KR880002241A - 집적회로 웨이퍼용 고온 척 어셈블리 - Google Patents

집적회로 웨이퍼용 고온 척 어셈블리 Download PDF

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Publication number
KR880002241A
KR880002241A KR1019870008015A KR870008015A KR880002241A KR 880002241 A KR880002241 A KR 880002241A KR 1019870008015 A KR1019870008015 A KR 1019870008015A KR 870008015 A KR870008015 A KR 870008015A KR 880002241 A KR880002241 A KR 880002241A
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KR
South Korea
Prior art keywords
chuck assembly
platen
mounting
mounting post
base
Prior art date
Application number
KR1019870008015A
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English (en)
Other versions
KR950014681B1 (ko
Inventor
제이·털리스 바클레이
지·베이에르 리타드
Original Assignee
앤 오. 바스킨스
휴렛트-팩카드 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 앤 오. 바스킨스, 휴렛트-팩카드 캄파니 filed Critical 앤 오. 바스킨스
Publication of KR880002241A publication Critical patent/KR880002241A/ko
Application granted granted Critical
Publication of KR950014681B1 publication Critical patent/KR950014681B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
    • B23Q1/25—Movable or adjustable work or tool supports
    • B23Q1/26—Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members
    • B23Q1/34—Relative movement obtained by use of deformable elements, e.g. piezoelectric, magnetostrictive, elastic or thermally-dilatable elements
    • B23Q1/36—Springs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/12—Arrangements for cooling or lubricating parts of the machine
    • B23Q11/126—Arrangements for cooling or lubricating parts of the machine for cooling only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/14—Methods or arrangements for maintaining a constant temperature in parts of machine tools
    • B23Q11/143—Methods or arrangements for maintaining a constant temperature in parts of machine tools comprising heating means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

내용 없음

Description

집적회로 웨이퍼용 고온 척 어셈블리
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 고온 척 어셈블리의 평면도
제2도는 제1도의 선 2-2를 따라 절취하여 도시한 단면도
제3도는 제1도 및 제2도에 도시한 장착 포스트의 사시도

Claims (11)

  1. 기보(12), 거의 수평인 평평한 웨이퍼 지지 표면(32)를 갖고 있는 압판(30), 및 압판(30)을 가열하기 위한 가열기(44)를 포함하는 고온 척 어셈블리(10)에 있어서, 웨이퍼 지지 표면(32)가 거의 일정한 수평면내에 유지되도록 지지부(16)이 압판(14)를 기부(12) 상에 배치시키는 것을 특징으로하는 고온 척 어셈블리(10).
  2. 제1항에 있어서, 지지부(16)이 압판(30)을 기부(12)상에 지지하기 위해 기부(12)에 결합된 다수의 장착 어셈블리들을 포함하는 것을 특징으로하는 고온 척 어셈블리(10).
  3. 제2항에 있어서, 각각의 장착 어셈블리가 기부(12)에 부착된 장착 포스트(60) 및 장착 포스트(60)과 압판(14) 사이로 연장되는 거의 수평인 장착 핀(61)을 포함하는 것을 특징으로하는 고온 척 어셈블리(10).
  4. 제3항에 있어서, 장착 핀(61)이 웨이퍼 지지 표면(32)에 근접하고 거의 평행한 압판(30)에 결합되는 것을 특징으로 하는 고온 척 어셈블리(10).
  5. 제4항에 있어서, 장착 포스트(60)이 웨이퍼 지지 표면(32)에 관련하여 방사상 만곡될 수 있는 것을 특징으로하는 고온 척 어셈블리(10).
  6. 제5항에 있어서, 장착 포스트(60)이 기부(12)에 부착된 기부(62)를 헤드부(70)에 결합시키는 가용성 장치를 포함하는 것을 특징으로하는 고온 척 어셈블리(10).
  7. 제6항에 있어서, 가요성 장치가 방사상 만곡 방향으로 정렬되는 다수의 가요성 다리부(64,66)을 포함하는 것을 특징으로하는 고온 척 어셈블리(10).
  8. 제6항 및 제7항 중 어느 한 항에 있어서, 장착 포스트(60)의 헤드부(70)을 냉각시키기 위한 냉각 시스템을 포함하는 것을 특징으로하는 고온 척 어셈블리(10).
  9. 제8항에 있어서, 냉각 시스템이 장착 포스트(60)의 헤드부(70)을 접촉시키는 도판(78) 및 도판(78)을 통해 순환된 유체 냉각제를 포함하는 것을 특징으로하는 고온 척 어셈블리(10).
  10. 제4항 내지 제9항 중 어느 한 항에 있어서, 장착 핀(61)이 압판(30)의 열전도율 및 장착 포스트(60)의 열전도율보다 낮은 열 전도율을 갖고 있는 것을 특징으로 하는 고온 척 어셈블리(10).
  11. 제10항에 있어서, 장착 핀(61)이 나사부(82)를 포함하고, 압판(30)이 나사부(82)와 결합될 수 있는 나사 무멍(84)를 갖추고 있는 것을 특징으로하는 고온 척 어셈블리(10).
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870008015A 1986-07-24 1987-07-23 집적 회로 웨이퍼용 고온 척 어셈블리 KR950014681B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US889548 1986-07-24
US889,548 1986-07-24
US06/889,548 US4872835A (en) 1986-07-24 1986-07-24 Hot chuck assembly for integrated circuit wafers

