DE3768060D1 - Traegeranordnung fuer halbleiterbauelemente. - Google Patents

Traegeranordnung fuer halbleiterbauelemente.

Info

Publication number
DE3768060D1
DE3768060D1 DE8787901224T DE3768060T DE3768060D1 DE 3768060 D1 DE3768060 D1 DE 3768060D1 DE 8787901224 T DE8787901224 T DE 8787901224T DE 3768060 T DE3768060 T DE 3768060T DE 3768060 D1 DE3768060 D1 DE 3768060D1
Authority
DE
Germany
Prior art keywords
flat surface
relatively flat
leg portions
solid state
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8787901224T
Other languages
English (en)
Inventor
Milford Faa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NCR International Inc
Original Assignee
NCR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NCR Corp filed Critical NCR Corp
Application granted granted Critical
Publication of DE3768060D1 publication Critical patent/DE3768060D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Die Bonding (AREA)
  • Aerials With Secondary Devices (AREA)
  • Ceramic Capacitors (AREA)
  • Inorganic Insulating Materials (AREA)
  • Fats And Perfumes (AREA)
DE8787901224T 1986-02-18 1987-01-27 Traegeranordnung fuer halbleiterbauelemente. Expired - Lifetime DE3768060D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/830,026 US4669028A (en) 1986-02-18 1986-02-18 Heat sink for solid state devices connected to a circuit board
PCT/US1987/000159 WO1987005183A1 (en) 1986-02-18 1987-01-27 Mounting arrangement for solid state devices

Publications (1)

Publication Number Publication Date
DE3768060D1 true DE3768060D1 (de) 1991-03-28

Family

ID=25256139

Family Applications (2)

Application Number Title Priority Date Filing Date
DE198787901224T Pending DE258312T1 (de) 1986-02-18 1987-01-27 Traegeranordnung fuer halbleiterbauelemente.
DE8787901224T Expired - Lifetime DE3768060D1 (de) 1986-02-18 1987-01-27 Traegeranordnung fuer halbleiterbauelemente.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE198787901224T Pending DE258312T1 (de) 1986-02-18 1987-01-27 Traegeranordnung fuer halbleiterbauelemente.

Country Status (10)

Country Link
US (1) US4669028A (de)
EP (1) EP0258312B1 (de)
JP (1) JPS63502547A (de)
AT (1) ATE60976T1 (de)
AU (1) AU593615B2 (de)
CA (1) CA1246750A (de)
DE (2) DE258312T1 (de)
DK (1) DK542187A (de)
WO (1) WO1987005183A1 (de)
ZA (1) ZA87595B (de)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4729426A (en) * 1986-03-06 1988-03-08 Thermalloy Incorporated Bonded clip heat sink
US4751963A (en) * 1986-07-03 1988-06-21 Hughes Aircraft Company Thermal conductance retainer for electronic printed circuit boards and the like
US4738024A (en) * 1987-08-24 1988-04-19 Hytek Microsystems Incorporated Method of making a heat dissipating assembly
US4923179A (en) * 1987-11-02 1990-05-08 Chrysler Corporation Spring panel heat sink for electrical components
US4845590A (en) * 1987-11-02 1989-07-04 Chrysler Motors Corporation Heat sink for electrical components
US4891735A (en) * 1987-11-02 1990-01-02 Chrysler Motors Corporation Heat sink for electrical components
US4922601A (en) * 1987-11-02 1990-05-08 Chrysler Corporation Method of making a heat sink for electrical components
US4888637A (en) * 1988-01-15 1989-12-19 Chrysler Motors Corporation Multiple semiconductor heat sink/mounting assembly
US4922379A (en) * 1989-07-18 1990-05-01 Hughes Aircraft Company Power semiconductor package
JP2539612Y2 (ja) * 1989-10-13 1997-06-25 日立金属 株式会社 電気部品の取付構造
DE4002060A1 (de) * 1990-01-25 1991-08-01 Bosch Gmbh Robert Halterung fuer zu kuehlende elektronische bauelemente
US5038858A (en) * 1990-03-13 1991-08-13 Thermalloy Incorporated Finned heat sink and method of manufacture
DE4012180C1 (de) * 1990-04-14 1991-08-01 Robert Bosch Gmbh, 7000 Stuttgart, De
FR2663809B1 (fr) * 1990-06-21 1996-07-19 Siemens Automotive Sa Organe multiple de retenue a ressort et son procede de fabrication.
JPH0521487U (ja) * 1991-05-20 1993-03-19 株式会社電子技研 発熱電子部品の取付構造
GB2259408A (en) * 1991-09-07 1993-03-10 Motorola Israel Ltd A heat dissipation device
JPH0629459A (ja) * 1992-07-08 1994-02-04 Mitsubishi Electric Corp 半導体装置およびその製造方法
US5461540A (en) * 1994-03-15 1995-10-24 Infinity Group Corporation Heat dissipation device for personal computers
US5504653A (en) * 1994-11-21 1996-04-02 Delco Electronics Corp. Heat sinking assembly for electrical components
US5815371A (en) * 1996-09-26 1998-09-29 Dell U.S.A., L.P. Multi-function heat dissipator
US5908235A (en) * 1997-04-28 1999-06-01 Jrs Technology Inc. Ballast fixture for fluorescent lighting
US6081424A (en) * 1998-05-19 2000-06-27 Chrysler Corporation Mechanism for removing heat from electronic components
US6038156A (en) * 1998-06-09 2000-03-14 Heart Interface Corporation Power inverter with improved heat sink configuration
KR20040069319A (ko) * 2001-12-04 2004-08-05 가부시키 가이샤 도쿄 알 앤드 디 급전장치
US8010991B2 (en) * 2007-01-29 2011-08-30 Cisco Technology, Inc. Policy resolution in an entitlement management system
JP4824624B2 (ja) * 2007-05-15 2011-11-30 株式会社リコー 熱移動部材、熱移動機構及び情報処理装置
DE202007008471U1 (de) * 2007-06-13 2007-09-27 Leichtmetallbau Schletter Gmbh Vorrichtung zum Verbinden einer Profilschiene mit einem anderen Bauteil
JP5766451B2 (ja) 2011-01-28 2015-08-19 矢崎総業株式会社 端子及び端子の接続構造
US20140254800A1 (en) * 2011-09-08 2014-09-11 AvaLAN Wireless Systems, Inc. High-Security Outdoor Wireless Communications Bridge
CN105874368B (zh) * 2013-11-12 2017-07-07 莫列斯有限公司 具有散热构造的连接器系统
US10624244B2 (en) * 2015-11-04 2020-04-14 Preh Gmbh Automotive power electronics assembly
JP6722540B2 (ja) * 2016-07-28 2020-07-15 株式会社Ｊｖｃケンウッド 放熱構造および電子機器
WO2021194716A1 (en) * 2020-03-24 2021-09-30 Arris Enterprises Llc Heat exchange ribbon

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3200296A (en) * 1962-10-26 1965-08-10 Rca Corp Combined mounting-bracket and heat-sink
US3568761A (en) * 1969-05-20 1971-03-09 Rca Corp Semiconductor mounting adapter
US3641474A (en) * 1970-05-11 1972-02-08 Rca Corp Semiconductor mounting structure
US3796254A (en) * 1972-05-25 1974-03-12 Us Army Temperature control conductive device
US4012769A (en) * 1975-08-04 1977-03-15 Thermalloy Incorporated Heat sink with parallel flat faces
US4204248A (en) * 1978-11-20 1980-05-20 General Electric Company Heat transfer mounting arrangement for a solid state device connected to a circuit board
US4288839A (en) * 1979-10-18 1981-09-08 Gould Inc. Solid state device mounting and heat dissipating assembly
US4475145A (en) * 1982-07-12 1984-10-02 Rockwell International Corporation Circuit board heatsink assembly and technique
JPS59208762A (ja) * 1983-05-09 1984-11-27 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン ソリツドステ−ト装置を放熱部材に圧接する装置
DE3331207A1 (de) * 1983-08-30 1985-03-07 Robert Bosch Gmbh, 7000 Stuttgart Baugruppe fuer elektronische steuergeraete
DE3416348A1 (de) * 1984-05-03 1985-11-07 Siemens AG, 1000 Berlin und 8000 München Kompaktbaugruppe, bei welcher eine leiterplatte mit einem kuehlkoerper verbunden ist

Also Published As

Publication number Publication date
AU6932487A (en) 1987-09-09
DK542187D0 (da) 1987-10-16
EP0258312B1 (de) 1991-02-20
ATE60976T1 (de) 1991-03-15
AU593615B2 (en) 1990-02-15
CA1246750A (en) 1988-12-13
DE258312T1 (de) 1988-09-01
DK542187A (da) 1987-10-16
JPS63502547A (ja) 1988-09-22
EP0258312A1 (de) 1988-03-09
US4669028A (en) 1987-05-26
ZA87595B (en) 1987-09-30
WO1987005183A1 (en) 1987-08-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: NCR INTERNATIONAL INC., DAYTON, OHIO, US

8328 Change in the person/name/address of the agent

Free format text: KAHLER, K., DIPL.-ING., 8948 MINDELHEIM KAECK, J., DIPL.-ING. DIPL.-WIRTSCH.-ING., 8910 LANDSBERG FIENER, J., PAT.-ANWAELTE, 8948 MINDELHEIM

8327 Change in the person/name/address of the patent owner

Owner name: AT&T GLOBAL INFORMATION SOLUTIONS INTERNATIONAL IN

8327 Change in the person/name/address of the patent owner

Owner name: NCR INTERNATIONAL, INC. (N.D.GES.D.STAATES DELAWAR

8339 Ceased/non-payment of the annual fee