DE3851475D1 - Integrierte Schaltung mit vergrabene Dioden enthaltender Schützvorrichtung sowie zugehöriges Verfahren zur Hertellung. - Google Patents

Integrierte Schaltung mit vergrabene Dioden enthaltender Schützvorrichtung sowie zugehöriges Verfahren zur Hertellung.

Info

Publication number
DE3851475D1
DE3851475D1 DE3851475T DE3851475T DE3851475D1 DE 3851475 D1 DE3851475 D1 DE 3851475D1 DE 3851475 T DE3851475 T DE 3851475T DE 3851475 T DE3851475 T DE 3851475T DE 3851475 D1 DE3851475 D1 DE 3851475D1
Authority
DE
Germany
Prior art keywords
production
integrated circuit
protective device
device containing
associated method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3851475T
Other languages
English (en)
Other versions
DE3851475T2 (de
Inventor
William Douglas Mack
Richard Henry Lane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of DE3851475D1 publication Critical patent/DE3851475D1/de
Application granted granted Critical
Publication of DE3851475T2 publication Critical patent/DE3851475T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/74—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
    • H01L21/76205—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO in a region being recessed from the surface, e.g. in a recess, groove, tub or trench region
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8222—Bipolar technology
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0255—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using diodes as protective elements
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/08—Modifications for protecting switching circuit against overcurrent or overvoltage
    • H03K17/081—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit
    • H03K17/0812—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit by measures taken in the control circuit
    • H03K17/08126—Modifications for protecting switching circuit against overcurrent or overvoltage without feedback from the output circuit to the control circuit by measures taken in the control circuit in bipolar transitor switches

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Bipolar Integrated Circuits (AREA)
DE3851475T 1987-06-23 1988-06-17 Integrierte Schaltung mit vergrabene Dioden enthaltender Schützvorrichtung sowie zugehöriges Verfahren zur Hertellung. Expired - Fee Related DE3851475T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/065,450 US4736271A (en) 1987-06-23 1987-06-23 Protection device utilizing one or more subsurface diodes and associated method of manufacture

Publications (2)

Publication Number Publication Date
DE3851475D1 true DE3851475D1 (de) 1994-10-20
DE3851475T2 DE3851475T2 (de) 1995-04-13

Family

ID=22062791

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3851475T Expired - Fee Related DE3851475T2 (de) 1987-06-23 1988-06-17 Integrierte Schaltung mit vergrabene Dioden enthaltender Schützvorrichtung sowie zugehöriges Verfahren zur Hertellung.

Country Status (5)

Country Link
US (1) US4736271A (de)
EP (1) EP0296675B1 (de)
JP (1) JPH0732233B2 (de)
KR (1) KR970004453B1 (de)
DE (1) DE3851475T2 (de)

