DE3872932D1 - Geraet und verfahren zur detektion oberflaechenfehler. - Google Patents

Geraet und verfahren zur detektion oberflaechenfehler.

Info

Publication number
DE3872932D1
DE3872932D1 DE8888304001T DE3872932T DE3872932D1 DE 3872932 D1 DE3872932 D1 DE 3872932D1 DE 8888304001 T DE8888304001 T DE 8888304001T DE 3872932 T DE3872932 T DE 3872932T DE 3872932 D1 DE3872932 D1 DE 3872932D1
Authority
DE
Germany
Prior art keywords
detecting surface
surface errors
errors
detecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8888304001T
Other languages
English (en)
Other versions
DE3872932T2 (de
Inventor
George S Quackenbos
Jay L Ormsby
Koichi Nishine
Eric T Chase
Sergey V Broude
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
QC Optics Inc
Original Assignee
QC Optics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by QC Optics Inc filed Critical QC Optics Inc
Application granted granted Critical
Publication of DE3872932D1 publication Critical patent/DE3872932D1/de
Publication of DE3872932T2 publication Critical patent/DE3872932T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9506—Optical discs
DE8888304001T 1987-05-08 1988-05-03 Geraet und verfahren zur detektion oberflaechenfehler. Expired - Lifetime DE3872932T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/047,889 US4794265A (en) 1987-05-08 1987-05-08 Surface pit detection system and method

Publications (2)

Publication Number Publication Date
DE3872932D1 true DE3872932D1 (de) 1992-08-27
DE3872932T2 DE3872932T2 (de) 1992-12-03

Family

ID=21951580

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8888304001T Expired - Lifetime DE3872932T2 (de) 1987-05-08 1988-05-03 Geraet und verfahren zur detektion oberflaechenfehler.

Country Status (5)

Country Link
US (1) US4794265A (de)
EP (1) EP0290227B1 (de)
JP (1) JPH0718808B2 (de)
CA (1) CA1297710C (de)
DE (1) DE3872932T2 (de)

Families Citing this family (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2680482B2 (ja) * 1990-06-25 1997-11-19 株式会社東芝 半導体基板、半導体基板と半導体装置の製造方法、並びに半導体基板の検査・評価方法
US4876457A (en) * 1988-10-31 1989-10-24 American Telephone And Telegraph Company Method and apparatus for differentiating a planar textured surface from a surrounding background
WO1991018281A1 (en) * 1990-05-23 1991-11-28 Pulp And Paper Research Institute Of Canada On-line dirt counter
US5504732A (en) * 1990-08-15 1996-04-02 Del Mar Avionics Null inflection detection and pulse expand latch in an optical recording system
US5155372A (en) * 1991-11-26 1992-10-13 International Business Machines Corporation Optical inspection system utilizing wedge shaped spatial filter
US5389794A (en) * 1992-11-25 1995-02-14 Qc Optics, Inc. Surface pit and mound detection and discrimination system and method
US5581346A (en) * 1993-05-10 1996-12-03 Midwest Research Institute System for characterizing semiconductor materials and photovoltaic device
US5757474A (en) * 1993-05-10 1998-05-26 Midwest Research Institute System for characterizing semiconductor materials and photovoltaic devices through calibration
US5406367A (en) * 1993-05-10 1995-04-11 Midwest Research Institute Defect mapping system
US6271916B1 (en) 1994-03-24 2001-08-07 Kla-Tencor Corporation Process and assembly for non-destructive surface inspections
JP3338561B2 (ja) * 1994-08-26 2002-10-28 株式会社ソニー・ディスクテクノロジー ディスク欠陥検査装置
US6118525A (en) * 1995-03-06 2000-09-12 Ade Optical Systems Corporation Wafer inspection system for distinguishing pits and particles
US5672885A (en) * 1995-07-10 1997-09-30 Qc Optics, Inc. Surface displacement detection and adjustment system
US5625193A (en) * 1995-07-10 1997-04-29 Qc Optics, Inc. Optical inspection system and method for detecting flaws on a diffractive surface
WO1997012226A1 (en) * 1995-09-25 1997-04-03 Tencor Instruments Improved system for surface inspection
WO1997026529A1 (en) * 1996-01-19 1997-07-24 Phase Metrics Surface inspection apparatus and method
US5883714A (en) * 1996-10-07 1999-03-16 Phase Metrics Method and apparatus for detecting defects on a disk using interferometric analysis on reflected light
US5940174A (en) * 1996-10-16 1999-08-17 Wea Manufacturing Inc. Optical disc inspection equalization system and method
US5867261A (en) * 1997-04-28 1999-02-02 International Business Machines Corporation Surface inspection tool
US5917589A (en) * 1997-04-28 1999-06-29 International Business Machines Corporation Surface inspection tool
US6100971A (en) * 1997-04-28 2000-08-08 International Business Machines Corporation Surface inspection tool
US5847823A (en) * 1997-04-28 1998-12-08 International Business Machines Corporation Surface inspection tool
US6704435B1 (en) 1997-04-28 2004-03-09 International Business Machines Corporation Surface inspection tool
US6624884B1 (en) 1997-04-28 2003-09-23 International Business Machines Corporation Surface inspection tool
US5969370A (en) * 1997-04-28 1999-10-19 International Business Machines Corporation Surface inspection tool
MY117417A (en) * 1997-06-25 2004-06-30 Hitachi High Tech Corp Magnetic disk testing method and surface defect testing device
US6057926A (en) * 1997-06-25 2000-05-02 Hitachi Electronics Engineering Co., Ltd. Magnetic disk testing method and surface defect testing device
US6201601B1 (en) 1997-09-19 2001-03-13 Kla-Tencor Corporation Sample inspection system
US6956644B2 (en) * 1997-09-19 2005-10-18 Kla-Tencor Technologies Corporation Systems and methods for a wafer inspection system using multiple angles and multiple wavelength illumination
US20040057045A1 (en) * 2000-12-21 2004-03-25 Mehdi Vaez-Iravani Sample inspection system
US5898492A (en) * 1997-09-25 1999-04-27 International Business Machines Corporation Surface inspection tool using reflected and scattered light
JPH11183394A (ja) * 1997-12-25 1999-07-09 Systemseiko Co Ltd ディスクの表面検査方法および装置
US6169601B1 (en) 1998-06-23 2001-01-02 Ade Optical Systems Method and apparatus for distinguishing particles from subsurface defects on a substrate using polarized light
US20050134841A1 (en) * 1998-09-18 2005-06-23 Mehdi Vacz-Iravani Sample inspection system
DE19904427B4 (de) * 1999-02-04 2004-12-16 Basler Ag Verfahren zum Prüfen von rotationssymmetrischen Gegenständen
JP2000280725A (ja) * 1999-04-01 2000-10-10 Sanden Corp 自動車用空調装置
JP2000289439A (ja) * 1999-04-02 2000-10-17 Sanden Corp 自動車用空調装置
JP2000289433A (ja) * 1999-04-09 2000-10-17 Sanden Corp 自動車用空調装置
US6486946B1 (en) 1999-06-15 2002-11-26 Ade Corporation Method for discriminating between holes in and particles on a film covering a substrate
US6548821B1 (en) 1999-06-21 2003-04-15 Komag, Inc. Method and apparatus for inspecting substrates
US6566674B1 (en) 1999-06-21 2003-05-20 Komag, Inc. Method and apparatus for inspecting substrates
