electron-beam array lithography (EBAL) system
DE3207085A1 (de) * 1982-02-26 1983-09-08 Siemens AG, 1000 Berlin und 8000 München Roentgendiagnostikeinrichtung mit einer bildverstaerker-fernsehkette
JPS5963725A (ja) * 1982-10-05 1984-04-11 Toshiba Corp パタ−ン検査装置
US4613981A (en) * 1984-01-24 1986-09-23 Varian Associates, Inc. Method and apparatus for lithographic rotate and repeat processing

Also Published As

Publication number Publication date
EP0230285A2 (de) 1987-07-29
US4760265A (en) 1988-07-26
EP0230285B1 (de) 1991-12-27
EP0230285A3 (en) 1989-10-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee