DE3788014D1 - Anordnung mit erwärmter Spannvorrichtung für Wafer mit integrierten Schaltungen. - Google Patents

Anordnung mit erwärmter Spannvorrichtung für Wafer mit integrierten Schaltungen.

Info

Publication number
DE3788014D1
DE3788014D1 DE87305952T DE3788014T DE3788014D1 DE 3788014 D1 DE3788014 D1 DE 3788014D1 DE 87305952 T DE87305952 T DE 87305952T DE 3788014 T DE3788014 T DE 3788014T DE 3788014 D1 DE3788014 D1 DE 3788014D1
Authority
DE
Germany
Prior art keywords
wafers
arrangement
clamping device
integrated circuits
heated clamping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE87305952T
Other languages
English (en)
Inventor
Barclay J Tullis
Richard G Baer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Application granted granted Critical
Publication of DE3788014D1 publication Critical patent/DE3788014D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
    • B23Q1/25—Movable or adjustable work or tool supports
    • B23Q1/26—Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members
    • B23Q1/34—Relative movement obtained by use of deformable elements, e.g. piezoelectric, magnetostrictive, elastic or thermally-dilatable elements
    • B23Q1/36—Springs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/12—Arrangements for cooling or lubricating parts of the machine
    • B23Q11/126—Arrangements for cooling or lubricating parts of the machine for cooling only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/14—Methods or arrangements for maintaining a constant temperature in parts of machine tools
    • B23Q11/143—Methods or arrangements for maintaining a constant temperature in parts of machine tools comprising heating means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE87305952T 1986-07-24 1987-07-06 Anordnung mit erwärmter Spannvorrichtung für Wafer mit integrierten Schaltungen. Expired - Lifetime DE3788014D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/889,548 US4872835A (en) 1986-07-24 1986-07-24 Hot chuck assembly for integrated circuit wafers

Publications (1)

Publication Number Publication Date
DE3788014D1 true DE3788014D1 (de) 1993-12-09

Family

ID=25395335

Family Applications (1)

Application Number Title Priority Date Filing Date
DE87305952T Expired - Lifetime DE3788014D1 (de) 1986-07-24 1987-07-06 Anordnung mit erwärmter Spannvorrichtung für Wafer mit integrierten Schaltungen.

Country Status (5)

Country Link
US (1) US4872835A (de)
EP (1) EP0255247B1 (de)
JP (1) JPS6332949A (de)
KR (1) KR950014681B1 (de)
DE (1) DE3788014D1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2923804B2 (ja) * 1990-11-16 1999-07-26 株式会社新川 試料吸着保持装置
EP0493089B1 (de) * 1990-12-25 1998-09-16 Ngk Insulators, Ltd. Heizungsapparat für eine Halbleiterscheibe und Verfahren zum Herstellen desselben
US6104203A (en) * 1995-05-16 2000-08-15 Trio-Tech International Test apparatus for electronic components
US6415858B1 (en) 1997-12-31 2002-07-09 Temptronic Corporation Temperature control system for a workpiece chuck
US6866094B2 (en) 1997-12-31 2005-03-15 Temptronic Corporation Temperature-controlled chuck with recovery of circulating temperature control fluid
US6583638B2 (en) 1999-01-26 2003-06-24 Trio-Tech International Temperature-controlled semiconductor wafer chuck system
US6221437B1 (en) 1999-04-12 2001-04-24 Reynolds Tech Fabricators, Inc. Heated workpiece holder for wet plating bath
US6771372B1 (en) * 2001-11-01 2004-08-03 Therma-Wave, Inc. Rotational stage with vertical axis adjustment
KR20030065217A (ko) * 2002-01-31 2003-08-06 삼성전자주식회사 웨이퍼 척 및 이를 포함하는 웨이퍼 가공 장치
DE10216786C5 (de) * 2002-04-15 2009-10-15 Ers Electronic Gmbh Verfahren und Vorrichtung zur Konditionierung von Halbleiterwafern und/oder Hybriden
KR100607094B1 (ko) * 2005-05-02 2006-08-01 김재문 열변형 방지 결합구조를 갖는 웨이퍼 프로버 스테이션용핫척
KR100811389B1 (ko) * 2006-03-24 2008-03-07 가부시키가이샤 뉴플레어 테크놀로지 반도체 제조 장치와 히터
CN109877724B (zh) * 2019-02-27 2022-02-25 武汉新芯集成电路制造有限公司 一种晶圆取出装置
CN112002658A (zh) * 2020-08-25 2020-11-27 北京北方华创微电子装备有限公司 加热器和加热基座

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3064363A (en) * 1959-03-30 1962-11-20 Ikeuchi Kazuyuki Device for drying veneers and plates
US3889389A (en) * 1974-05-13 1975-06-17 Alfred Serup Parachute drying apparatus
US3979671A (en) * 1975-03-06 1976-09-07 International Business Machines Corporation Test fixture for use in a high speed electronic semiconductor chip test system
US4020563A (en) * 1975-04-21 1977-05-03 Hoefer Scientific Instruments Slab gel dryer and method
JPS547276A (en) * 1977-06-20 1979-01-19 Nippon Telegr & Teleph Corp <Ntt> Fine adjustment unit for stage
JPS5443480A (en) * 1977-09-12 1979-04-06 Hitachi Ltd Mask aligner
US4157818A (en) * 1977-12-01 1979-06-12 Motorola, Inc. X-Y Movable work holder
US4518848A (en) * 1981-05-15 1985-05-21 Gca Corporation Apparatus for baking resist on semiconductor wafers
US4415788A (en) * 1981-06-08 1983-11-15 Jenn-Air Corporation Induction cartridge
JPS59117128A (ja) * 1982-12-24 1984-07-06 Hitachi Ltd 温度制御装置を備えたウエハ搭載台
US4556785A (en) * 1983-05-23 1985-12-03 Gca Corporation Apparatus for vapor sheathed baking of semiconductor wafers
US4549052A (en) * 1984-01-12 1985-10-22 The Maytag Company Cooling system for an induction cooking cartridge

Also Published As

Publication number Publication date
KR950014681B1 (ko) 1995-12-13
EP0255247B1 (de) 1993-11-03
KR880002241A (ko) 1988-04-29
EP0255247A2 (de) 1988-02-03
US4872835A (en) 1989-10-10
JPS6332949A (ja) 1988-02-12
EP0255247A3 (en) 1989-12-13

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Legal Events

Date Code Title Description
8332 No legal effect for de