Families Citing this family (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06104394B2 (ja) * 1986-06-11 1994-12-21 株式会社東芝 携帯可能記憶媒体
JPH0693497B2 (ja) * 1986-07-30 1994-11-16 日本電気株式会社 相補型ｍｉｓ集積回路
IT1215131B (it) * 1986-12-03 1990-01-31 Sgs Microelettronica Spa Protezione dei circuiti integrati contro scariche elettrostatiche
JPH0758734B2 (ja) * 1987-02-23 1995-06-21 株式会社東芝 絶縁ゲ−ト型セミカスタム集積回路
JPH0748652B2 (ja) * 1987-07-23 1995-05-24 三菱電機株式会社 半導体回路装置の入力保護装置
WO1989007334A1 (en) * 1988-02-02 1989-08-10 Analog Devices, Inc. Ic with means for reducing esd damage
US5182621A (en) * 1988-06-14 1993-01-26 Nec Corporation Input protection circuit for analog/digital converting semiconductor
JPH02113623A (ja) * 1988-10-21 1990-04-25 Sharp Corp 集積回路の静電気保護回路
US4990802A (en) * 1988-11-22 1991-02-05 At&T Bell Laboratories ESD protection for output buffers
US5189588A (en) * 1989-03-15 1993-02-23 Matsushita Electric Industrial Co., Ltd. Surge protection apparatus
US5200876A (en) * 1989-04-10 1993-04-06 Matsushita Electric Industrial Co., Ltd. Electrostatic breakdown protection circuit
US5019002A (en) * 1989-07-12 1991-05-28 Honeywell, Inc. Method of manufacturing flat panel backplanes including electrostatic discharge prevention and displays made thereby
US5124877A (en) * 1989-07-18 1992-06-23 Gazelle Microcircuits, Inc. Structure for providing electrostatic discharge protection
US5032742A (en) * 1989-07-28 1991-07-16 Dallas Semiconductor Corporation ESD circuit for input which exceeds power supplies in normal operation
WO1991002408A1 (en) * 1989-07-28 1991-02-21 Dallas Semiconductor Corporation Line-powered integrated circuit transceiver
JP2542706B2 (ja) * 1989-10-05 1996-10-09 株式会社東芝 ダイナミックｒａｍ
IT1237666B (it) * 1989-10-31 1993-06-15 Sgs Thomson Microelectronics Processo per la fabbricazione di un componente limitatore della tensione di programmazione e stabilizzatore di tensione incorporato inun dispositivo elettrico con celle di memoria eeprom
US5045733A (en) * 1989-11-28 1991-09-03 Thomson Consumer Electronics, Inc. Switching apparatus with cascaded switch sections
US5124578A (en) * 1990-10-01 1992-06-23 Rockwell International Corporation Receiver designed with large output drive and having unique input protection circuit
US5117129A (en) * 1990-10-16 1992-05-26 International Business Machines Corporation Cmos off chip driver for fault tolerant cold sparing
US5138413A (en) * 1990-10-22 1992-08-11 Harris Corporation Piso electrostatic discharge protection device
US5341114A (en) * 1990-11-02 1994-08-23 Ail Systems, Inc. Integrated limiter and amplifying devices
US5359211A (en) * 1991-07-18 1994-10-25 Harris Corporation High voltage protection using SCRs
JP2748747B2 (ja) * 1991-10-22 1998-05-13 株式会社デンソー 電源電圧補償装置
US5276582A (en) * 1992-08-12 1994-01-04 National Semiconductor Corporation ESD protection using npn bipolar transistor
GB2273831B (en) * 1992-12-24 1997-03-26 Motorola Semiconducteurs Voltage protection circuit
JP2589938B2 (ja) * 1993-10-04 1997-03-12 日本モトローラ株式会社 半導体集積回路装置の静電破壊保護回路
EP0606667A1 (de) * 1993-01-13 1994-07-20 Koninklijke Philips Electronics N.V. Halbleiterbauelement mit einer integrierten Schaltung mit Überspannungsschutz
DE69326543T2 (de) * 1993-04-28 2000-01-05 Cons Ric Microelettronica Monolithisch integrierte Struktur einer elektronischen Vorrichtung mit einer bestimmten unidirektionalen Konduktionsschwellenspannung
EP0657933B1 (de) * 1993-12-13 2000-06-28 Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno Integrierte aktive Klammerungsstruktur für den Schutz von Leistungshalbleiterbauelementen gegen Überspannungen
CA2115230A1 (en) * 1994-02-08 1995-08-09 Jonathan H. Orchard-Webb Esd protection circuit
FR2717308B1 (fr) * 1994-03-14 1996-07-26 Sgs Thomson Microelectronics Dispositif de protection contre des surtensions dans des circuits intégrés.
US5530612A (en) * 1994-03-28 1996-06-25 Intel Corporation Electrostatic discharge protection circuits using biased and terminated PNP transistor chains
US5597758A (en) * 1994-08-01 1997-01-28 Motorola, Inc. Method for forming an electrostatic discharge protection device
JPH08139528A (ja) * 1994-09-14 1996-05-31 Oki Electric Ind Co Ltd トランジスタ保護回路
EP0740344B1 (de) * 1995-04-24 2002-07-24 Conexant Systems, Inc. Verfahren und Apparat zum Koppeln verschiedener, unabhängiger on-Chip-Vdd-Busse an eine ESD-Klemme