US6342707B1 (en) * 2000-06-20 2002-01-29 Katsina Optics, Inc. Laser scatterometer with adjustable beam block
US6687008B1 (en) 2000-10-19 2004-02-03 Kla-Tencor Corporation Waveguide based parallel multi-phaseshift interferometry for high speed metrology, optical inspection, and non-contact sensing
JP2004513364A (ja) * 2000-11-13 2004-04-30 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 表面欠陥の測定
US6600556B2 (en) * 2001-01-10 2003-07-29 Hitachi Global Storage Technologies Netherlands, B.V. System and method for detecting manufacturing marks on sputtered disks
WO2002082064A1 (en) * 2001-04-06 2002-10-17 Kla-Tencor Corporation Improved defect detection system
US6538730B2 (en) * 2001-04-06 2003-03-25 Kla-Tencor Technologies Corporation Defect detection system
US6657714B2 (en) * 2001-09-24 2003-12-02 Applied Materials, Inc. Defect detection with enhanced dynamic range
US7116413B2 (en) * 2002-09-13 2006-10-03 Kla-Tencor Corporation Inspection system for integrated applications
US7433031B2 (en) * 2003-10-29 2008-10-07 Core Tech Optical, Inc. Defect review system with 2D scanning and a ring detector
US20050105791A1 (en) * 2003-10-29 2005-05-19 Lee Ken K. Surface inspection method
US7110106B2 (en) * 2003-10-29 2006-09-19 Coretech Optical, Inc. Surface inspection system
WO2006014152A1 (en) * 2004-07-01 2006-02-09 Midwest Research Institute Optic probe for semiconductor characterization
US7302148B2 (en) * 2005-01-13 2007-11-27 Komag, Inc. Test head for optically inspecting workpieces
US20060181697A1 (en) * 2005-01-13 2006-08-17 Komag, Inc. Circularly polarized light for optically inspecting workpieces
US7239970B2 (en) * 2005-01-13 2007-07-03 Komag, Inc. Robotic system for optically inspecting workpieces
US7305119B2 (en) * 2005-01-13 2007-12-04 Komag, Inc. Test head for optically inspecting workpieces
US7184139B2 (en) * 2005-01-13 2007-02-27 Komag, Inc. Test head for optically inspecting workpieces
US7375362B2 (en) * 2005-01-13 2008-05-20 Wd Media, Inc. Method and apparatus for reducing or eliminating stray light in an optical test head
US7425719B2 (en) * 2005-01-13 2008-09-16 Wd Media, Inc. Method and apparatus for selectively providing data from a test head to a processor
US7292329B2 (en) * 2005-01-13 2007-11-06 Komag, Inc. Test head for optically inspecting workpieces comprising a lens for elongating a laser spot on the workpieces
US7554656B2 (en) * 2005-10-06 2009-06-30 Kla-Tencor Technologies Corp. Methods and systems for inspection of a wafer
US7362450B2 (en) * 2005-12-23 2008-04-22 Xerox Corporation Specular surface flaw detection
US20070146692A1 (en) * 2005-12-23 2007-06-28 Xerox Corporation Fiber optic specular surface flaw detection
US7326929B2 (en) * 2006-02-06 2008-02-05 Northrop Grumman Corporation Method and apparatus for inspection of semiconductor devices
US7705978B2 (en) * 2006-02-06 2010-04-27 Northrop Grumman Corporation Method and apparatus for inspection of multi-junction solar cells
US7663745B2 (en) * 2007-02-09 2010-02-16 Xerox Corporation Plural light source and camera to detect surface flaws
JP5566078B2 (ja) * 2009-10-28 2014-08-06 株式会社ニレコ 突起物検出装置及び突起物検出方法
WO2013028196A1 (en) 2011-08-25 2013-02-28 Alliance For Sustainable Energy, Llc On-line, continuous monitoring in solar cell and fuel cell manufacturing using spectral reflectance imaging
JP2014035316A (ja) * 2012-08-10 2014-02-24 Hitachi High-Technologies Corp ダブルレシピ処理機能を有する表面検査装置及びその方法
US10480935B2 (en) 2016-12-02 2019-11-19 Alliance For Sustainable Energy, Llc Thickness mapping using multispectral imaging
CN108507909B (zh) * 2017-02-28 2021-04-09 上海微电子装备（集团）股份有限公司 一种平板颗粒度检测装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4184082A (en) * 1975-12-08 1980-01-15 Howell Laboratories, Incorporated Linear flaw detector
GB1592449A (en) * 1976-12-01 1981-07-08 Ferranti Ltd Optical inspection apparatus
US4352564A (en) * 1980-05-30 1982-10-05 Rca Corporation Missing order defect detection apparatus
FR2500630A1 (fr) * 1981-02-25 1982-08-27 Leser Jacques Procede pour la recherche des defauts des feuilles de verre et dispositif mettant en oeuvre ce procede
US4395122A (en) * 1981-04-29 1983-07-26 Rca Corporation Defect detection system
US4376583A (en) * 1981-05-12 1983-03-15 Aeronca Electronics, Inc. Surface inspection scanning system
US4583861A (en) * 1981-08-12 1986-04-22 Tokyo Shibaura Denki Kabushiki Kaisha Surface condition judging apparatus
US4598997A (en) * 1982-02-15 1986-07-08 Rca Corporation Apparatus and method for detecting defects and dust on a patterned surface
JPS58155731A (ja) * 1982-03-12 1983-09-16 Hitachi Ltd 欠陥検査装置
JPS6128846A (ja) * 1984-07-19 1986-02-08 Toshiba Corp 表面検査装置
US4630276A (en) * 1984-10-09 1986-12-16 Aeronca Electronics, Inc. Compact laser scanning system
JPH0629859B2 (ja) * 1986-01-14 1994-04-20 株式会社神戸製鋼所 表面欠陥検出装置
JPH0795039B2 (ja) * 1986-11-13 1995-10-11 株式会社東芝 欠陥検査装置
JPH0787208B2 (ja) * 1986-12-08 1995-09-20 日立電子エンジニアリング株式会社 面板欠陥検出光学装置

