DE3775417D1 - Verfahren und vorrichtung zum nachweis von musterfehlern fuer mikroelektronische anordnungen. - Google Patents
Verfahren und vorrichtung zum nachweis von musterfehlern fuer mikroelektronische anordnungen.Info
- Publication number
- DE3775417D1 DE3775417D1 DE8787100518T DE3775417T DE3775417D1 DE 3775417 D1 DE3775417 D1 DE 3775417D1 DE 8787100518 T DE8787100518 T DE 8787100518T DE 3775417 T DE3775417 T DE 3775417T DE 3775417 D1 DE3775417 D1 DE 3775417D1
- Authority
- DE
- Germany
- Prior art keywords
- detecting pattern
- pattern errors
- microelectronic
- arrangements
- microelectronic arrangements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/10—Scanning
- G01N2201/103—Scanning by mechanical motion of stage
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP839186 | 1986-01-18 | ||
JP61228980A JPS62259454A (ja) | 1986-01-18 | 1986-09-27 | パタ−ンの欠陥検出方法および装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3775417D1 true DE3775417D1 (de) | 1992-02-06 |
Family
ID=26342905
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8787100518T Expired - Lifetime DE3775417D1 (de) | 1986-01-18 | 1987-01-16 | Verfahren und vorrichtung zum nachweis von musterfehlern fuer mikroelektronische anordnungen. |
Country Status (3)
Country | Link |
---|---|
US (1) | US4760265A (de) |
EP (1) | EP0230285B1 (de) |
DE (1) | DE3775417D1 (de) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4734923A (en) * | 1986-05-19 | 1988-03-29 | Hampshire Instruments, Inc | Lithographic system mask inspection device |
US4863252A (en) * | 1988-02-11 | 1989-09-05 | Tracor Northern, Inc. | Objective lens positioning system for confocal tandem scanning reflected light microscope |
IL99823A0 (en) * | 1990-11-16 | 1992-08-18 | Orbot Instr Ltd | Optical inspection method and apparatus |
JP2688123B2 (ja) * | 1991-04-19 | 1997-12-08 | 富士写真フイルム株式会社 | 放射線画像情報記録読取装置 |
US5563702A (en) * | 1991-08-22 | 1996-10-08 | Kla Instruments Corporation | Automated photomask inspection apparatus and method |
JPH07335165A (ja) * | 1994-06-10 | 1995-12-22 | Hitachi Ltd | 格子欠陥観察用電子顕微鏡 |
US6013355A (en) * | 1996-12-30 | 2000-01-11 | International Business Machines Corp. | Testing laminates with x-ray moire interferometry |
US6048422A (en) * | 1998-09-16 | 2000-04-11 | Kim, Ii; John | Method of applying glitter and the like to non-planar surfaces and three-dimensional articles |
US6489586B1 (en) * | 1999-04-29 | 2002-12-03 | Cad-Tech, Inc. | Method and apparatus for verification of assembled printed circuit boards |
US6236196B1 (en) | 1999-06-03 | 2001-05-22 | International Business Machines Corporation | Thermal modulation system and method for locating a circuit defect such as a short or incipient open independent of a circuit geometry |
US6414330B1 (en) * | 1999-06-04 | 2002-07-02 | Jim H. Johnson | Method and apparatus for applying electron radiation to subcutaneous cells |
US6693664B2 (en) | 1999-06-30 | 2004-02-17 | Negevtech | Method and system for fast on-line electro-optical detection of wafer defects |
US6369888B1 (en) * | 1999-11-17 | 2002-04-09 | Applied Materials, Inc. | Method and apparatus for article inspection including speckle reduction |
US6484306B1 (en) * | 1999-12-17 | 2002-11-19 | The Regents Of The University Of California | Multi-level scanning method for defect inspection |
EP1184725A1 (de) * | 2000-09-04 | 2002-03-06 | Infineon Technologies SC300 GmbH & Co. KG | Verfahren zur Einstellung eines lithographischen Gerätes |
US20020053647A1 (en) * | 2000-11-06 | 2002-05-09 | Masataka Shiratsuchi | Pattern detection, processing and testing apparatus |
US6611327B2 (en) * | 2001-03-23 | 2003-08-26 | Intel Corporation | Detection of contaminants on low wavelength masks |
US6847433B2 (en) * | 2001-06-01 | 2005-01-25 | Agere Systems, Inc. | Holder, system, and process for improving overlay in lithography |
US6892013B2 (en) * | 2003-01-15 | 2005-05-10 | Negevtech Ltd. | Fiber optical illumination system |