Publications (2)

Publication Number Publication Date
KR880002241A true KR880002241A (ko) 1988-04-29
KR950014681B1 KR950014681B1 (ko) 1995-12-13

Family

ID=25395335

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870008015A KR950014681B1 (ko) 1986-07-24 1987-07-23 집적 회로 웨이퍼용 고온 척 어셈블리

Country Status (5)

Country Link
US (1) US4872835A (ko)
EP (1) EP0255247B1 (ko)
JP (1) JPS6332949A (ko)
KR (1) KR950014681B1 (ko)
DE (1) DE3788014D1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100607094B1 (ko) * 2005-05-02 2006-08-01 김재문 열변형 방지 결합구조를 갖는 웨이퍼 프로버 스테이션용핫척

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2923804B2 (ja) * 1990-11-16 1999-07-26 株式会社新川 試料吸着保持装置
DE69130205T2 (de) * 1990-12-25 1999-03-25 Ngk Insulators, Ltd., Nagoya, Aichi Heizungsapparat für eine Halbleiterscheibe und Verfahren zum Herstellen desselben
EP0743530A3 (en) * 1995-05-16 1997-04-09 Trio Tech International Test device for electronic components
US6866094B2 (en) 1997-12-31 2005-03-15 Temptronic Corporation Temperature-controlled chuck with recovery of circulating temperature control fluid
US6415858B1 (en) * 1997-12-31 2002-07-09 Temptronic Corporation Temperature control system for a workpiece chuck
US6583638B2 (en) 1999-01-26 2003-06-24 Trio-Tech International Temperature-controlled semiconductor wafer chuck system
US6221437B1 (en) 1999-04-12 2001-04-24 Reynolds Tech Fabricators, Inc. Heated workpiece holder for wet plating bath
US6771372B1 (en) * 2001-11-01 2004-08-03 Therma-Wave, Inc. Rotational stage with vertical axis adjustment
KR20030065217A (ko) * 2002-01-31 2003-08-06 삼성전자주식회사 웨이퍼 척 및 이를 포함하는 웨이퍼 가공 장치
DE10216786C5 (de) * 2002-04-15 2009-10-15 Ers Electronic Gmbh Verfahren und Vorrichtung zur Konditionierung von Halbleiterwafern und/oder Hybriden
KR100811389B1 (ko) * 2006-03-24 2008-03-07 가부시키가이샤 뉴플레어 테크놀로지 반도체 제조 장치와 히터
CN109877724B (zh) * 2019-02-27 2022-02-25 武汉新芯集成电路制造有限公司 一种晶圆取出装置
CN112002658B (zh) * 2020-08-25 2024-06-21 北京北方华创微电子装备有限公司 加热器和加热基座

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US4020563A (en) * 1975-04-21 1977-05-03 Hoefer Scientific Instruments Slab gel dryer and method
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100607094B1 (ko) * 2005-05-02 2006-08-01 김재문 열변형 방지 결합구조를 갖는 웨이퍼 프로버 스테이션용핫척

Also Published As

Publication number Publication date
EP0255247A3 (en) 1989-12-13
DE3788014D1 (de) 1993-12-09
JPS6332949A (ja) 1988-02-12
US4872835A (en) 1989-10-10
EP0255247A2 (en) 1988-02-03
KR950014681B1 (ko) 1995-12-13
EP0255247B1 (en) 1993-11-03

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