Also Published As

Publication number Publication date
JPH0718808B2 (ja) 1995-03-06
DE3872932T2 (de) 1992-12-03
JPS6435246A (en) 1989-02-06
US4794265A (en) 1988-12-27
EP0290227A3 (en) 1990-03-14
EP0290227A2 (de) 1988-11-09
CA1297710C (en) 1992-03-24
EP0290227B1 (de) 1992-07-22

Similar Documents

Publication Publication Date Title
DE3872932D1 (de) Geraet und verfahren zur detektion oberflaechenfehler.
DE3876487D1 (de) Geraet und verfahren zur detektion und bestaetigung oberflaechenfehler.
DE3877516D1 (de) Geraet und verfahren zur bohrlochmessung.
DE3687220D1 (de) Verfahren und vorrichtung zur detektion von musterfehlern.
DE3854546D1 (de) Verfahren und Gerät zur Programmablaufmessung.
DE3678717D1 (de) Verfahren und einrichtung zur tonerkennung.
DE3584117D1 (de) Verfahren zur ultraschallmessung und dazugehoeriges geraet.
DE3883592D1 (de) Verfahren und Vorrichtung zur Induktionsmessung.
DE69013790T2 (de) Verfahren und Vorrichtung zur Positionsbestimmung.
DE3687760T2 (de) Vorrichtung und verfahren zur koordinatenmessung.
DE69031294D1 (de) Einrichtung und Verfahren zur Fehlererkennung und Fehlerkorrektur
DE3854334D1 (de) Verfahren und Gerät zur Bestimmung von Substanzen.
DE3851587D1 (de) Verfahren und Apparatur zur Widerstandsmessung.
DE68900965D1 (de) Verfahren und geraet zur bodenradarmessung.
DE3853206D1 (de) Verfahren und gerät zur byteschreibfehlerkodierung.
DE68924563D1 (de) Verfahren und Vorrichtung zur Oberflächenanalyse.
DE3850164T2 (de) Verfahren und Gerät zur Drehwinkelerkennung.
DE3673917D1 (de) Verfahren und vorrichtung zum absoluten wegmessen.
DE3280123D1 (de) Geraet und verfahren zur mustererkennung.
DE58901197D1 (de) Verfahren zur weg- und winkelmessung.
DE3889725D1 (de) Verfahren und vorrichtung zur messfehlerkompensation.
DE3779334D1 (de) Verfahren und testsatz zur drogenbestimmung.
DE3766367D1 (de) Verfahren und vorrichtung zur radstellungsmessung.
DE3673401D1 (de) Verfahren und vorrichtung zur konzentrationsbestimmung.
DE3679142D1 (de) Verfahren und vorrichtung zur verschiebungsmessung.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Free format text: DERZEIT KEIN VERTRETER BESTELLT