US5656967A (en) * 1995-08-07 1997-08-12 Micron Technology, Inc. Two-stage fusible electrostatic discharge protection circuit
US5706163A (en) * 1995-11-28 1998-01-06 California Micro Devices Corporation ESD-protected thin film capacitor structures
US5708289A (en) * 1996-02-29 1998-01-13 Sgs-Thomson Microelectronics, Inc. Pad protection diode structure
US5719737A (en) * 1996-03-21 1998-02-17 Intel Corporation Voltage-tolerant electrostatic discharge protection device for integrated circuit power supplies
US6064093A (en) * 1996-03-29 2000-05-16 Citizen Watch Co., Ltd. Protection circuit with clamping feature for semiconductor device
US5875089A (en) * 1996-04-22 1999-02-23 Mitsubishi Denki Kabushiki Kaisha Input protection circuit device
US6147564A (en) * 1996-12-04 2000-11-14 Seiko Epson Corporation Oscillation circuit having electrostatic protective circuit
JP3536561B2 (ja) * 1996-12-04 2004-06-14 セイコーエプソン株式会社 発振回路、電子回路、これらを備えた半導体装置、時計および電子機器
US6025746A (en) * 1996-12-23 2000-02-15 Stmicroelectronics, Inc. ESD protection circuits
US6014052A (en) * 1997-09-29 2000-01-11 Lsi Logic Corporation Implementation of serial fusible links
GB2334633B (en) * 1998-02-21 2002-09-25 Mitel Corp Low leakage electrostatic discharge protection system
ITMI991387A1 (it) * 1999-06-22 2000-12-22 St Microelectronics Srl Struttura circuitale e relativo metodo di inhibit compatibile a massaper circuiti integrati su un substrato svincolato dal potenziale di ma
US6777996B2 (en) * 2000-02-09 2004-08-17 Raytheon Company Radio frequency clamping circuit
DE10241086B4 (de) * 2001-09-06 2016-02-18 Fuji Electric Co., Ltd Zusammengesetztes integriertes Halbleiterbauteil
US7948725B2 (en) * 2001-09-06 2011-05-24 Fuji Electric Systems Co., Ltd. Composite integrated semiconductor device
US7384854B2 (en) * 2002-03-08 2008-06-10 International Business Machines Corporation Method of forming low capacitance ESD robust diodes
US6683334B2 (en) * 2002-03-12 2004-01-27 Microsemi Corporation Compound semiconductor protection device for low voltage and high speed data lines
JP2004050637A (ja) * 2002-07-19 2004-02-19 Canon Inc インクジェットヘッド用基板、インクジェットヘッド及び該インクジェットヘッドを備えたインクジェット記録装置
US7705349B2 (en) * 2002-08-29 2010-04-27 Micron Technology, Inc. Test inserts and interconnects with electrostatic discharge structures
US7250668B2 (en) * 2005-01-20 2007-07-31 Diodes, Inc. Integrated circuit including power diode
DE102005019305B4 (de) 2005-04-26 2010-04-22 Infineon Technologies Ag ESD-Schutzstruktur mit Diodenreihenschaltung und Halbleiterschaltung mit derselben
US7700977B2 (en) * 2007-06-21 2010-04-20 Intersil Americas Inc. Integrated circuit with a subsurface diode
US8164154B1 (en) 2010-12-17 2012-04-24 Aram Tanielian Low profile Schottky barrier diode for solar cells and solar panels and method of fabrication thereof
US9012997B2 (en) 2012-10-26 2015-04-21 International Business Machines Corporation Semiconductor device including ESD protection device
JP2017216325A (ja) * 2016-05-31 2017-12-07 ルネサスエレクトロニクス株式会社 半導体装置
CN106449634B (zh) * 2016-09-23 2019-06-14 矽力杰半导体技术(杭州)有限公司 瞬态电压抑制器及其制造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3673428A (en) * 1970-09-18 1972-06-27 Rca Corp Input transient protection for complementary insulated gate field effect transistor integrated circuit device
US3967295A (en) * 1975-04-03 1976-06-29 Rca Corporation Input transient protection for integrated circuit element
US4136349A (en) * 1977-05-27 1979-01-23 Analog Devices, Inc. Ic chip with buried zener diode
US4602267A (en) * 1981-02-17 1986-07-22 Fujitsu Limited Protection element for semiconductor device
JPS6066049U (ja) * 1983-10-12 1985-05-10 日本電気株式会社 Ｃ−ｍｏｓ型電界効果トランジスタ
US4605980A (en) * 1984-03-02 1986-08-12 Zilog, Inc. Integrated circuit high voltage protection
JPS61242060A (ja) * 1985-04-19 1986-10-28 Matsushita Electronics Corp 半導体集積回路
US4651178A (en) * 1985-05-31 1987-03-17 Rca Corporation Dual inverse zener diode with buried junctions

Also Published As

Publication number Publication date
EP0296675A2 (de) 1988-12-28
EP0296675A3 (en) 1989-12-06
KR970004453B1 (ko) 1997-03-27
JPH0732233B2 (ja) 1995-04-10
JPS6433957A (en) 1989-02-03
DE3851475T2 (de) 1995-04-13
US4736271A (en) 1988-04-05
EP0296675B1 (de) 1994-09-14
KR890001188A (ko) 1989-03-18

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: PHILIPS ELECTRONICS N.V., EINDHOVEN, NL

8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V., EINDHOVEN, N

8339 Ceased/non-payment of the annual fee