US7486861B2 (en) * | 2003-01-15 | 2009-02-03 | Negevtech Ltd. | Fiber optical illumination system |
US7525659B2 (en) * | 2003-01-15 | 2009-04-28 | Negevtech Ltd. | System for detection of water defects |
DE60324656D1 (de) * | 2003-01-15 | 2008-12-24 | Negevtech Ltd | Verfahren und Gerät zur schnellen on-line und elektro-optischen Defekterkennung an Wafern |
WO2006006148A2 (en) * | 2004-07-12 | 2006-01-19 | Negevtech Ltd. | Multi mode inspection method and apparatus |
US20060012781A1 (en) * | 2004-07-14 | 2006-01-19 | Negevtech Ltd. | Programmable spatial filter for wafer inspection |
US7813541B2 (en) * | 2005-02-28 | 2010-10-12 | Applied Materials South East Asia Pte. Ltd. | Method and apparatus for detecting defects in wafers |
US7804993B2 (en) * | 2005-02-28 | 2010-09-28 | Applied Materials South East Asia Pte. Ltd. | Method and apparatus for detecting defects in wafers including alignment of the wafer images so as to induce the same smear in all images |
US8031931B2 (en) | 2006-04-24 | 2011-10-04 | Applied Materials South East Asia Pte. Ltd. | Printed fourier filtering in optical inspection tools |
US7671990B1 (en) * | 2006-07-28 | 2010-03-02 | Kla-Tencor Technologies Corporation | Cross hatched metrology marks and associated method of use |
US7714998B2 (en) * | 2006-11-28 | 2010-05-11 | Applied Materials South East Asia Pte. Ltd. | Image splitting in optical inspection systems |
US7719674B2 (en) * | 2006-11-28 | 2010-05-18 | Applied Materials South East Asia Pte. Ltd. | Image splitting in optical inspection systems |
JP5322543B2 (ja) * | 2008-09-08 | 2013-10-23 | 株式会社日立ハイテクノロジーズ | 基板検査装置及び基板検査方法 |
US8575791B2 (en) * | 2010-12-17 | 2013-11-05 | National Formosa University | Manufacturing-process equipment |
US8692204B2 (en) * | 2011-04-26 | 2014-04-08 | Kla-Tencor Corporation | Apparatus and methods for electron beam detection |
DE102013016113B4 (de) | 2013-09-26 | 2018-11-29 | Carl Zeiss Microscopy Gmbh | Verfahren zum Detektieren von Elektronen, Elektronendetektor und Inspektionssystem |
KR102372842B1 (ko) | 2016-04-22 | 2022-03-08 | 어플라이드 머티어리얼스, 인코포레이티드 | Pecvd 오버레이 개선을 위한 방법 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2146106B1 (de) * | 1971-07-16 | 1977-08-05 | Thomson Csf | |
US3742229A (en) * | 1972-06-29 | 1973-06-26 | Massachusetts Inst Technology | Soft x-ray mask alignment system |
US4260670A (en) * | 1979-07-12 | 1981-04-07 | Western Electric Company, Inc. | X-ray mask |
JPS56126750A (en) * | 1980-03-11 | 1981-10-05 | Mitsubishi Electric Corp | Inspecting device for transmission of radiant ray |
US4335313A (en) * | 1980-05-12 | 1982-06-15 | The Perkin-Elmer Corporation | Method and apparatus for aligning an opaque mask with an integrated circuit wafer |
DE3104052A1 (de) * | 1981-02-06 | 1982-08-19 | Philips Patentverwaltung Gmbh, 2000 Hamburg | "roentgenuntersuchungsanordnung mit hoher ortsaufloesung" |
US4467211A (en) * | 1981-04-16 | 1984-08-21 | Control Data Corporation | Method and apparatus for exposing multi-level registered patterns interchangeably between stations of a multi-station electron-beam array lithography (EBAL) system |
DE3207085A1 (de) * | 1982-02-26 | 1983-09-08 | Siemens AG, 1000 Berlin und 8000 München | Roentgendiagnostikeinrichtung mit einer bildverstaerker-fernsehkette |
JPS5963725A (ja) * | 1982-10-05 | 1984-04-11 | Toshiba Corp | パタ−ン検査装置 |
US4613981A (en) * | 1984-01-24 | 1986-09-23 | Varian Associates, Inc. | Method and apparatus for lithographic rotate and repeat processing |
-
1987
- 1987-01-15 US US07/003,572 patent/US4760265A/en not_active Expired - Fee Related
- 1987-01-16 EP EP87100518A patent/EP0230285B1/de not_active Expired
- 1987-01-16 DE DE8787100518T patent/DE3775417D1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0230285A2 (de) | 1987-07-29 |
US4760265A (en) | 1988-07-26 |
EP0230285B1 (de) | 1991-12-27 |
EP0230285A3 (en) | 1989-10-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |